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VNH50N04

STMicroelectronics

VNH50N04 by STMicroelectronics

VNH50N04 by STMicroelectronics is a MOS peripheral driver with built-in protections for over current, thermal, and Zener clamp. It has a nominal output peak current limit of 50A, operates at 5V supply voltage, and features an open-drain output polarity. Ideal for applications requiring sink output current flow direction in automotive systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,712 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,712

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Anansix

USA . 2,764 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,764

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Vyrian

USA . 1,321 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,321

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,047 parts In-Stock

1+ parts

$5.730

100+ parts

-

1k+ parts

$5.157

10k+ parts

-

2,047

$5.730

-

$5.157

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MKK Technologies

India . 2,135 parts In-Stock

1+ parts

$10.774

100+ parts

-

1k+ parts

-

10k+ parts

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2,135

$10.774

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-

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DigiPath Technology Company

USA . 2,135 parts In-Stock

1+ parts

$10.774

100+ parts

-

1k+ parts

-

10k+ parts

-

2,135

$10.774

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-

-

Corphita

USA . 4,213 parts In-Stock

1+ parts

-

100+ parts

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4,213

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Parana Technologies

USA . 630 parts In-Stock

1+ parts

-

100+ parts

$6.851

1k+ parts

-

10k+ parts

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630

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$6.851

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Overview

Unlock the potential of your electronic devices with the VNH50N04 by STMicroelectronics. As a leading manufacturer in peripheral drivers, STMicroelectronics delivers top-quality products with built-in protections for over current, thermal, and zener clamp. Ideal for applications requiring high output peak currents, this rectangular package style flange mount device offers true output polarity and sink current flow direction. With its reliable technology and Schmitt trigger input characteristics, the VNH50N04 provides exceptional value and performance for your projects. Elevate your designs with STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight, durable, and resistant to heat, making it a reliable choice for various applications.

Built-in Protections: OVER CURRENT; THERMAL; ZENER CLAMP

The built-in protections ensure the safety and reliability of the peripheral driver by preventing damage from overcurrent, excessive heat, and voltage spikes.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage makes it compatible with a wide range of devices and systems, offering flexibility in application.

Output Polarity: TRUE

The true output polarity ensures accurate signal transfer, making it suitable for precision applications where signal integrity is crucial.

Maximum Supply Current: 0.5 mA

The low maximum supply current consumption of 0.5 mA helps in reducing energy consumption and heat generation, making it more energy-efficient.

Technical Specifications

Peripheral Drivers VNH50N04 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; ZENER CLAMP

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

3

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

50 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Current:

.5 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

MOS

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

VNH50N04 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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