Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK TUBE; MIL Conformity: NO; IEC Conformity: NO; DIN Conformity: NO; Assembly Item Name: TAPER SLEEVE; Jacket Material: CROSSLINKED POLYOLEFIN;
Median Price
$0.378
Lifecycle Status
Suppliers In-Stock
14
In-Stock Inventory
1k+
Verical
1+ parts
-
100+ parts
1k+ parts
10k+ parts
CDM Electronics
Nova Conductors
$1.840
FDH Electronics
Bristol Electronics
Bisco
A2Z Electronics, Inc.
Eastern End Electronics, LLC
Electro Mavin
QIE Inc.
Electronic Expediters
Global Solutions Electronics Company
Vyrian
Kallista Electronics Ltd
Continental Prestige Electronics
Argo Parts USA
Perfect Parts
Heat Shrinks M23053/5-107-9 attributes and parameters. Explore more Heat Shrinks devices from Ls Cable & System
Assembly Item Name:
Connector Accessory Type:
Construction:
DIN Conformity:
IEC Conformity:
Jacket Material:
MIL Conformity:
LS Cable & System, established in 1962, has been contributing to building power grids and communication networks first in Korea and then in countries all over the world by developing, producing and providing cables and related solutions used in daily life and throughout many industries. Furthermore, the company set the stage for industrial and economic development by capitalizing on our innovative technology to supply various special industrial cables and industrial materials. We at LS Cable & System are now supplying state-of-the-art products, such as submarine, extra-high voltage, high temperature superconducting and communications cables to power authorities, heavy electric equipment makers and common carriers around the world. Our products can be seen throughout the Americas, Europe, the Middle East and Asia, so we are now recognized as a leading manufacturer serving global industries both in name and reality.
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ERJ2RKF1002X
Panasonic
Panasonic's ERJ2RKF1002X is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance and operating temperature range of -55 to 155 °C.
LM358M
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM358AN
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STMicroelectronics
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
1N4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
LL4148
Onsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
LM107H/883
Texas Instruments
LM107H/883 by Texas Instruments is a MIL-STD-883 compliant operational amplifier with 3000uV max input offset voltage, 80dB common mode reject ratio, and 250kHz unity gain bandwidth. Ideal for military applications due to its -55 to 125 °C operating temperature range and robust metal package body material.
MMSZ5245BT1G
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
ATUM-8/2-0-STK
TE Connectivity
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
342A024-25/225-0
TE Connectivity's 342A024-25/225-0 is a dual wall heat shrink with elastomer jacket material. It has a max operating temp of 150°C and min of -75°C, suitable for wires up to 0 AWG. Ideal for applications requiring durable insulation in extreme temperature environments.
RT-375-1/2-X-65MM
HEAT SHRINK MARKER SLEEVE; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
D-110-0101
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Terminal Type: SOLDER; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
CWT-9001
TE Connectivity's CWT-9001 heat shrink features single wall construction with crosslinked modified polyolefin jacket material. It supports wire gauge 18 AWG, suitable for discrete wire applications. Operating temperature ranges from -55 to 125°C, accommodating wires b/w 22 and 18 AWG efficiently.
202K163-25-G03/225-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER;
M83519/2-13
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
222K152-100/180-0
HEAT SHRINK BOOT; Maximum Cable Entry: 20 inch; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel; Minimum Cable Entry: 8.4 inch; Maximum Wire Size: 0 AWG;
M23053/5-108-0
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
588742-000
HEAT SHRINK SOLDER SLEEVE; Wire Gauge (AWG): 24; Diameter: 5.95 mm; Maximum Wire Size: 24 AWG; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE;
462A023-25/225-0
TE Connectivity's 462A023-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a wide operating temperature range from -75°C to 150°C and accommodates wire sizes up to 0 AWG. Ideal for applications requiring durable insulation in extreme temperature conditions.
M83519/2-8
Sumitomo Electric Industries
HEAT SHRINK SOLDER SLEEVE; Jacket Material: POLYVINYLIDENE FLUORIDE;
HSTT38-C
Panduit
EH3268-000
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -75 Cel;
M23053/5-108-9
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL;
TMS-SCE-1K-1-1/2-2.0-9
HEAT SHRINK MARKER SLEEVE; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL;
222K163-25-0
TE Connectivity's 222K163-25-0 heat shrink features single wall construction with elastomer jacket material. It has a min cable entry of 9.9" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size with a max cable entry of 23".
NB18932001
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
ES2000-NO.1-C1-0-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 130 Cel; Construction: DUAL WALL; Minimum Operating Temperature: -40 Cel; Wire Gauge (AWG): 0;
TAT-125-3/8-0-2IN
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN; Construction: DUAL WALL; Maximum Operating Temperature: 110 Cel;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M23053/16-004-0
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; Jacket Material: ELASTOMER POLYOLEFIN; IEC Conformity: NO; DIN Conformity: NO; Construction: SINGLE WALL;
Ls Cable & System
HEAT SHRINK TUBE; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO; MIL Conformity: NO; Construction: SINGLE WALL; IEC Conformity: NO;
M23053/16-003-0
HEAT SHRINK TUBE; DIN Conformity: NO; IEC Conformity: NO; MIL Conformity: NO; Jacket Material: ELASTOMER POLYOLEFIN; Construction: SINGLE WALL;
HEAT SHRINK TUBE; Jacket Material: ELASTOMER POLYOLEFIN; MIL Conformity: NO; IEC Conformity: NO; DIN Conformity: NO; Construction: SINGLE WALL;
M23053/5-102-0
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN;
M23053/5-103-9
HEAT SHRINK TUBE; IEC Conformity: NO; Construction: SINGLE WALL; DIN Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; Assembly Item Name: TAPER SLEEVE;
Grayline
HEAT SHRINK TUBE; MIL Conformity: NO; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO; IEC Conformity: NO;
HEAT SHRINK TUBE; DIN Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; IEC Conformity: NO; Construction: SINGLE WALL; MIL Conformity: NO;
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Wire Gauge (AWG): 0;
M23053/5-111-9
HEAT SHRINK TUBE; IEC Conformity: NO; DIN Conformity: NO; MIL Conformity: NO; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYOLEFIN;
HEAT SHRINK TUBE; MIL Conformity: NO; IEC Conformity: NO; Assembly Item Name: TAPER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYOLEFIN;
HEAT SHRINK TUBE; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
M23053/18-208-C
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 150 Cel; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
M23053/5-106-9
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Jacket Material: IRRADIATED MODIFIED POLYOLEFIN; Construction: SINGLE WALL; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG;
HEAT SHRINK TUBE; MIL Conformity: NO; IEC Conformity: NO; DIN Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; Assembly Item Name: TAPER SLEEVE;
L3harris Technologies
HEAT SHRINK TUBE; MIL Conformity: NO; DIN Conformity: NO; Assembly Item Name: TAPER SLEEVE; IEC Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN;
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; MIL Conformity: NO; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved