Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HEAT SHRINK; Construction: SINGLE WALL; Additional Features: REFERENCE STANDARD: DEF; VG; Minimum Operating Temperature: -30 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel;
Median Price
$34.840
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1k+
TE Connectivity
1+ parts
$30.610
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Mouser Electronics
$23.150
$22.970
DigiKey
$25.174
$23.600
Master Electronics
$35.650
$23.310
$22.480
WireMasters
$45.248
$41.767
$33.936
Verical
$27.424
Nova Conductors
$20.270
VNN
Vyrian
Netroflash
$19.865
Continental Prestige Electronics
Argo Parts USA
Heat Shrinks 382A012-100-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Additional Features:
Connector Accessory Type:
Construction:
Jacket Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
PCN Design/Specification - Multiple Drawings Ordering Information Descriptions 27/Oct/2018
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
1N4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NC7WZ17P6X
Onsemi
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
BAV99
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
BSS138
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
Lite-on Semiconductor
Nte Electronics
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Semtech
NB11802001
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Jacket Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel;
RNF-100-3/4-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
DR-25-3/16-0-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Minimum Operating Temperature: -75 Cel;
RNF-100-1/2-X-FSP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel;
M23053/16-005-0
HEAT SHRINK TUBE; DIN Conformity: NO; Jacket Material: ELASTOMER POLYOLEFIN; Assembly Item Name: TAPER SLEEVE; MIL Conformity: NO; Construction: SINGLE WALL;
382A012-25/225-0
TE Connectivity's 382A012-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It can withstand temperatures from -75 to 150°C and accommodate wires up to 0 AWG. Ideal for applications requiring durable insulation in extreme temperature environments.
222K152-100/180-0
HEAT SHRINK BOOT; Maximum Cable Entry: 20 inch; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 105 Cel; Minimum Cable Entry: 8.4 inch; Maximum Wire Size: 0 AWG;
342A024-25-0
TE Connectivity's 342A024-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temperature of 150°C and min of -75°C, suitable for wires up to 0 AWG. Ideal for electrical insulation in various applications.
M23053/5-103-0
3m Electronic Products Division
HEAT SHRINK TUBE; IEC Conformity: NO; MIL Conformity: NO; DIN Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; Assembly Item Name: TAPER SLEEVE;
DR-25-1-0-SP
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED ELASTOMER; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Minimum Operating Temperature: -75 Cel;
TAT-125-1/4-0-2IN
HEAT SHRINK TUBE; Maximum Operating Temperature: 110 Cel; Construction: DUAL WALL; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
RNF-100-3/32-2-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
M83519/2-13
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
RNF-100-2-0-SP
HEAT SHRINK TUBE; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Construction: SINGLE WALL;
RNF-100-3/16-BK-SP-CS5004
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Additional Features: APPROVAL: VDE;
D-1744-01
TE Connectivity D-1744-01 heat shrink features single wall construction with crosslinked PVDF jacket material. Ideal for solder terminals, it operates b/w -55°C to 150°C and accommodates wires up to 0 AWG.
HSTTT08-48-Q
Panduit
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYTETRAFLUOROETHYLENE;
202A142-3/86-0
TE Connectivity's 202A142-3/86-0 heat shrink features dual wall construction with polyolefin jacket material. It has a min cable entry of 0.291" and can withstand temperatures from -55°C to 135°C. Ideal for applications requiring protection and insulation for cables up to 0 AWG size with a max cable entry of 1".
202K132-25/225-0-CS6939
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Jacket Material: ELASTOMER;
HSTTT19-48-Q
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
382A012-25-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Construction: DUAL WALL; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
382A023-3-42-0
HEAT SHRINK 2-WAY JUNCTION; Construction: DUAL WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
382A023-25/225-0
TE Connectivity's 382A023-25/225-0 is a DUAL WALL heat shrink with ELASTOMER jacket, operating from -75°C to 150°C. It accommodates up to 0 AWG wire and is ideal for electrical insulation in various applications.
382A012-4/86-0
TE Connectivity's 382A012-4/86-0 heat shrink features dual wall construction with polyolefin jacket material. It has a max operating temp of 135°C and min of -55°C, suitable for wire sizes up to 0 AWG. Ideal for various applications requiring reliable insulation and protection.
382A023-3-0
HEAT SHRINK 2-WAY JUNCTION; Minimum Operating Temperature: -55 Cel; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Wire Size: 0 AWG; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
382A012-25-01/225-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
382A012-3/42-0
HEAT SHRINK 2-WAY JUNCTION; Jacket Material: POLYOLEFIN; Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
382A012-3-0
HEAT SHRINK 2-WAY JUNCTION; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN;
382A046-3-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Construction: DUAL WALL; Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
382A034-3-0
HEAT SHRINK BOOT; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
382A034-25/225-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Additional Features: REFERENCE STANDARD: VG; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER;
382A012-12-0
HEAT SHRINK 2-WAY JUNCTION; Maximum Wire Size: 0 AWG; Material: FLUOROELASTOMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 200 Cel; Jacket Material: FLUORO-ELASTOMER;
382A023-25-08-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Construction: DUAL WALL; Material: ELASTOMER;
382A034-100/180-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -30 Cel;
382A023-25-06-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
382A023-4-0
HEAT SHRINK 2-WAY JUNCTION; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN;
382A023-3/86-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN;
382A012-3/86-0
TE Connectivity's 382A012-3/86-0 heat shrink features dual wall construction with polyolefin jacket material. It has a max operating temperature of 135°C and min of -55°C, suitable for wire sizes up to 0 AWG. Ideal for various applications requiring durable insulation in extreme temperature conditions.
Supply Digital Components
$106.00
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$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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