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VNP5N07

STMicroelectronics

VNP5N07 by STMicroelectronics

VNP5N07 by STMicroelectronics is a MOS technology peripheral driver with built-in protections for transient, over current, and over voltage. It has 3 terminals in a rectangular package style with matte tin finish. Ideal for applications requiring true output polarity and sink current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 10,507 parts In-Stock

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10,507

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Vyrian

USA . 2,720 parts In-Stock

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2,720

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Anansix

USA . 1,622 parts In-Stock

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1,622

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R&J Components

USA . 1,235 parts In-Stock

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1,235

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Digiode

USA . 624 parts In-Stock

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624

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ComSIT Distribution GmbH

Germany . 550 parts In-Stock

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550

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Goldney Electronics S.L.

Spain . 50 parts In-Stock

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50

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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20

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,709 parts In-Stock

1+ parts

$4.291

100+ parts

-

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$3.862

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1,709

$4.291

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$3.862

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Microchip USA

USA . 204 parts In-Stock

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$6.881

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204

$6.881

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MKK Technologies

India . 175 parts In-Stock

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$8.069

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175

$8.069

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DigiPath Technology Company

USA . 175 parts In-Stock

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$8.069

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$8.069

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AZTECH Wire

Italy . 1,157 parts In-Stock

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$8.640

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$8.640

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Kepictronics

USA . 13,000 parts In-Stock

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RC Electronics

USA . 9,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Parana Technologies

USA . 1,850 parts In-Stock

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$5.130

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$5.130

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Corphita

USA . 1,007 parts In-Stock

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Perfect Parts

USA . 45 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 20 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the VNP5N07 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics has crafted this high-quality peripheral driver with built-in protections for transient, over current, over voltage, and thermal issues. With a compact rectangular package style and matte tin finish, this product offers easy installation and reliable performance. Ideal for applications requiring open-drain output characteristics and true output polarity, the VNP5N07 provides customers with a cost-effective solution that delivers superior efficiency and functionality. Elevate your projects with the VNP5N07 and experience unparalleled value and benefits today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable applications.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The multiple built-in protections ensure safe operation of the peripheral driver and protect connected devices from damage due to various electrical faults.

No. of Terminals: 3

Having only 3 terminals simplifies the installation process and reduces the chances of wiring errors, making it user-friendly.

Output Characteristics: OPEN-DRAIN

The open-drain output allows for flexibility in interfacing with different types of circuits and devices, making it versatile for a variety of applications.

Turn-on Time: 0.25 us

The fast turn-on time of 0.25 us ensures quick response and minimal delay in driving connected peripherals, enhancing overall system performance.

Nominal Output Peak Current Limit: 5 A

With a peak output current limit of 5 A, the peripheral driver can handle high current loads, making it suitable for demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type allows for easy integration with other digital circuits, providing seamless communication between devices.

Output Current Flow Direction: SINK

The sink output current flow direction allows the peripheral driver to sink current from connected devices, ensuring proper operation and protection against overloading.

Technical Specifications

Peripheral Drivers VNP5N07 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

3

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

5 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Current:

.5 mA

Surface Mount:

NO

Technology:

MOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

SINGLE

Turn-off Time:

5 us

Turn-on Time:

.25 us

Trade Compliance

VNP5N07 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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