Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity's 382A034-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It has a wide operating temperature range from -75°C to 150°C and accommodates wire sizes up to 0 AWG. Ideal for applications requiring durable insulation in extreme temperature conditions.
Median Price
$85.330
Lifecycle Status
Suppliers In-Stock
21
In-Stock Inventory
1k+
TTI Europe
1+ parts
$53.710
100+ parts
$41.910
1k+ parts
-
10k+ parts
Interstate Connecting
$67.228
$53.222
TTI
$67.910
$54.740
Arrow
$80.530
TE Connectivity
$81.070
Master Electronics
$65.780
RS Americas
$94.940
Verical
$98.235
$82.753
Mouser Electronics
$100.870
$73.360
Powell Electronics
$103.650
$85.230
Newark
$110.750
$81.440
$78.830
Nova Conductors
$47.810
Electro Sonic
$73.370
$64.380
$64.050
TME
$73.880
$59.900
Electro Enterprises
$96.275
$81.936
$66.397
FDH Electronics
$108.657
$92.474
$74.936
IBS Electronics
$119.675
$92.256
Vyrian
VNN
ACDS - Activité Composants Distribution Service
Quittner & Schimek s.r.o.
Semicontronic
$45.650
$44.509
$44.280
Continental Prestige Electronics
$46.854
Netroflash
Infinite Electronics LLP (Excess)
Argo Parts USA
Assy Fe
Dual wall construction provides extra protection and durability, making this heat shrink resistant to abrasion, chemicals, and moisture.
Elastomer jacket material offers excellent flexibility and heat resistance, ensuring long-term performance in demanding environments.
With a high maximum operating temperature of 150°C, this heat shrink can withstand intense heat without compromising its integrity.
The low minimum operating temperature of -75°C allows this heat shrink to remain effective in extremely cold conditions.
Capable of accommodating up to 0 AWG wire size, this heat shrink is versatile and suitable for a wide range of applications.
The elastomer material used in this heat shrink provides superior insulation and protection for wires and cables, ensuring reliable performance.
Heat Shrinks 382A034-25/225-0 attributes and parameters. Explore more Heat Shrinks devices from TE Connectivity
Additional Features:
Connector Accessory Type:
Construction:
Jacket Material:
Material:
Maximum Operating Temperature:
Minimum Operating Temperature:
Maximum Wire Size:
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
LM317T/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-609 Code: e3; Package Shape: RECTANGULAR;
LM317T
Tt Electronics Plc
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Qualification Status: Not Qualified; JESD-30 Code: R-PSFM-T3;
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
1N4148
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
Bharat Electronics
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
LM107H/883
Texas Instruments
LM107H/883 by Texas Instruments is a MIL-STD-883 compliant operational amplifier with 3000uV max input offset voltage, 80dB common mode reject ratio, and 250kHz unity gain bandwidth. Ideal for military applications due to its -55 to 125 °C operating temperature range and robust metal package body material.
SMBJ18CA
Good-ark Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Maximum Time At Peak Reflow Temperature (s): 10; JESD-609 Code: e3;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Diodes Incorporated
FDLL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM78L05ACMX/NOPB
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
S01-03-RCS918
HEAT SHRINK SOLDER SLEEVE; Terminal Type: SOLDER; Maximum Operating Temperature: 150 Cel; Maximum Wire Size: 0 AWG; Diameter: 4.3 mm;
TMS-SCE-1-1/2-2.0-4
HEAT SHRINK MARKER SLEEVE; Minimum Operating Temperature: -55 Cel; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Wire Gauge (AWG): 0; Maximum Operating Temperature: 135 Cel;
202D263-25-08/86-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Jacket Material: ELASTOMER; Maximum Wire Size: 0 AWG;
M83519/2-13
Defense Logistics Agency
HEAT SHRINK TUBE; Jacket Material: POLYVIMYLIDENE FLUORIDE;
F221B1/8BK100
Alpha Wire
HEAT SHRINK TUBE; Jacket Material: CROSSLINKED POLYOLEFIN;
RNF-100-1/8-X-STK
HEAT SHRINK TUBE; Construction: SINGLE WALL; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
M23053/5-102-9
Ls Cable & System
HEAT SHRINK TUBE; Construction: SINGLE WALL; Assembly Item Name: TAPER SLEEVE; DIN Conformity: NO; Jacket Material: CROSSLINKED POLYOLEFIN; MIL Conformity: NO;
D-142-50
HEAT SHRINK SOLDER SLEEVE; Jacket Material: CROSSLINKED POLYVINYLIDENE FLUORIDE; Construction: SINGLE WALL;
222A132-25-0
TE Connectivity's 222A132-25-0 heat shrink features ELASTOMER jacket material, 0.252" min cable entry, and -75 to 150°C operating temp range. Ideal for applications requiring protection and insulation of cables up to 0 AWG with a max entry of 0.811".
382A012-3/42-0
TE Connectivity's 382A012-3/42-0 heat shrink features dual wall construction with polyolefin jacket material. With a max operating temp of 135°C and min of -55°C, it accommodates up to 0 AWG wire size. Ideal for electrical insulation in various applications.
XFFR-04X4
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Maximum Operating Temperature: 110 Cel; Construction: SINGLE WALL; Minimum Operating Temperature: -55 Cel;
202K121-25-0
TE Connectivity's 202K121-25-0 heat shrink features single wall construction with elastomer jacket material. It has a max operating temp of 150°C and min operating temp of -75°C. Ideal for applications requiring a min cable entry of 5.6" and accommodating up to 0 AWG wire size.
RNF-100-3/16-BK-STK
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
202D121-3-00-0
HEAT SHRINK BOOT; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Jacket Material: SEMI-RIGID POLYOLEFIN; Material: POLYOLEFIN;
ES-CAP-NO.2-B9-0-35MM
HEAT SHRINK CAP; Minimum Operating Temperature: -40 Cel; Construction: SINGLE WALL; Maximum Operating Temperature: 105 Cel; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN;
CWT-9005
HEAT SHRINK SOLDER SLEEVE; Construction: SINGLE WALL; Jacket Material: CROSSLINKED MODIFIED POLYOLEFIN;
RNF-100-3/32-BK-STK
HEAT SHRINK TUBE; Additional Features: APPROVAL: VDE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN;
RNF-100-3/4-X-SP
HEAT SHRINK TUBE; Construction: SINGLE WALL; Jacket Material: POLYOLEFIN; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
RNF-100-2-BK-STK
HEAT SHRINK TUBE; Maximum Wire Size: 0 AWG; Construction: SINGLE WALL; Wire Gauge (AWG): 0; Minimum Operating Temperature: -55 Cel; Additional Features: APPROVAL: VDE;
ATUM-8/2-0-STK
HEAT SHRINK TUBE; Jacket Material: POLYOLEFIN; Construction: SINGLE WALL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
382A012-25-0
HEAT SHRINK BOOT; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Construction: DUAL WALL; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
382A023-3-42-0
HEAT SHRINK 2-WAY JUNCTION; Construction: DUAL WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Maximum Wire Size: 0 AWG;
382A012-25/225-0
TE Connectivity's 382A012-25/225-0 heat shrink features dual wall construction with elastomer jacket material. It can withstand temperatures from -75 to 150°C and accommodate wires up to 0 AWG. Ideal for applications requiring durable insulation in extreme temperature environments.
382A023-25/225-0
TE Connectivity's 382A023-25/225-0 is a DUAL WALL heat shrink with ELASTOMER jacket, operating from -75°C to 150°C. It accommodates up to 0 AWG wire and is ideal for electrical insulation in various applications.
382A012-4/86-0
TE Connectivity's 382A012-4/86-0 heat shrink features dual wall construction with polyolefin jacket material. It has a max operating temp of 135°C and min of -55°C, suitable for wire sizes up to 0 AWG. Ideal for various applications requiring reliable insulation and protection.
382A023-3-0
HEAT SHRINK 2-WAY JUNCTION; Minimum Operating Temperature: -55 Cel; Jacket Material: SEMI-RIGID POLYOLEFIN; Maximum Wire Size: 0 AWG; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel;
382A012-25-01/225-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Jacket Material: ELASTOMER; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
HEAT SHRINK 2-WAY JUNCTION; Jacket Material: POLYOLEFIN; Material: POLYOLEFIN; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel;
382A012-3-0
HEAT SHRINK 2-WAY JUNCTION; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 135 Cel; Construction: SINGLE WALL; Material: POLYOLEFIN; Jacket Material: POLYOLEFIN;
382A046-3-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Construction: DUAL WALL; Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel; Jacket Material: POLYOLEFIN;
382A034-3-0
HEAT SHRINK BOOT; Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Jacket Material: POLYOLEFIN; Minimum Operating Temperature: -55 Cel;
382A012-12-0
HEAT SHRINK 2-WAY JUNCTION; Maximum Wire Size: 0 AWG; Material: FLUOROELASTOMER; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 200 Cel; Jacket Material: FLUORO-ELASTOMER;
382A023-25-08-0
HEAT SHRINK BOOT; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Construction: DUAL WALL; Material: ELASTOMER;
382A034-100/180-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Maximum Operating Temperature: 105 Cel; Minimum Operating Temperature: -30 Cel;
382A023-25-06-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Minimum Operating Temperature: -75 Cel; Jacket Material: ELASTOMER; Material: ELASTOMER; Maximum Operating Temperature: 150 Cel;
382A012-100-0
HEAT SHRINK; Construction: SINGLE WALL; Additional Features: REFERENCE STANDARD: DEF; VG; Minimum Operating Temperature: -30 Cel; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 105 Cel;
382A023-4-0
HEAT SHRINK 2-WAY JUNCTION; Jacket Material: POLYOLEFIN; Maximum Operating Temperature: 135 Cel; Maximum Wire Size: 0 AWG; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN;
382A023-3/86-0
HEAT SHRINK BOOT; Maximum Operating Temperature: 135 Cel; Minimum Operating Temperature: -55 Cel; Material: POLYOLEFIN;
382A012-3/86-0
TE Connectivity's 382A012-3/86-0 heat shrink features dual wall construction with polyolefin jacket material. It has a max operating temperature of 135°C and min of -55°C, suitable for wire sizes up to 0 AWG. Ideal for various applications requiring durable insulation in extreme temperature conditions.
382A034-25/86-0
HEAT SHRINK BOOT; Construction: DUAL WALL; Jacket Material: ELASTOMER; Maximum Operating Temperature: 150 Cel; Minimum Operating Temperature: -75 Cel; Material: ELASTOMER;
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