Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
HEAT SHRINK CAP; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN;
Median Price
$0.196
Lifecycle Status
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15
In-Stock Inventory
1k+
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1+ parts
$0.169
100+ parts
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10k+ parts
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Heilind Electronics
$0.177
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Adafruit Industries
$0.229
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Mouser Electronics
$0.300
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$0.151
DigiKey
$0.360
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TE Connectivity
$0.460
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Master Electronics
$0.162
Verical
$0.191
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Powell Electronics
$0.200
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TTI
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Q Components
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Heat Shrinks ES-CAP-NO.2-B9-0-35MM attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
2N2222A
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
CRG0805F10R
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
SMBJ18CA
Semtech
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
AT90CAN128-16AUR
Microchip Technology
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
BAV99
Weitron Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
Bytesonic Electronics
DRV5053VAQLPG
Texas Instruments
Texas Instruments DRV5053VAQLPG is a magnetic field sensor with 2.5-38V supply voltage range, -40 to 125°C operating temperature, and 0-2V output. Ideal for applications requiring Hall effect sensors like automotive, industrial automation, and robotics due to its compact size (1.52" x 4mm) and high output current capability of 2.3A.
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
Rectron
S01-04-R
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
S01-03-R
VERSAFIT-1-1/4-0-SP
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL;
342A012-25-0
HEAT SHRINK 3-WAY JUNCTION; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel;
202K142-25-01-0
TE Connectivity's 202K142-25-01-0 heat shrink features ELASTOMER jacket material, -75 to 150 °C operating temp range, and fits cables up to 17" in diameter. Ideal for applications requiring durable cable protection with a wide temperature tolerance.
FIT-221-1/2BK105
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
M23053/5-102-9
Ls Cable & System
HEAT SHRINK TUBE; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; MIL Conformity: NO;
RPS-10-2/2.0-9
HEAT SHRINK MARKER SLEEVE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel;
FIT-221-1/4WH103
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN;
NB24322001
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Construction: DUAL WALL;
ES2000-NO.2-B9-0-50MM
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Operating Temperature: 130 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel;
202A153-100/180-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -30 Cel; Maximum Cable Entry: 1.031 inch; Minimum Cable Entry: .339 inch; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel;
D-436-83
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
NB09012001
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL;
S02-08-R-92
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Diameter: 4.3 mm; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER;
TMS-SCE-3/8-2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
222D263-3-0
TE Connectivity's 222D263-3-0 heat shrink features single wall construction with polyolefin jacket material. It has a max operating temperature of 135°C and min of -55°C, suitable for up to 0 AWG wire. Ideal for various applications requiring durable insulation in extreme temperature conditions.
101A031-12-0
HEAT SHRINK CAP; Construction: MEDIUM WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 200 Cel; Material: FLUOROELASTOMER;
202D211-12-22-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Material: FLUOROELASTOMER; Jacket Material: FLUORO-ELASTOMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 200 Cel;
HSTTT08-48-Q
Panduit
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYTETRAFLUOROETHYLENE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
ES-CAP-NO.2-B9-0-30MM
HEAT SHRINK CAP; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN; Construction: SINGLE WALL; Jacket Material: CHLORINATED POLYOLEFIN;
ES-CAP-NO.1-C1-0-30MM
HEAT SHRINK CAP; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN; Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL;
ES-CAP-NO.1-C1-0-35MM
HEAT SHRINK CAP; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN;
ES-CAP-NO.1-C1-0-40MM
HEAT SHRINK CAP; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN;
ES-CAP-NO.1-C1-0-50MM
HEAT SHRINK CAP; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL;
ES-CAP-NO.2-B9-X-50MM
HEAT SHRINK CAP; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel;
ES-CAP-NO.1-C1-X-45MM
HEAT SHRINK TUBE; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel;
ES-CAP-NO.2-B9-X-30MM
HEAT SHRINK CAP; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel;
ES-CAP-NO.2-B9-X-35MM
HEAT SHRINK CAP; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel;
ES-CAP-NO.3-B8-0-50MM
HEAT SHRINK CAP; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -40 Cel; Material: POLYOLEFIN; Construction: SINGLE WALL;
ES-CAP-NO.2-B9-X-40MM
HEAT SHRINK CAP; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL;
ES-CAP-NO.1-C1-X-30MM
HEAT SHRINK CAP; Construction: SINGLE WALL; Material: POLYOLEFIN; Jacket Material: CROSSLINKED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel;
ES-CAP-NO.3-B8-0-40MM
HEAT SHRINK CAP; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Jacket Material: CHLORINATED POLYOLEFIN;
ES-CAP-NO.1-C1-X-50MM
HEAT SHRINK CAP; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL;
ES-CAP-NO.3-B8-X-50MM
HEAT SHRINK CAP; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel;
ES-CAP-NO.3-B8-X-40MM
ES-CAP-NO.2-B9-0-50MM
HEAT SHRINK CAP; Minimum Operating Temperature: -40 Cel; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
ES-CAP-NO.2-B9-X-30MM-FEC
HEAT SHRINK CAP; Construction: SINGLE WALL; Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 105 Cel; Jacket Material: POLYOLEFIN;
ES-CAP-NO.1-C1-X-30MM-FEC
HEAT SHRINK CAP; Jacket Material: POLYOLEFIN; Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -40 Cel;
ES-CAP-NO.2-B9-0-40MM
HEAT SHRINK CAP; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Construction: SINGLE WALL; Material: POLYOLEFIN; Minimum Operating Temperature: -40 Cel;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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