Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Jacket Material: CROSSLINKED ELASTOMER;
Median Price
$9.328
Lifecycle Status
Suppliers In-Stock
17
In-Stock Inventory
1k+
WireMasters
1+ parts
$6.755
100+ parts
$6.441
1k+ parts
$5.539
10k+ parts
$5.226
Adafruit Industries
$51.500
$48.925
-
Element14
$2,320.210
Master Electronics
$9.280
$9.010
$8.920
Verical
$10.918
$10.600
TTI Europe
$5.700
$5.486
Chip1Stop
$8.450
Powell Electronics
Mouser Electronics
$11.110
DigiKey
Nova Conductors
$8.981
Electro Enterprises
$16.488
$14.033
$11.371
FDH Electronics
$19.854
$16.897
$13.692
IBS Electronics
$13.015
$12.637
$12.510
Electro Sonic
$8.080
$7.180
$6.890
Rapid Electronics
$6.060
Bisco
Continental Prestige Electronics
$8.373
$8.205
Netroflash
$8.801
Semicontronic
$10.550
$10.286
$10.234
Advanced Electronics
Epart123
$4.950
Argo Parts USA
Heat Shrinks DR-25-TW-3/16-0-SP attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Wire Gauge (AWG):
Maximum Wire Size:
PCN Design/Specification - DR-25-TW Drawing chg 21/JAN/2022
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
SMBJ18CA
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
BAV99
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
LL4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148WS
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
M83519/1-5
TE Connectivity
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED MODIFIED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
VERSAFIT-3/8-KT2-REFILL
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Additional Features: REFERENCE STANDARD: CSA; UL;
RW-175-1/2-X-STK
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 175 Cel; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
518286-001
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
RT-375-3/4-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 150 Cel;
M23053/5-108-0
Defense Logistics Agency
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Wire Gauge (AWG): 0; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
222K152-25-0
TE Connectivity's 222K152-25-0 heat shrink features single wall construction with elastomer jacket material. It has a min cable entry of 8.4" and can withstand temperatures from -75°C to 150°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size with a max entry of 20".
M23053/18-208-C
HEAT SHRINK TUBE; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 150 Cel; Jacket Material: FLUOROPOLYMER; Construction: SINGLE WALL;
EE1117-000
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
381A301-71/42-0
TE Connectivity's 381A301-71/42-0 heat shrink features dual wall construction with polyolefin jacket material. With a max operating temp of 135°C and min of -55°C, it accommodates wires up to 0 AWG. Ideal for electrical insulation in various applications.
202K132-3-0
TE Connectivity's 202K132-3-0 heat shrink features single wall construction with polyolefin jacket material. It has a max operating temp of 135°C and min cable entry of 5.9". Ideal for applications requiring protection against extreme temperatures and secure cable insulation up to 0 AWG wire size.
RW-175-3-64-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 175 Cel; Jacket Material: FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel;
202K121-25-01/42-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 150 Cel;
NB11382001
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Construction: DUAL WALL; Maximum Operating Temperature: 110 Cel;
878504-006
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Wire Size: 0 AWG;
CWT-7
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Diameter: 7 mm; Maximum Operating Temperature: 125 Cel;
FP-301-3/4-BLACK-50
3m Electronic Products Division
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Additional Features: REFERENCE STANDARD: ABS; AMS-3636; AMS-3637; CSA; UL; Construction: SINGLE WALL;
D-101-00
HEAT SHRINK SOLDER SLEEVE; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Wire Gauge (AWG): 0;
FIT-221-1/16RD001
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
222K152-100/180-0
HEAT SHRINK BOOT; Maximum Cable Entry: 20 inch; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel; Minimum Cable Entry: 8.4 inch; Maximum Wire Size: 0 AWG;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DR-25-3/8-0-SP
HEAT SHRINK TUBE; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Jacket Material: CROSSLINKED ELASTOMER; Maximum Operating Temperature: 150 Cel;
DR-25-1/4-0-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Wire Gauge (AWG): 0;
DR-25-1/2-0-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -75 Cel; Construction: SINGLE WALL;
DR-25-1-1/2-0-SP
HEAT SHRINK TUBE; Wire Gauge (AWG): 0; Maximum Operating Temperature: 150 Cel; Construction: SINGLE WALL; Jacket Material: CROSSLINKED ELASTOMER; Maximum Wire Size: 0 AWG;
DR-25-3/16-0-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -75 Cel;
DR-25-1/2-0
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN; Construction: SINGLE WALL;
DR-25-3/4-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Maximum Wire Size: 0 AWG; Jacket Material: CROSSLINKED ELASTOMER; Construction: SINGLE WALL;
DR-25-1/2-0-SP-CS7143
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: ELASTOMER;
DR-25-1/8-0-SP-
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Wire Gauge (AWG): 0; Jacket Material: CROSSLINKED ELASTOMER;
DR-25-1/8-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Jacket Material: CROSSLINKED ELASTOMER; Wire Gauge (AWG): 0;
DR-25-1-0-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -75 Cel;
DR-25-3/8-0
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED POLYOLEFIN;
DR-25-2-0-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -75 Cel; Maximum Operating Temperature: 150 Cel; Jacket Material: CROSSLINKED ELASTOMER;
DR-25-1/4-0
DR-25-3/8-0-200FT/CSP
DR-25-3/8-0-150FT/CSP
HEAT SHRINK TUBE; Jacket Material: ELASTOMER; Construction: SINGLE WALL;
DR-25-3/4-0
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Construction: SINGLE WALL;
DR-25-1/2-0-150FT/CSP
DR-25-3/16-0
DR-25-3/16-0-150FT/CSP
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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