Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity's 202K163-25-01-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min cable entry of 9.9". Ideal for applications requiring durable insulation in extreme temperature environments.
Median Price
$32.278
Lifecycle Status
Suppliers In-Stock
19
In-Stock Inventory
1k+
Adafruit Industries
1+ parts
$18.487
100+ parts
1k+ parts
10k+ parts
-
TE Connectivity
$28.090
Arrow
$29.150
$24.280
Powell Electronics
$32.920
$25.600
Mouser Electronics
$34.070
$24.990
$23.430
Master Electronics
$35.220
$24.380
$22.860
DigiKey
$35.980
$25.999
$24.373
WireMasters
$40.107
$37.309
$32.740
$30.851
Verical
$31.635
Chip1Stop
$24.200
Boersig
Nova Conductors
$18.400
Electro Sonic
$29.070
$20.200
$17.670
IBS Electronics
$49.396
$34.193
$32.061
Vyrian
VNN
ACDS - Activité Composants Distribution Service
Quittner & Schimek s.r.o.
Kallista Electronics Ltd
Semicontronic
$15.710
$15.317
$15.239
Continental Prestige Electronics
$18.287
$17.921
Netroflash
Advanced Electronics
$18.488
Argo Parts USA
Assy Fe
Robosynatics
$0.060
Lucentia Tech
Infinite Electronics LLP (Excess)
Single wall construction provides a good balance between flexibility and durability for easy installation and long-lasting protection.
The use of elastomer as the jacket material ensures resistance against abrasion, chemicals, and extreme temperatures, making it suitable for a wide range of applications.
A minimum cable entry of 9.9 inches allows for compatibility with various cable sizes, providing versatility in usage.
With a high maximum operating temperature of 150°C, this heat shrink can withstand elevated temperatures, ensuring reliable performance in hot environments.
The low minimum operating temperature of -75°C allows this heat shrink to remain flexible and functional even in extremely cold conditions.
Capability to accommodate wire sizes up to 0 AWG ensures compatibility with a wide range of wire gauges, making it a versatile choice for various wiring projects.
The maximum cable entry of 23 inches provides ample space for accommodating larger cables, offering flexibility in installation and usage.
Elastomer material provides excellent protection against moisture, chemicals, and mechanical damage, ensuring long-term reliability and safety for the cables within.
Heat Shrinks 202K163-25-01-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
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PCN Design/Specification - Multiple Drawings Ordering Information Descriptions 27/Oct/2018
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
ULN2803A
Texas Instruments
ULN2803A by Texas Instruments is a peripheral driver with 8 functions. It has a max supply voltage of 3V and can operate in temperatures ranging from -40 to 85°C. This IC is commonly used as a buffer or inverter based peripheral driver for various applications.
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
1552200168
Molex
WIRE AND CABLE;
NE555D
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
DS18B20U
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
FDN5618P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
Goodwork Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
BAV99
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
M23053/5-106-9
Ls Cable & System
HEAT SHRINK TUBE; MIL Conformity: NO; IEC Conformity: NO; DIN Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; Assembly Item Name: TAPER SLEEVE;
HRHT-2/3
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN;
HX-SCE-1K-3.2-50-9
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel; Wire Gauge (AWG): 0;
RT-375-1-X-SP.
HEAT SHRINK; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -55 Cel; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
TMS-SCE-1-2.0-9
HEAT SHRINK MARKER SLEEVE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG;
DWP-125-1/2-0-STK
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -40 Cel; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
382A012-25-01/225-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
D-181-1222-90/9
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE;
TMS-SCE-3/8-2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
ATUM-12/3-0-SP
HEAT SHRINK TUBE; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 110 Cel;
HSTTT24-48-Q
Panduit
HEAT SHRINK TUBE; Jacket Material: POLYTETRAFLUOROETHYLENE; Construction: SINGLE WALL;
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; MIL Conformity: NO; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO;
M23053/5-110-4
HEAT SHRINK TUBE; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
M23053/5-303-0
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Additional Features: REFERENCE STANDARD: CSA; UL; Wire Gauge (AWG): 0;
SO96-3-55-22-90
TE Connectivity's SO96-3-55-22-90 heat shrink features a single wall construction with crosslinked modified PVDF jacket material. It has a max operating temperature of 175°C, 4.3mm diameter, and supports up to 0 AWG wire size. Ideal for solder terminals in various applications requiring reliable insulation and protection.
202K121-25-00-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER;
D-142-51CS728
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG;
S02-17-R-3
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Diameter: 2.65 mm;
204W221-25/225-0
HEAT SHRINK BOOT; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel;
TMS-SCE-1-2.0-4
HEAT SHRINK MARKER SLEEVE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
202K132-25/225-0
TE Connectivity's 202K132-25/225-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temp range, and accommodates up to 0 AWG wire. Ideal for applications requiring a min cable entry of 5.9" and max of 15".
202K121-25/225-0
TE Connectivity's 202K121-25/225-0 heat shrink features ELASTOMER jacket material, -75 to 150 °C operating temp range, and fits cables up to 0 AWG. Ideal for applications requiring a min cable entry of 5.6 inch and max of 14 inch.
202K121-25-01/225-0
TE Connectivity's 202K121-25-01/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a max operating temp of 150°C and min cable entry of 5.6". Ideal for applications requiring durable insulation in extreme temperature environments.
202K132-25-0
TE Connectivity's 202K132-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min cable entry of 5.9". Ideal for applications requiring -75 to 150°C range, accommodating up to 0 AWG wire size in a 15" cable entry space.
202K121-25/225-0-CS6939
HEAT SHRINK BOOT; Construction: DUAL WALL; Jacket Material: ELASTOMER;
202K1322501-225-0
TE Connectivity's 202K1322501-225-0 heat shrink features dual wall construction with elastomer jacket material. It offers a wide temperature range from -75°C to 150°C, accommodating wire sizes up to 0 AWG. Ideal for applications requiring a min cable entry of 5.9" and max of 15".
202K132-25-01/86-0
TE Connectivity's 202K132-25-01/86-0 heat shrink features dual wall construction with elastomer jacket material. It has a min cable entry of 5.9" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size with a max cable entry of 15".
202K121-25-01/86-0
TE Connectivity's 202K121-25-01/86-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temp range, and fits cables up to 14" with a min entry of 5.6". Ideal for electrical insulation in various applications.
202K142-25-01/86-0
TE Connectivity's 202K142-25-01/86-0 heat shrink features ELASTOMER jacket material, -75 to 150°C temp range, and fits cables up to 17" with 0 AWG wire size. Ideal for electrical insulation in various applications.
202K121-25-0
TE Connectivity's 202K121-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min operating temp of -75°C. Ideal for applications requiring a min cable entry of 5.6" and accommodating up to 0 AWG wire size.
202K142-25/225-0
TE Connectivity's 202K142-25/225-0 heat shrink features ELASTOMER jacket material, -75 to 150 °C operating temp range, and fits cables up to 0 AWG. Ideal for applications requiring a min cable entry of 7.1 inches and max of 17 inches.
202K142-25-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Material: ELASTOMER; Minimum Cable Entry: 7.1 inch; Construction: SINGLE WALL; Jacket Material: ELASTOMER;
202K142-25-01/225-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Wire Size: 0 AWG; Minimum Cable Entry: 7.1 inch; Maximum Operating Temperature: 150 Cel;
202K142-25-01-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Cable Entry: 7.1 inch; Maximum Operating Temperature: 150 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER;
202K121-25-01-0
HEAT SHRINK BOOT; Minimum Cable Entry: 5.6 inch; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Cable Entry: 14 inch;
202K142-25-00-0
HEAT SHRINK BOOT; Material: ELASTOMER; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel;
202K132-25-G03/86-0
HEAT SHRINK BOOT; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER;
202K121-25-01/42-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel;
202K153-25/225-0
TE Connectivity's 202K153-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a max operating temp of 150°C and min operating temp of -75°C, suitable for cables up to 0 AWG size. Ideal for applications requiring a min cable entry of 8.4 inches and max cable entry of 20 inches.
202K153-25-01/225-0
TE Connectivity's 202K153-25-01/225-0 heat shrink features ELASTOMER jacket material, -75 to 150°C operating temp range, and fits cables up to 20" in diameter. Ideal for applications requiring protection and insulation of large cables with a min entry of 8.4".
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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