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RG3216N-7503-B-T1

Susumu

RG3216N-7503-B-T1 by Susumu

The Susumu RG3216N-7503-B-T1 is a chip fixed resistor with 750000 ohm resistance, 0.1% tolerance, and 0.25 W power dissipation. It operates b/w -55 to 155 °C and is ideal for SMT applications requiring precise resistance values in compact spaces.

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Overview

Elevate your electronic projects with the RG3216N-7503-B-T1 by Susumu. As a leading manufacturer in the industry, Susumu delivers top-quality fixed resistors that are essential for various applications. With its advanced technology and reliable construction, this chip resistor offers exceptional value and benefits to customers. Whether you're working on telecommunications, automotive, or industrial applications, this SMT resistor provides precise resistance with a tolerance of 0.1%. Trust Susumu's expertise and experience to enhance your projects with the RG3216N-7503-B-T1.

Feature Benefit Bullets

Rated Temperature: 85 °C

The rated temperature of 85 °C ensures that this fixed resistor can operate efficiently within a reasonable temperature range, making it suitable for various applications.

Technology: METAL FILM

Metal film technology provides high accuracy and stability in resistance values, making this fixed resistor a reliable choice for precise circuit requirements.

Resistance: 750000 ohm

With a resistance value of 750000 ohms, this fixed resistor can be used in circuits that require specific resistance values for optimal performance.

Tolerance: 0.1 %

The low tolerance of 0.1% ensures that this fixed resistor provides accurate and consistent resistance values, making it suitable for applications where precision is crucial.

Operating Voltage: 150 V

The high operating voltage of 150V allows this fixed resistor to be used in circuits that require higher voltage levels without compromising performance or safety.

Mounting Type: SURFACE MOUNT

The surface mounting type enables easy and secure installation of this fixed resistor on PCBs, saving space and simplifying assembly processes.

Technical Specifications

Fixed Resistors RG3216N-7503-B-T1 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Additional Features:

ULTRA PRECISION

Construction:

Chip

JESD-609 Code:

e3

Manufacturer Series:

RG

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.5 mm

Length (Package):

3.2 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Width (Package):

1.6 mm

Packing Method:

TR

Rated Power Dissipation (P):

Rated Temperature:

85 Cel

Resistance:

Resistor Type:

Series:

RG3216(NP TC,WB TOL)

Size Code:

1206

Sub-Category:

Fixed Resistors

Technology:

METAL FILM

Temperature Coef (ppm/Cel):

10

Terminal Finish:

Matte Tin (Sn)

Terminal Shape:

WRAPAROUND

Tolerance:

Operating Voltage:

150 V

Trade Compliance

RG3216N-7503-B-T1 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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