Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
HEAT SHRINK BOOT; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 105 Cel;
Median Price
$65.960
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7
In-Stock Inventory
1k+
Master Electronics
1+ parts
100+ parts
$40.030
1k+ parts
$39.240
10k+ parts
-
Verical
$82.760
$46.632
Powell Electronics
$36.080
Nova Conductors
$27.720
IBS Electronics
$92.509
$56.142
$55.034
VNN
Vyrian
Semicontronic
$4.500
$4.388
$4.365
Continental Prestige Electronics
$27.310
$26.764
Bastille Electronics
$26.334
$24.671
Advanced Electronics
$103.000
$97.850
Argo Parts USA
Robosynatics
$4.990
Lucentia Tech
Heat Shrinks 301A022-100/180-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
BAV99
ROHM
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
Wuxi Xuyang Electronic
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
Microsemi
LM358AN
Samsung
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
Sinyork
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Operating Temperature: 85 Cel; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Operating Mode: ENHANCEMENT MODE;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
202K163-25-20/225-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Jacket Material: ELASTOMER;
RNF-100-1-1/2-0-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
301A513-51/164-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Jacket Material: ELASTOMER; Material: FLUOROELASTOMER; Minimum Operating Temperature: -55 Cel;
M23053/5-108-0
Defense Logistics Agency
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
RNF-100-1/4-X-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
M23053/5-111-9
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
NB12042001
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -55 Cel;
2065124003
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG;
RNF-100-3/16-BK-STK
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
M23053/5-104-4
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
DWP-125-3/8-0-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -40 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
M83519/2-7
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
M23053/5-308-9
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel;
SCT-NO.2-E5-0-STK
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel;
M83519/2-14
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
S02-08-R-95
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Terminal Type: SOLDER; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm;
M23053/1-205-0
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED CHLORINATED POLYOLEFIN;
RNF-100-1/4-BK-SP-CS5004
RNF-100-1/16-X-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
9556824001
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 75 Cel; Construction: DUAL WALL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
301A512-51-0
HEAT SHRINK 2-WAY JUNCTION; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUORO-ELASTOMER; Material: FLUOROELASTOMER; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
301A514-50-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Minimum Operating Temperature: -55 Cel; Jacket Material: ELASTOMER;
301A022-25-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Additional Features: REFERENCE STANDARD: VG;
301A034-25/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Construction: DUAL WALL;
301A011-25/225-0
HEAT SHRINK BOOT; Material: ELASTOMER; Construction: DUAL WALL; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel;
301A034-3/86-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
301A028-25-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG;
301A511-51/164-0
HEAT SHRINK 3-WAY JUNCTION; Material: FLUOROELASTOMER; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: FLUORO-ELASTOMER;
301A512-51/164-0
HEAT SHRINK 3-WAY JUNCTION; Jacket Material: FLUORO-ELASTOMER; Material: FLUOROELASTOMER; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
301A022-25-225-0
HEAT SHRINK 3-WAY JUNCTION; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel;
301A511-71-0
HEAT SHRINK BOOT; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
301A028-100-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel;
301A022-4/86-0
HEAT SHRINK BOOT; Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: SAE-AS81765/1; Maximum Operating Temperature: 135 Cel;
301A022-3/42-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
301A022-4-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Construction: DUAL WALL;
301A022-100-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -30 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 105 Cel;
301A022-3-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
301A022-3/86-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Construction: DUAL WALL; Minimum Operating Temperature: -55 Cel;
301A022-3/180-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Construction: DUAL WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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