Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity's 222D921-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min cable entry of 2.1". Ideal for -75°C to +150°C applications, accommodating up to 0 AWG wire size with a max cable entry of 4.6".
Median Price
$30.515
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Suppliers In-Stock
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1k+
Master Electronics
1+ parts
$32.500
100+ parts
$19.820
1k+ parts
$16.110
10k+ parts
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TTI
$21.850
$15.820
Mouser Electronics
$34.860
$24.600
TE Connectivity
$45.390
$29.500
$28.370
Verical
$24.765
Powell Electronics
$23.880
$23.350
PEI Genesis
Chip1Stop
$17.100
DigiKey
$28.530
Bristol Electronics
$14.554
Nova Conductors
$15.655
FDH Electronics
$29.325
$24.957
$20.224
IBS Electronics
$45.581
$27.798
$22.594
Vyrian
VNN
Rapid Electronics
ACDS - Activité Composants Distribution Service
Dan-Mar Components
Continental Prestige Electronics
$15.342
Argo Parts USA
Single wall construction provides excellent flexibility and easy installation, making it a convenient choice for various applications.
Elastomer jacket material offers durability and resistance to heat, chemicals, and abrasion, ensuring long-lasting performance in tough conditions.
With a minimum cable entry of 2.1 inches, this heat shrink can accommodate a wide range of cable sizes, providing versatility for different projects.
The high maximum operating temperature of 150°C allows this heat shrink to withstand heat exposure without compromising its effectiveness, ideal for use in demanding environments.
The low minimum operating temperature of -75°C ensures this heat shrink can be used in extreme cold conditions, providing reliable performance in various temperature extremes.
With a maximum wire size of 0 AWG, this heat shrink is suitable for larger gauge wires, offering a wide range of applications in electrical and automotive projects.
The generous maximum cable entry of 4.6 inches provides ample space for large cables, making this heat shrink ideal for covering and protecting bulky cable connections.
Using elastomer material ensures flexibility, durability, and resistance to harsh environmental factors, making this heat shrink a reliable choice for various industrial and automotive applications.
Heat Shrinks 222D921-25-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
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TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
2N2222A
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
SS14
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
08055C104KAT4A
KYOCERA AVX
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM317D2TG
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
Fairchild Semiconductor
LM317AEMP/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Semitronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2803ADWG4
Texas Instruments
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
SMBJ18CA
Eic Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
202D174-3-10/42-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
491908-003
HEAT SHRINK BOOT; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER;
ATUM-32/8-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL;
EE1123-000
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
TMS-SCE-1K-1/4-2.0-9
HEAT SHRINK MARKER SLEEVE; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
M83519/1-5
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
RNF-100-1/8-X-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
2M809A060-3G
Amphenol
HEAT SHRINK BOOT; Jacket Material: POLYMER;
222K152-25-G44/225-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel;
S02-08-R-90
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Terminal Type: SOLDER; Diameter: 4.3 mm;
ZHTM-12/6-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -30 Cel; Jacket Material: POLYOLEFIN;
DR-25-3/16-0
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; Construction: SINGLE WALL;
RNF-100-1/4-X-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN;
TMS-SCE-1/4-2.0-S1-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYOLEFIN;
TMS-SCE-1-2.0-9
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
301A022-100/180-0
HEAT SHRINK BOOT; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 105 Cel;
DR-25-1/4-0-150FT/CSP
HEAT SHRINK TUBE; Jacket Material: ELASTOMER; Construction: SINGLE WALL;
ES2000-NO.2-B9-0-50MM
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Operating Temperature: 130 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel;
M83519/2-17
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
202K132-100-01-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -30 Cel; Maximum Cable Entry: 15 inch; Minimum Cable Entry: 5.9 inch;
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222D132-3-60/42-0
TE Connectivity's 222D132-3-60/42-0 is a heat shrink with SEMI-RIGID POLYOLEFIN jacket material. It has a min cable entry of 0.26 inch and can withstand temperatures from -55 to 135 °C. Ideal for applications requiring protection and insulation of cables up to 0 AWG size.
222D132-3-60-0
TE Connectivity's 222D132-3-60-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket, with 0.26" min cable entry and 0.579" max cable entry. Operating temp ranges from -55°C to 135°C. Ideal for applications requiring protection and insulation of wires up to 0 AWG size.
222D242-3-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Material: POLYOLEFIN; Minimum Cable Entry: .382 inch;
222D232-3-0
HEAT SHRINK BOOT; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Jacket Material: SEMI-RIGID POLYOLEFIN;
222D142-25-0
HEAT SHRINK BOOT; Minimum Cable Entry: .7 inch; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Maximum Cable Entry: 1.22 inch;
222D921-25/225-0
TE Connectivity's 222D921-25/225-0 is an ELASTOMER heat shrink with a min cable entry of 2.1 inch and max operating temperature of 150°C. It is suitable for applications requiring protection and insulation for cables up to 0 AWG, with a max cable entry of 4.6 inch.
222D263-3-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
222D232-25/225-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Maximum Cable Entry: .72 inch; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel;
222D232-25-02/86-0
HEAT SHRINK BOOT; Maximum Cable Entry: 1.33 inch; Minimum Cable Entry: .74 inch; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER;
222D221-3-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Material: POLYOLEFIN;
222D232-25-0
TE Connectivity's 222D232-25-0 is an ELASTOMER heat shrink with a min cable entry of 0.331 inch and max operating temperature of 150°C. It can accommodate up to 0 AWG wire size and has a max cable entry of 0.72 inch. Ideal for various applications requiring durable insulation and protection.
222D174-25/225-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
222D232-4/86-0
HEAT SHRINK BOOT; Minimum Cable Entry: .331 inch; Maximum Cable Entry: .72 inch; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
222D921-25-G05/225-0
HEAT SHRINK BOOT; Material: ELASTOMER; Maximum Cable Entry: .76 inch; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel;
222D152-3/86-0
HEAT SHRINK BOOT; Maximum Cable Entry: .728 inch; Minimum Operating Temperature: -55 Cel; Jacket Material: SEMI-RIGID POLYOLEFIN; Material: POLYOLEFIN; Minimum Cable Entry: .331 inch;
222D921-25-00-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Maximum Cable Entry: .76 inch; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Minimum Cable Entry: .51 inch;
222D921-25/86-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 4.6 inch; Minimum Cable Entry: 2.1 inch; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
222D163-4-0
HEAT SHRINK BOOT; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Minimum Cable Entry: .39 inch; Maximum Operating Temperature: 135 Cel;
222D232-25-22-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel;
222D953-25-00-0
HEAT SHRINK BOOT; Maximum Cable Entry: 1.35 inch; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Minimum Cable Entry: 1.02 inch;
Supply Digital Components
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