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RG3216P-1103-B-T1

Susumu

RG3216P-1103-B-T1 by Susumu

Susumu's RG3216P-1103-B-T1 is a chip fixed resistor with 110000 ohm resistance, 0.1% tolerance, and 0.25 W power dissipation. Ideal for SMT applications in electronics due to its compact rectangular package design and high operating temperature range of -55 to 155 °C.

Median Price

$0.240

Lifecycle Status

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1k+

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Mouser Electronics

USA . 2,239 parts In-Stock

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$0.240

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$0.167

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$0.149

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$0.123

2,239

$0.240

$0.167

$0.149

$0.123

DigiKey

USA . 594 parts In-Stock

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$0.240

100+ parts

$0.166

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$0.149

10k+ parts

$0.129

594

$0.240

$0.166

$0.149

$0.129

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Vyrian

USA . 1,753 parts In-Stock

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Bristol Electronics

USA . 1,700 parts In-Stock

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Nova Conductors

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Corohmni

South Africa . 874 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,759 parts In-Stock

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Continental Prestige Electronics

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Aranea Global

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Argo Parts USA

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Overview

Discover the top-quality RG3216P-1103-B-T1 by Susumu, a leading manufacturer in the industry of fixed resistors. This chip resistor, with its metal film technology and superior construction, offers exceptional reliability and performance in various applications. With a wide operating temperature range and precise tolerance, this SMT package resistor provides unmatched value and benefits to customers seeking high-quality components for their electronic devices. Trust Susumu for quality you can count on.

Feature Benefit Bullets

Rated Temperature: 85 °C

With a rated temperature of 85 °C, this fixed resistor can operate effectively in a wide range of temperatures, making it suitable for various applications.

Technology: METAL FILM

The metal film technology used in this resistor provides high precision and stability in resistance values, ensuring accurate performance in circuits.

Resistance: 110000 ohm

With a resistance value of 110000 ohm, this resistor can handle high voltages and power dissipation while maintaining stable performance.

Operating Voltage: 150 V

The high operating voltage of 150 V makes this resistor suitable for use in circuits that require a higher voltage tolerance, ensuring reliable performance.

Tolerance: 0.1 %

The tight tolerance of 0.1 % ensures that this resistor provides accurate and consistent resistance values, making it ideal for precision applications.

Package Style (Meter): SMT

The surface mount package style allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Technical Specifications

Fixed Resistors RG3216P-1103-B-T1 attributes and parameters. Explore more Fixed Resistors devices from Susumu

Specs

Additional Features:

ULTRA PRECISION

Construction:

Chip

JESD-609 Code:

e3

Manufacturer Series:

RG

Mounting Type:

No. of Terminals:

2

Maximum Operating Temperature:

Minimum Operating Temperature:

-55 Cel

Height (Package):

.5 mm

Length (Package):

3.2 mm

Shape (Package):

RECTANGULAR PACKAGE

Package Style (Meter):

SMT

Width (Package):

1.6 mm

Packing Method:

TR

Rated Power Dissipation (P):

Rated Temperature:

85 Cel

Resistance:

Resistor Type:

Series:

RG3216(NP TC,WB TOL)

Size Code:

1206

Sub-Category:

Fixed Resistors

Technology:

METAL FILM

Temperature Coef (ppm/Cel):

25

Terminal Finish:

MATTE TIN

Terminal Shape:

WRAPAROUND

Tolerance:

Operating Voltage:

150 V

Trade Compliance

RG3216P-1103-B-T1 Resistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8533.21.00.30

SB

8533.21.00.45

Manufacturer Highlights

Susumu

As a specialist in thin film technology and resistors, we can turn your ideas into reality. Since our founding in 1964, we have pursued the originality of thin films through research into thin film technology and product development. A corporate culture that dedicates itself to commercialization in the face of difficulties, self-confidence cultivated through repeated basic research, and unique development capabilities enabled by experienced thin-film technology. This is the reason why Susumu is able to acquire a global position and trust. We have the ability to integrate organically while improving each technology. In particular, our thin film deposition technology is backed by our high level of basic research, and there are things that surpass our competitors. Thin film formation technology (plasma reaction method, sputtering, vacuum deposition method, etc.) Fine photo-etching technology (flat/curved surface etching) Microlaser technology (pattern generation, trimming, scribing, etc.) High-density packaging technology (BGA, ultra-small chips, etc.)

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