Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TE Connectivity's MA4L021-134 is a PIN diode with 0V reverse test voltage, 125°C max temp, and 1.5 ohm forward resistance. Ideal for applications requiring high-speed switching in RF circuits due to its low capacitance of 0.2 pF and breakdown voltage of 30V at 500 MHz and 10 mA current.
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This product can be easily mounted on a surface, making it convenient for use in various applications.
The 0 V reverse test voltage ensures that the diode can handle a reverse bias without breaking down, enhancing its reliability.
With a maximum operating temperature of 125 °C, this diode can withstand high temperatures, making it suitable for demanding environments.
The low forward resistance of 1.5 ohm ensures minimal power loss and efficient performance of the diode.
The low diode capacitance of 0.2 pF makes this product suitable for high-frequency applications where minimal capacitance is desired.
The short minority carrier lifetime of 0.01 us results in fast switching speeds, making this diode ideal for high-speed applications.
With a minimum breakdown voltage of 30 V, this diode can handle higher voltages without breaking down, ensuring its durability.
The high resistive test frequency of 500 MHz indicates that this diode can be used in high-frequency circuits and applications.
The diode can handle a test current of 10 mA, allowing for accurate testing and characterization of its performance.
Being a PIN diode, this product offers high power handling capabilities and low distortion, making it suitable for RF, microwave, and high-power applications.
PIN Diodes MA4L021-134 attributes and parameters. Explore more PIN Diodes devices from TE Connectivity
Minimum Breakdown Voltage:
Nominal Diode Capacitance:
Maximum Diode Forward Resistance:
Diode Resistive Test Current:
Diode Resistive Test Frequency:
Diode Type:
Nominal Minority Carrier Lifetime:
Maximum Operating Temperature:
Reverse Test Voltage:
Sub-Category:
Surface Mount:
MA4L021-134 Diodes trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
ROHM
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
BSS138LT1G
Onsemi
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
Transistor & Electronic
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
CRG0805F10R
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
TM4C1294NCPDTI3
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
Comchip Technology
Semiconductors
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
BAQ806
NXP Semiconductors
PIN DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
JDP2501E
Toshiba
PIN DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAR64-06W-E6327
Infineon Technologies
PIN DIODE; Surface Mount: YES; Nominal Minority Carrier Lifetime: 1.55 us; Maximum Diode Forward Resistance: 20 ohm; Reverse Test Voltage: 0 V; Nominal Diode Capacitance: .17 pF;
BXY44-T1ES
PIN DIODE; Terminal Position: UNSPECIFIED; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAP1321-02,115
5082-3081
Asi Semiconductor
PIN DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAR67-04-E6327
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 125 Cel; Nominal Minority Carrier Lifetime: .7 us; Reverse Test Voltage: 5 V; Minimum Breakdown Voltage: 150 V;
BAP64-05TRL13
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
UM6606SM
Microchip Technology
UM6606SM by Microchip Technology is a PIN diode with single configuration, operating in ultra high frequency band. It has a max diode capacitance of 0.4 pF and forward resistance of 2.5 ohm. Ideal for attenuator and switching applications due to its high power dissipation capability of 4.5 W and breakdown voltage of 600 V.
BAR89-02L
PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
HSMP-3833-BLKG
Agilent Technologies
MA4P504-1072T
M/a-com Technology Solutions
MA4P504-1072T by M/a-com Technology Solutions is a PIN Diode with 0.5 pF capacitance, 0.6 ohm forward resistance, and 10 W power dissipation. It operates in S Band frequency for switching applications at up to 175°C temperature.
BAR65-07E6433
PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 4; Surface Mount: YES; Package Shape: RECTANGULAR;
934064656125
PIN DIODE;
ISS312
PIN DIODE; Terminal Form: THROUGH-HOLE; Surface Mount: NO; Package Shape: RECTANGULAR; Qualification: Not Qualified; Minimum Breakdown Voltage: 30 V;
BXY43-P1P
PIN DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BXY44-FPS
PIN DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 4; Surface Mount: YES; Package Shape: RECTANGULAR;
BAP64-04
934056623215
BXY44-T2H
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MA4L021-120
MA4L021-134
M/a-com
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 500 MHz; Diode Resistive Test Current: 10 mA; Nominal Diode Capacitance: .2 pF; Reverse Test Voltage: 0 V;
MA4L021-30
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 1.5 ohm; Diode Resistive Test Frequency: 500 MHz; Reverse Test Voltage: 0 V; Nominal Diode Capacitance: .4 pF;
MA4L022-134
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 500 MHz; Reverse Test Voltage: 0 V; Nominal Diode Capacitance: .15 pF; Nominal Minority Carrier Lifetime: .01 us;
MA4L022-30
PIN DIODE; Surface Mount: YES; Reverse Test Voltage: 0 V; Maximum Diode Forward Resistance: 2 ohm; Nominal Diode Capacitance: .35 pF; Nominal Minority Carrier Lifetime: .01 us;
MA4L021-132
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 1.5 ohm; Diode Resistive Test Frequency: 500 MHz; Minimum Breakdown Voltage: 30 V; Reverse Test Voltage: 0 V;
MA4L022-132
PIN DIODE; Surface Mount: YES; Nominal Minority Carrier Lifetime: .01 us; Diode Resistive Test Frequency: 500 MHz; Nominal Diode Capacitance: .15 pF; Diode Resistive Test Current: 10 mA;
PIN DIODE; Surface Mount: YES; Reverse Test Voltage: 0 V; Maximum Operating Temperature: 125 Cel; Diode Resistive Test Frequency: 500 MHz; Nominal Diode Capacitance: .4 pF;
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .15 pF; Reverse Test Voltage: 0 V; Nominal Minority Carrier Lifetime: .01 us; Minimum Breakdown Voltage: 30 V;
PIN DIODE; Surface Mount: YES; Diode Resistive Test Frequency: 500 MHz; Maximum Diode Forward Resistance: 2 ohm; Maximum Operating Temperature: 125 Cel; Nominal Diode Capacitance: .35 pF;
MA4L032-134
PIN DIODE; Surface Mount: YES; Reverse Test Voltage: 0 V; Maximum Operating Temperature: 125 Cel; Nominal Minority Carrier Lifetime: .015 us; Nominal Diode Capacitance: .15 pF;
PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 30 V; Diode Resistive Test Frequency: 500 MHz; Diode Resistive Test Current: 10 mA; Reverse Test Voltage: 0 V;
PIN DIODE; Surface Mount: YES; Nominal Diode Capacitance: .15 pF; Diode Resistive Test Frequency: 500 MHz; Maximum Operating Temperature: 125 Cel; Diode Resistive Test Current: 10 mA;
PIN DIODE; Surface Mount: YES; Maximum Operating Temperature: 125 Cel; Reverse Test Voltage: 0 V; Minimum Breakdown Voltage: 30 V; Nominal Minority Carrier Lifetime: .01 us;
PIN DIODE; Surface Mount: YES; Maximum Diode Forward Resistance: 2 ohm; Reverse Test Voltage: 0 V; Nominal Minority Carrier Lifetime: .01 us; Diode Resistive Test Current: 10 mA;
PIN DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
PIN DIODE; Surface Mount: YES; Minimum Breakdown Voltage: 30 V; Reverse Test Voltage: 0 V; Maximum Diode Forward Resistance: 1.5 ohm; Maximum Operating Temperature: 125 Cel;
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