Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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TE Connectivity's 222D921-25-00-0 heat shrink features ELASTOMER jacket material, 0.51" min cable entry, and -75 to 150°C operating temp range. Ideal for applications requiring protection and insulation for cables up to 0 AWG with 0.76" max cable entry.
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Elasotmer material provides flexibility and resistance to heat and chemicals, making it a durable choice for heat shrink applications.
The minimum cable entry size allows for easy installation on various cable sizes, ensuring compatibility with a range of wiring setups.
With a high maximum operating temperature, this heat shrink can withstand elevated temperatures without degrading, ensuring reliable performance in demanding environments.
The low minimum operating temperature allows this heat shrink to remain flexible and functional even in extremely cold conditions, providing versatility for different applications.
The ability to accommodate up to 0 AWG wire size makes this heat shrink suitable for a wide range of wiring projects, offering flexibility and versatility in cable management.
The large maximum cable entry size provides compatibility with thicker cables, offering a secure and snug fit for effective insulation and protection.
The elastomer material's properties of resilience and durability make this heat shrink a reliable and long-lasting solution for cable insulation and protection.
Heat Shrinks 222D921-25-00-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
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TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
BSS138LT1G
Onsemi
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
2N2222A
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
2N7002
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
SMBJ18CA
Concord Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V;
International Devices
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
4554
Jw Miller Magnetics
Other Semiconductors;
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
KSZ9031RNXIA
Microchip Technology
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
Lite-on Semiconductor
LM358M
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
202K142-100-01/180-0
TE Connectivity
HEAT SHRINK BOOT; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel; Minimum Cable Entry: 7.1 inch; Maximum Cable Entry: 17 inch;
D-1744-03
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
222K142-25/225-0
TE Connectivity's 222K142-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It supports wire sizes up to 0 AWG, with a min cable entry of 7.1" and max of 17". Ideal for applications requiring temperature resistance from -75°C to 150°C.
M23053/5-308-9
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel;
VERSAFIT-1-0-SP.
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel;
202A142-3/86-0
TE Connectivity's 202A142-3/86-0 heat shrink features dual wall construction with polyolefin jacket material. It has a min cable entry of 0.291" and can withstand temperatures from -55°C to 135°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size with a max cable entry of 1".
NB13434001
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: VDE; Construction: SINGLE WALL; Wire Gauge (AWG): 0;
CWT-7
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Diameter: 7 mm; Maximum Operating Temperature: 125 Cel;
S01-02-RCS380
HEAT SHRINK SOLDER SLEEVE; Maximum Operating Temperature: 150 Cel; Terminal Type: SOLDER; Diameter: 2.65 mm; Maximum Wire Size: 0 AWG;
S01-03-RCS681
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Diameter: 4.3 mm; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG;
202K142-4/180-0
HEAT SHRINK BOOT; Jacket Material: POLYOLEFIN;
M23053/16-005-0
Defense Logistics Agency
HEAT SHRINK TUBE; DIN Conformity: NO; Jacket Material: ELASTOMER POLYOLEFIN; Assembly Item Name: TAPER SLEEVE; MIL Conformity: NO; Construction: SINGLE WALL;
RNF-100-3/8-X-SP
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
NB13892001
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Jacket Material: CROSSLINKED POLYOLEFIN; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Construction: DUAL WALL;
B-040-20-N
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL;
RNF-100-3/16-BK-SP
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
RNF-100-1/2-BK-STK
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Additional Features: APPROVAL: VDE;
FIT-221-1/2BK016
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
RNF-3000-9/3-0-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0;
HT-SCE-1/8-2.0-S1-9
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 225 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
222D132-3-60/42-0
TE Connectivity's 222D132-3-60/42-0 is a heat shrink with SEMI-RIGID POLYOLEFIN jacket material. It has a min cable entry of 0.26 inch and can withstand temperatures from -55 to 135 °C. Ideal for applications requiring protection and insulation of cables up to 0 AWG size.
222D132-3-60-0
TE Connectivity's 222D132-3-60-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket, with 0.26" min cable entry and 0.579" max cable entry. Operating temp ranges from -55°C to 135°C. Ideal for applications requiring protection and insulation of wires up to 0 AWG size.
222D242-3-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Material: POLYOLEFIN; Minimum Cable Entry: .382 inch;
222D232-3-0
HEAT SHRINK BOOT; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Jacket Material: SEMI-RIGID POLYOLEFIN;
222D142-25-0
HEAT SHRINK BOOT; Minimum Cable Entry: .7 inch; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Maximum Cable Entry: 1.22 inch;
222D921-25/225-0
TE Connectivity's 222D921-25/225-0 is an ELASTOMER heat shrink with a min cable entry of 2.1 inch and max operating temperature of 150°C. It is suitable for applications requiring protection and insulation for cables up to 0 AWG, with a max cable entry of 4.6 inch.
222D263-3-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
222D921-25-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -75 Cel; Minimum Cable Entry: 2.1 inch; Jacket Material: ELASTOMER;
222D232-25/225-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Maximum Cable Entry: .72 inch; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel;
222D232-25-02/86-0
HEAT SHRINK BOOT; Maximum Cable Entry: 1.33 inch; Minimum Cable Entry: .74 inch; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER;
222D221-3-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Material: POLYOLEFIN;
222D232-25-0
TE Connectivity's 222D232-25-0 is an ELASTOMER heat shrink with a min cable entry of 0.331 inch and max operating temperature of 150°C. It can accommodate up to 0 AWG wire size and has a max cable entry of 0.72 inch. Ideal for various applications requiring durable insulation and protection.
222D174-25/225-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
222D232-4/86-0
HEAT SHRINK BOOT; Minimum Cable Entry: .331 inch; Maximum Cable Entry: .72 inch; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
222D921-25-G05/225-0
HEAT SHRINK BOOT; Material: ELASTOMER; Maximum Cable Entry: .76 inch; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel;
222D152-3/86-0
HEAT SHRINK BOOT; Maximum Cable Entry: .728 inch; Minimum Operating Temperature: -55 Cel; Jacket Material: SEMI-RIGID POLYOLEFIN; Material: POLYOLEFIN; Minimum Cable Entry: .331 inch;
222D921-25/86-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 4.6 inch; Minimum Cable Entry: 2.1 inch; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
222D163-4-0
HEAT SHRINK BOOT; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Minimum Cable Entry: .39 inch; Maximum Operating Temperature: 135 Cel;
222D232-25-22-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel;
222D932-25-G01-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel; Maximum Cable Entry: 1.03 inch; Material: ELASTOMER;
Supply Digital Components
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