Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel;
Median Price
$1.090
Lifecycle Status
Suppliers In-Stock
13
In-Stock Inventory
1k+
Verical
1+ parts
$1.050
100+ parts
-
1k+ parts
$1.010
10k+ parts
$0.970
TE Connectivity
$2.570
$2.320
$2.120
TTI Europe
$0.990
$0.920
Master Electronics
$0.890
$0.850
TTI
$0.780
Chip1Stop
$1.180
$1.070
Newark
$1.320
PEI Genesis
IBS Electronics
$1.842
$1.534
$1.441
Rapid Electronics
Rebound Electronics
ACDS - Activité Composants Distribution Service
Powertech Controls
Assy Fe
Heat Shrinks HX-SCE-1K-3.2-50-4 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Maximum Operating Temperature:
Minimum Operating Temperature:
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
LM317T
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
2N2222A
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
LM107H/883C
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
BAV99
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM317LMX/NOPB
Texas Instruments
LM317LMX/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max input-output voltage differential of 40V. It operates in temperatures ranging from -40°C to 125°C and has a max output current of 0.1A, making it suitable for various applications requiring precise voltage regulation.
1N4148WS
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
SN65HVD230DR
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M24308/2-1F
Itt Cannon
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
STM32H750VBT6
STMicroelectronics
STM32H750VBT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20 timers and 16 DMA channels. It features 2 DAC and 16 ADC channels, suitable for industrial applications requiring high-speed processing up to 48 MHz. With extensive connectivity options like FDCAN, Ethernet, and USB, it provides versatile solutions in a compact package.
202K163-100/180-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Minimum Cable Entry: 9.9 inch; Maximum Cable Entry: 23 inch; Maximum Operating Temperature: 105 Cel;
NB11382001
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 110 Cel;
NTFR-3/8-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 121 Cel; Minimum Operating Temperature: -70 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
Q2-Z-1/4-01-SS500FT
Qualtek Electronics
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
ATUM-16-4-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel; Jacket Material: POLYOLEFIN;
M23053/5-109-9
Grayline
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; DIN Conformity: NO; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; MIL Conformity: NO;
S03-03-R-100
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
D-142-50
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
RNF-100-1/4-GN-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE;
ATUM-12/4-0-SP
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: DUAL WALL;
FIT-221-1/8RD019
Alpha Wire
HEAT SHRINK TUBE; Additional Features: REFERENCE STANDARD: CSA; UL; Jacket Material: POLYOLEFIN;
222K174-25/225-0
TE Connectivity's 222K174-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a min cable entry of 0.618" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size with a max cable entry of 1.378".
301A034-25/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Construction: DUAL WALL;
RNF-150-3/16-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED FLUOROPOLYMER;
S01-03-RCS293
HEAT SHRINK SOLDER SLEEVE; Diameter: 4.3 mm; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG;
588742-000
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 24; Diameter: 5.95 mm; Maximum Wire Size: 24 AWG; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
ES2000-NO.3-B8-0-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 130 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0;
SCT-NO.2-E5-0-STK
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel;
M23053/16-006-0
Ls Cable & System
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; Jacket Material: ELASTOMER POLYOLEFIN; Construction: SINGLE WALL; IEC Conformity: NO; DIN Conformity: NO;
XFFR-04X4
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
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Supply Digital Components
$106.00
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12,000 In-Stock
Total price ≈ $80,197.29
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