Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 105 Cel; Wire Gauge (AWG): 0;
Median Price
$0.424
Lifecycle Status
Suppliers In-Stock
12
In-Stock Inventory
1k+
TE Connectivity
1+ parts
$1.200
100+ parts
$1.080
1k+ parts
$0.990
10k+ parts
-
Mouser Electronics
$1.230
$0.671
$0.456
DigiKey
$1.320
$0.750
$0.582
$0.495
TTI Europe
$0.241
$0.205
Heilind Electronics
$0.223
$0.210
TTI
$0.385
$0.359
Verical
$0.410
$0.403
Master Electronics
$0.437
$0.409
Nova Conductors
$0.441
TME
$0.330
$0.194
Vyrian
IBS Electronics
$0.613
$0.574
Bastille Electronics
$0.419
$0.398
$0.392
Continental Prestige Electronics
$0.432
Argo Parts USA
$0.428
Authorized Procurement Solutions
Assy Fe
Perfect Parts
Robosynatics
$10.836
Lucentia Tech
Heat Shrinks RPS-1K-18-12/2.0-9 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ESD5Z5.0T1G
Onsemi
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
SDR0604-101KL
Bourns
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803ADWRG4
Texas Instruments
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
1N4148
Multicomp Pro
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
Silicon Group
Microchip Technology
LAN8720A-CP-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 3.3V, and consumes 54mA max supply current. Ideal for network interfaces in commercial applications due to its small size (4x4mm) and low power consumption.
EU2B-YS2J03F
Idec
ROTARY SWITCH;
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
STM8S003F3P6TR
STMicroelectronics
STM8S003F3P6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 RAM bytes, 128 data EEPROM size, and 5-ch 10-bit ADC channels. Ideal for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART interfaces.
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
Philips Semiconductors
Gec Plessey Semiconductors
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
204W511-25-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER;
CWT-9003
TE Connectivity's CWT-9003 heat shrink features single wall construction with crosslinked modified polyolefin jacket. It has a temperature range of -55 to 125°C, suitable for discrete wire applications. With a wire gauge range of 12-14 AWG and 4 mm2 cross section area, it ensures secure electrical connections.
TAT-125-1/4-0-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
TMS-SCE-1K-1/2-2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
S02-02-W3-22-00-100
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
202K174-100/180-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -30 Cel; Minimum Cable Entry: .618 inch; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 1.378 inch;
B-040-22-N
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
382A012-25/225-0
TE Connectivity's 382A012-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It can withstand temperatures from -75 to 150°C and accommodate wires up to 0 AWG. Ideal for applications requiring durable insulation in extreme temperature environments.
RNF-100-2-X-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
M23053/8-003-C
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE;
RNF-100-1/2-X-MS-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL;
202D274-4-22-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
ZHTM-40/20-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -30 Cel; Wire Gauge (AWG): 0; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL;
382A023-25/225-0
TE Connectivity's 382A023-25/225-0 is a DUAL WALL heat shrink with ELASTOMER jacket, operating from -75°C to 150°C. It accommodates up to 0 AWG wire and is ideal for electrical insulation in various applications.
M23053/16-001-0
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO; IEC Conformity: NO; Construction: SINGLE WALL; Jacket Material: ELASTOMER POLYOLEFIN;
HTAT-24/6-0-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Maximum Operating Temperature: 125 Cel; Construction: DUAL WALL; Wire Gauge (AWG): 0;
S02-02-R
HEAT SHRINK SOLDER SLEEVE; Diameter: 2.65 mm; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Wire Gauge (AWG): 20; Maximum Wire Size: 20 AWG; Construction: SINGLE WALL;
322A112-25/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Construction: DUAL WALL;
DWP-125-1/2-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
EE1123-000
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
RPS-1K-16-10/2.0-4
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel;
RPS-10-2/2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel;
RPS-1K-1-400/2.0-4
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel;
RPS-1K-16-10/2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG;
RPS-1K-18-12/2.0-4
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -30 Cel; Jacket Material: CROSSLINKED POLYOLEFIN;
RPS-1K-22-18/2.0-S1-4
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel;
RPS-1K-6-250/2.0-4
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel; Jacket Material: CROSSLINKED POLYOLEFIN; Wire Gauge (AWG): 0;
RPS-1K-1-400/2.0-9
RPS-16-10/2.0-S1-9
HEAT SHRINK TUBE; Minimum Operating Temperature: -30 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 105 Cel;
RPS-1K-10-2/2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 105 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel;
RPS-18-12/2.0-S2-9
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG;
RPS-1K-18-12/2.0-S3-9
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
RPS-1K-10-2/2.0-S1-4
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 105 Cel;
RPS-1K-18-12/2.0-S1-9
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -30 Cel;
RPS-1K-18-12/2.0-S2-4
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 105 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel;
RPS-1K-18-12/2.0-S2-9
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel;
RPS-1K-16-10/2.0-S3-4
RPS-1K-16-10/2.0-S2-9
RPS-1K-18-12/2.0-S1-4
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 105 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
RPS-1K-16-10/2.0-S1-9
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -30 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel; Wire Gauge (AWG): 0;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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