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74ACT11139DRE4

Texas Instruments

74ACT11139DRE4 by Texas Instruments

74ACT11139DRE4 by Texas Instruments is a Decoder & Drivers IC with 8.5 ns Propagation Delay, suitable for industrial applications. It operates at a Nominal Voltage of 5V and has Inverted Output Polarity. This CMOS technology chip comes in a small outline package with 16 terminals and can handle load capacitance of up to 50 pF.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,037 parts In-Stock

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Digiode

USA . 1,403 parts In-Stock

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Native Components

USA . 828 parts In-Stock

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$0.453

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$0.435

828

$0.453

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$0.435

Northwest PG Solutions

USA . 1,227 parts In-Stock

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$0.498

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$0.439

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$0.498

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$0.439

AZTECH Wire

Italy . 634 parts In-Stock

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$6.191

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Parana Technologies

USA . 1,126 parts In-Stock

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$10.584

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$982.874

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$9.525

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$9.525

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DigiPath Technology Company

USA . 620 parts In-Stock

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$11.654

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620

$11.654

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ChromeModa Solutions

Germany . 5,820 parts In-Stock

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$11.892

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$9.751

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IDEA Electronic Components Group

UK . 962 parts In-Stock

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$11.892

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$11.297

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$10.703

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962

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One Stop Electronics

USA . 1,176 parts In-Stock

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$65.000

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Corphita

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Microchip USA

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Overview

Elevate your electronic design with the 74ACT11139DRE4 by Texas Instruments, a top-tier manufacturer known for quality and innovation. This versatile Decoder & Drivers component is perfect for a wide range of applications, offering fast propagation delays and standard input conditioning. With its small outline package style and inverted output polarity, this product is a game-changer for your projects. Experience the superior performance and reliability that Texas Instruments is renowned for, and take your designs to the next level with the 74ACT11139DRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for internal components and ensures durability of the product.

Propagation Delay At Nominal Supply: 8.5 ns

Fast propagation delay allows for quick signal processing and response times.

Surface Mount: YES

Enables easy installation on PCBs, saving space and simplifying assembly process.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals.

No. of Functions: 2

Provides versatility by offering multiple functions in a single device.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used voltage level, making it convenient for integration into existing systems.

Load Capacitance (CL): 50 pF

Suitable for driving moderate load capacitances, ensuring stable and reliable performance.

Power Supplies (V): 5

Consistent power supply voltage for reliable operation.

No. of Terminals: 16

Sufficient terminals for connecting to other components and peripherals.

Package Style (Meter): SMALL OUTLINE

Compact package size for space-efficient PCB layout.

Maximum I (ol): 24 Amp

Capable of driving high current loads, suitable for a variety of applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operates reliably in low temperature conditions as well.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and connection options.

Maximum Seated Height: 1.75 mm

Low profile design for compact and slim applications.

Width: 3.9 mm

Narrow width for space-saving installation.

Output Polarity: INVERTED

Inverted output polarity for compatibility with specific systems or applications.

Minimum Supply Voltage (Vsup): 4.5 V

Works reliably even at lower supply voltages.

Length: 9.9 mm

Compact length for efficient use of board space.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for easy surface mounting and soldering.

Packing Method: TR

Suitable packing method for transporting and storing the product securely.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for operation at higher supply voltages when needed.

Technical Specifications

Decoder & Drivers 74ACT11139DRE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

CENTER VCC/GND PINS

Family:

ACT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

74ACT11139DRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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