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5962-01-299-3045

Texas Instruments

5962-01-299-3045 by Texas Instruments

Texas Instruments' 5962-01-299-3045 is an OTP ROM with 32x8 organization, 40ns max access time, and operates at 0 to 70°C. It has a ceramic rectangular package with 16 terminals in-line style. Ideal for commercial applications requiring reliable memory storage and fast data retrieval.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,834 parts In-Stock

1+ parts

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Digiode

USA . 1,832 parts In-Stock

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1,832

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Inland Empire Components Inc.

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Native Components

USA . 663 parts In-Stock

1+ parts

$2.150

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663

$2.150

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Northwest PG Solutions

USA . 1,007 parts In-Stock

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$2.365

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1,007

$2.365

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Parana Technologies

USA . 618 parts In-Stock

1+ parts

$4.514

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$4.960

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618

$4.514

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$4.960

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DigiPath Technology Company

USA . 662 parts In-Stock

1+ parts

$4.971

100+ parts

$4.573

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662

$4.971

$4.573

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IDEA Electronic Components Group

UK . 1,622 parts In-Stock

1+ parts

$5.072

100+ parts

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$4.565

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1,622

$5.072

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$4.565

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ChromeModa Solutions

Germany . 196 parts In-Stock

1+ parts

$5.072

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$4.159

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196

$5.072

$4.159

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AZTECH Wire

Italy . 340 parts In-Stock

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$7.490

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340

$7.490

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One Stop Electronics

USA . 602 parts In-Stock

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$27.000

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$27.000

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Corphita

USA . 1,137 parts In-Stock

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Overview

Upgrade your electronics with the 5962-01-299-3045 by Texas Instruments, a top-quality OTP ROM that delivers reliable performance and durability. Designed by a trusted manufacturer in the industry, this product offers countless applications and benefits for customers seeking high-value components. With its advanced technology and commercial-grade temperature tolerance, this ROM is perfect for a wide range of projects. Trust Texas Instruments for superior quality and performance every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body provides superior durability and heat resistance, making it ideal for various industrial applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with a wide range of devices and systems.

No. of Terminals: 16

Having 16 terminals allows for efficient and organized connection to external circuits or devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this OTP ROM can reliably function in various environmental conditions.

Organization: 32X8

The 32x8 organization offers a good balance of storage capacity and access speed for optimal performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the circuit board, enhancing the overall durability of the product.

Memory Width: 8

With a memory width of 8 bits, this OTP ROM can handle data processing tasks efficiently and effectively.

Maximum Access Time: 40 ns

The fast maximum access time of 40 nanoseconds ensures quick retrieval of data, improving overall system performance.

Technical Specifications

OTP ROM 5962-01-299-3045 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

40 ns

JESD-30 Code:

R-XDIP-T16

Memory IC Type:

Memory Width:

8

No. of Terminals:

16

No. of Words:

32 words

No. of Words Code:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32X8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Maximum Supply Current:

110 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-01-299-3045 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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