Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel;
Median Price
$2.197
Lifecycle Status
Suppliers In-Stock
14
In-Stock Inventory
1k+
TE Connectivity
1+ parts
$6.440
100+ parts
$3.220
1k+ parts
$2.150
10k+ parts
-
TTI Europe
$2.000
$1.806
Mouser Electronics
$2.370
$2.130
Heilind Electronics
$1.862
Interstate Connecting
$1.733
DigiKey
$12.679
$12.177
$11.933
Master Electronics
$2.550
$1.990
Arrow
Verical
Nova Conductors
$2.380
FDH Electronics
$2.886
$2.456
$1.991
Electro Enterprises
$3.119
$2.655
$2.151
Vyrian
Quittner & Schimek s.r.o.
Semicontronic
$1.560
$1.521
$1.513
Argo Parts USA
Continental Prestige Electronics
$312.060
$256.710
Bastille Electronics
Heat Shrinks RT-375-3/32-X-SP attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Maximum Operating Temperature:
Minimum Operating Temperature:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
LM7805CT/NOPB
Texas Instruments
LM7805CT/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a package style of flange mount, and offers low line/load regulation making it ideal for various electronic applications requiring stable power supply.
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
EU2B-YS3303C
Idec
ROTARY SWITCH;
LL4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
IRLML6401TRPBF
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
BSS84PH6327XTSA2
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
Comchip Technology
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SN6505BDBVR
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
Continental Device India
0460-202-16141
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
Formosa Microsemi
204W201-25/225-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel;
202K163-25-20/225-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Jacket Material: ELASTOMER;
RT555-1-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -65 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 200 Cel; Wire Gauge (AWG): 0;
RNF-100-1/2-X-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN;
202K132-3-0
TE Connectivity's 202K132-3-0 heat shrink features single wall construction with polyolefin jacket material. It has a max operating temp of 135°C and min cable entry of 5.9". Ideal for applications requiring protection against extreme temperatures and secure cable insulation up to 0 AWG wire size.
M23053/16-003-0
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: ELASTOMER POLYOLEFIN; MIL Conformity: NO; IEC Conformity: NO; DIN Conformity: NO; Construction: SINGLE WALL;
222K121-3/42-0
TE Connectivity's 222K121-3/42-0 heat shrink features SEMI-RIGID POLYOLEFIN jacket material. With a max operating temp of 135°C and min cable entry of 5.6", it suits applications requiring durable insulation for wires up to 0 AWG with a max cable entry of 14".
NB17842001
HEAT SHRINK TUBE; Maximum Operating Temperature: 175 Cel; Minimum Operating Temperature: -55 Cel;
RNF-100-1/4-GN-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE;
S01-03-R
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
856164-002
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel;
TTMS-12.7-9
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN;
RNF-100-3/8-GN-STK
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL;
CGPT-12/4-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
588742-000
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 24; Diameter: 5.95 mm; Maximum Wire Size: 24 AWG; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
RT-375-3/32-X-SP
TMS-SCE-3/8-2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
DCPT-6/3-45-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel;
M23053/5-106-0
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
202K153-25-01-0
TE Connectivity's 202K153-25-01-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temp range, and fits cables up to 20" with 0 AWG wire size. Ideal for applications requiring durable cable protection in extreme temperature environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
RT-375-3/8-X-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel;
RT-375-1-4-X-SP
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel;
RT-375-1/2-X-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Jacket Material: FLUOROPOLYMER;
RT-375-1-X-SP.
HEAT SHRINK; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
RT-375-1-1/2-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUOROPOLYMER;
RT-375-3-16-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 150 Cel;
RT-375-3/4-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 150 Cel;
RT-375-1/4-X-STK
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED FLUOROPOLYMER; Construction: SINGLE WALL;
RT-375-3/64-X-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUOROPOLYMER;
RT-375-1/2-X-65MM
HEAT SHRINK MARKER SLEEVE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
RT-375-3/4-X-STK
RT-375-1/8-X-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
RT-375-3/8-X-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED FLUOROPOLYMER;
RT-375-3/8-X-50MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel;
RT-375-3/8-X-65MM
HEAT SHRINK TUBE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
RT-375-1-1/2-X-65MM
RT-375-1/4-X-27MM
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel;
RT-375-3/4-X-30MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: 55 Cel;
RT-375-1-X-30MM
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
RT-375-1/16-X-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Jacket Material: FLUOROPOLYMER; Maximum Operating Temperature: 150 Cel;
Supply Digital Components
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