Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TE Connectivity's ES-CAP-NO.2-B9-0-30MM is a SINGLE WALL heat shrink with CHLORINATED POLYOLEFIN jacket. It can withstand temperatures from -40 to 105 °C and accommodate up to 0 AWG wire size. Ideal for electrical insulation in various applications.
Median Price
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1k+
Mouser Electronics
1+ parts
$0.250
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$0.153
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$0.142
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DigiKey
$0.171
$0.129
Farnell
$21.186
$18.393
$17.685
Newark
$21.360
$13.660
$12.840
Element14
$25.067
$14.323
$13.270
Adafruit Industries
$150.802
$137.230
$123.658
TE Connectivity
$0.260
$0.190
Verical
$0.131
$0.126
Master Electronics
$0.144
$0.140
Nova Conductors
Vyrian
IBS Electronics
$0.203
$0.196
Electro Sonic
$0.124
Netroflash
$0.139
Argo Parts USA
$0.138
Continental Prestige Electronics
$19.720
$16.710
Advanced Electronics
Perfect Parts
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Glotronic Ltd.
Single wall construction provides excellent insulation and protection for wires and cables, making this heat shrink durable and reliable.
Chlorinated polyolefin jacket material offers resistance to chemicals, oils, and fuels, ensuring the heat shrink can withstand harsh environments and industrial applications.
With a high maximum operating temperature of 105°C, this heat shrink is suitable for use in applications where heat resistance is crucial.
The low minimum operating temperature of -40°C makes this heat shrink suitable for use in extreme cold conditions without sacrificing performance.
With a maximum wire size of 0 AWG, this heat shrink can accommodate a wide range of wire sizes for versatility and flexibility in various projects.
Polyolefin material offers excellent electrical insulation properties and resistance to moisture, making this heat shrink ideal for protecting wires and cables in different environments.
Heat Shrinks ES-CAP-NO.2-B9-0-30MM attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
ULN2803ADWG4
Texas Instruments
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
SMBJ18CA
Semtech
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
Philips Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
CRG0805F10R
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
LM317T
Linear Technology
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Operating Temperature (TJ-Min): 0 Cel; No. of Functions: 1; JESD-609 Code: e0;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
1N4148
Surge Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/56-351
Amphenol
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Additional Features: STANDARD: MIL-DTL-38999; Contact Gender: FEMALE; MIL-Connector Accessory Name: CONTACT; Associated Military - Specifications: MIL-DTL-38999;
202K174-100/180-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -30 Cel; Minimum Cable Entry: .618 inch; Maximum Operating Temperature: 105 Cel; Maximum Wire Size: 0 AWG; Maximum Cable Entry: 1.378 inch;
HSTT25-48Q3
Panduit
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
RNF-100-3/16-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
FIT-221-1/16RD001
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
RNF-100-1/16-0-50MM
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
ATUM-19/6-0-SP
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Construction: DUAL WALL;
202K132-12-01-0
TE Connectivity's 202K132-12-01-0 heat shrink features FLUOROELASTOMER material, with a max operating temp of 200°C and min cable entry of 5.9". Ideal for applications requiring high temp resistance and secure cable insulation up to 15" in size.
M23053/5-111-9
Ls Cable & System
HEAT SHRINK TUBE; MIL Conformity: NO; IEC Conformity: NO; Assembly Item Name: TAPER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYOLEFIN;
M23053/5-103-0
3m Electronic Products Division
HEAT SHRINK TUBE; IEC Conformity: NO; MIL Conformity: NO; DIN Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; Assembly Item Name: TAPER SLEEVE;
222A132-3-0
TE Connectivity's 222A132-3-0 heat shrink features single wall construction with polyolefin jacket material. It has a min cable entry of 0.252" and can withstand temperatures from -55°C to 135°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size with a max cable entry of 0.811".
S02-08-R-94
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm; Terminal Type: SOLDER; Construction: SINGLE WALL;
202K142-25-G03/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG;
202D211-25/86-0
TE Connectivity's 202D211-25/86-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temp range, and fits cables up to 15" with a min entry of 6.4". Ideal for protecting wires in various applications.
RNF-100-3/8-X-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN;
202K153-25/225-0
TE Connectivity's 202K153-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a max operating temp of 150°C and min operating temp of -75°C, suitable for cables up to 0 AWG size. Ideal for applications requiring a min cable entry of 8.4 inches and max cable entry of 20 inches.
M23053/5-107-9
HEAT SHRINK TUBE; MIL Conformity: NO; IEC Conformity: NO; DIN Conformity: NO; Assembly Item Name: TAPER SLEEVE; Jacket Material: CROSSLINKED POLYOLEFIN;
HTAT-24/6-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 125 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Jacket Material: RADIATION CROSSLINKED POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
290207-000
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel;
HT-SCE-1/8-2.0-0
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 225 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
B-040-20-N
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL;
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ES-CAP-NO.2-B9-0-35MM
HEAT SHRINK CAP; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN;
ES-CAP-NO.1-C1-0-30MM
HEAT SHRINK CAP; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN; Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL;
ES-CAP-NO.1-C1-0-35MM
HEAT SHRINK CAP; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN;
ES-CAP-NO.1-C1-0-40MM
HEAT SHRINK CAP; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN;
ES-CAP-NO.1-C1-0-50MM
HEAT SHRINK CAP; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL;
ES-CAP-NO.2-B9-X-50MM
HEAT SHRINK CAP; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel;
ES-CAP-NO.3-B8-0-35MM
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
ES-CAP-NO.2-B9-X-30MM
HEAT SHRINK CAP; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel;
ES-CAP-NO.2-B9-X-35MM
HEAT SHRINK CAP; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel;
ES-CAP-NO.3-B8-0-50MM
HEAT SHRINK CAP; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -40 Cel; Material: POLYOLEFIN; Construction: SINGLE WALL;
ES-CAP-NO.2-B9-X-40MM
HEAT SHRINK CAP; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL;
ES-CAP-NO.1-C1-X-30MM
HEAT SHRINK CAP; Construction: SINGLE WALL; Material: POLYOLEFIN; Jacket Material: CROSSLINKED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel;
ES-CAP-NO.1-C1-X-50MM
HEAT SHRINK CAP; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL;
ES-CAP-NO.3-B8-X-50MM
HEAT SHRINK CAP; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel;
ES-CAP-NO.3-B8-X-40MM
ES-CAP-NO.2-B9-0-50MM
HEAT SHRINK CAP; Minimum Operating Temperature: -40 Cel; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
ES-CAP-NO.1-C1-X-40MM
HEAT SHRINK CAP; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -40 Cel;
ES-CAP-NO.2-B9-X-30MM-FEC
HEAT SHRINK CAP; Construction: SINGLE WALL; Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN;
ES-CAP-NO.1-C1-X-30MM-FEC
HEAT SHRINK CAP; Jacket Material: POLYOLEFIN; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel;
ES-CAP-NO.2-B9-0-40MM
HEAT SHRINK CAP; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Construction: SINGLE WALL; Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel;
Supply Digital Components
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