Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Wire Gauge (AWG): 0;
Median Price
$1.125
Lifecycle Status
Suppliers In-Stock
18
In-Stock Inventory
1k+
RS Americas
1+ parts
$1.110
100+ parts
$1.050
1k+ parts
$0.980
10k+ parts
$0.960
RS (Exports)
$1.920
$1.610
$1.500
-
Farnell
$283.370
Element14
$1,125.104
Verical
$0.972
$0.920
TTI Europe
$1.060
Master Electronics
$1.140
$0.665
PEI Genesis
Powell Electronics
$1.080
$0.690
Chip1Stop
$1.270
$1.150
$0.821
Mouser Electronics
$1.260
$1.180
Arrow
$0.864
$0.856
DigiKey
$1.028
Nova Conductors
$0.997
EMSNET
IBS Electronics
$1.283
$0.818
Vyrian
Rapid Electronics
$1.020
Continental Prestige Electronics
$0.964
$0.944
Argo Parts USA
Aranea Global
$0.977
$0.938
Advanced Electronics
$1.098
$1.010
$0.947
Semicontronic
$1.720
$1.677
$1.668
Assy Fe
Authorized Procurement Solutions
Heat Shrinks HX-SCE-1K-3.2-50-9 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Bharat Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Vishay Intertechnology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Bytesonic Electronics
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
Taitron Components
2N7002
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
SMBJ18CA
Hy Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Bkc Semiconductors
MBRS140T3G
Onsemi
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
Fairchild Semiconductor
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
Silicon Standard
FIT-221-3/16BK063
Alpha Wire
HEAT SHRINK TUBE; Additional Features: CSA; UL; Jacket Material: POLYOLEFIN;
ATUM-9/3-0-SP
TE Connectivity
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 110 Cel;
TMS-SCE-3/4-2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0;
RT-375-1-1/2-X-65MM
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
M83519/2-4
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
RNF-100-1/16-0-90MM
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Additional Features: APPROVAL: VDE; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
202K174-25-02-0
TE Connectivity's 202K174-25-02-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temp range, and 0.618" to 1.378" cable entry. Ideal for applications requiring protection and insulation of cables with up to 0 AWG wire size.
301A011-25/225-0
HEAT SHRINK BOOT; Material: ELASTOMER; Construction: DUAL WALL; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel;
222K132-25/225-0
TE Connectivity's 222K132-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a min cable entry of 5.9" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size, with a max cable entry of 15".
DR-25-3/8-0-150FT/CSP
HEAT SHRINK TUBE; Jacket Material: ELASTOMER; Construction: SINGLE WALL;
RNF-100-1-1/2-BK-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
222D921-25/225-0
TE Connectivity's 222D921-25/225-0 is an ELASTOMER heat shrink with a min cable entry of 2.1 inch and max operating temperature of 150°C. It is suitable for applications requiring protection and insulation for cables up to 0 AWG, with a max cable entry of 4.6 inch.
202K121-25-G38/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
RT-375-1/2-X-65MM
HEAT SHRINK MARKER SLEEVE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
M83519/2-13
S200-3-W1-22-9
TE Connectivity's S200-3-W1-22-9 heat shrink features single wall construction with crosslinked modified fluoropolymer jacket. Ideal for solder terminals, it has a max operating temp of 200°C, 4.3mm diameter, and supports up to 0 AWG wire size.
CWT-3809-W2
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 125 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 22 AWG; Wire Gauge (AWG): 22;
RW-200-1-0-SPMDBG-CS8751
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: FLUORO-ELASTOMER;
MT1000-3/32-0-SP
NB13892001
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Jacket Material: CROSSLINKED POLYOLEFIN; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Construction: DUAL WALL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HX-SCE-1K-6.4-50-S1-9
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel;
HX-SCE-1K-12.7-50-S1-4
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 105 Cel;
HX-SCE-1K-12.7-50-S1-9
HX-SCE-6.4-50-4
HEAT SHRINK MARKER SLEEVE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
HX-SCE-1K-25.4-50-4
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
HX-SCE-12.7-50-S1-4
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -55 Cel;
HX-SCE-38.1-50-4
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
HX-SCE-1K-4.8-50-4
HX-SCE-1K-4.8-50-S1-9
HX-SCE-1K-9.5-50-S1-4
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG;
HX-SCE-1K-25.4-50-S1-9
HX-SCE-1K-6.4-50-4
HX-SCE-1K-2.4-50-4
HX-SCE-1K-3.2-50-4
HX-SCE-1K-2.4-50-9
HX-SCE-1K-19.0-50-S1-4
HX-SCE-1K-3.2-50-S1-9
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel;
HX-SCE-1K-2.4-50-S1-9
HX-SCE-1K-3.2-50-S1-4
HX-SCE-1K-19.0-50-4
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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