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5962-00-147-4464

Texas Instruments

5962-00-147-4464 by Texas Instruments

Texas Instruments 5962-00-147-4464 is a TTL latch with 2 functions, Vsup of 5V, and operates b/w 0 to 70°C. It features MASTER-SLAVE trigger type, IN-LINE package style, and CERAMIC body material. Ideal for commercial applications requiring reliable dual-terminal flip-flops.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,703 parts In-Stock

1+ parts

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3,703

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Vyrian

USA . 2,192 parts In-Stock

1+ parts

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2,192

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Manoshevitz Elec. Sales

Israel . 182 parts In-Stock

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182

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 860 parts In-Stock

1+ parts

$0.158

100+ parts

-

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$0.152

860

$0.158

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-

$0.152

Northwest PG Solutions

USA . 774 parts In-Stock

1+ parts

$0.174

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-

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$0.153

774

$0.174

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$0.153

AZTECH Wire

Italy . 548 parts In-Stock

1+ parts

$8.086

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548

$8.086

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Parana Technologies

USA . 1,720 parts In-Stock

1+ parts

$16.587

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$16.857

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1,720

$16.587

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$16.857

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DigiPath Technology Company

USA . 927 parts In-Stock

1+ parts

$18.264

100+ parts

$16.803

1k+ parts

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927

$18.264

$16.803

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ChromeModa Solutions

Germany . 4,985 parts In-Stock

1+ parts

$18.637

100+ parts

$15.282

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4,985

$18.637

$15.282

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IDEA Electronic Components Group

UK . 1,743 parts In-Stock

1+ parts

$18.637

100+ parts

$17.705

1k+ parts

$16.773

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1,743

$18.637

$17.705

$16.773

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One Stop Electronics

USA . 218 parts In-Stock

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$51.000

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218

$51.000

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Corphita

USA . 3,190 parts In-Stock

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3,190

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Overview

Unlock the power of seamless data transfer with the 5962-00-147-4464 by Texas Instruments. Crafted with precision and expertise, this latches & flip-flops device offers unparalleled reliability and performance. Perfect for a wide range of applications, this product delivers exceptional value and benefits to customers seeking high-quality solutions. Experience the advantages of Texas Instruments technology and elevate your projects to new heights with ease and efficiency. Trust in the best, trust in Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal stability and durability, making the latch or flip-flop suitable for high temperature environments.

No. of Functions: 2

Having 2 functions allows for more versatile and complex operations within the latch or flip-flop, making it suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with common electronic systems and power sources.

Trigger Type: MASTER-SLAVE

Master-slave trigger type ensures reliable and synchronized operation of the latch or flip-flop, preventing errors in data transmission or storage.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making the latch or flip-flop ideal for high-speed digital applications.

Technical Specifications

Latches & Flip-Flops 5962-00-147-4464 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

MASTER-SLAVE

Trade Compliance

5962-00-147-4464 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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