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VNH5200AS-E

STMicroelectronics

VNH5200AS-E by STMicroelectronics

STMicroelectronics VNH5200AS-E is a 16-terminal peripheral driver with built-in protections for over voltage, thermal, and under voltage. It operates at a supply voltage range of 5.5V to 18V, with a nominal output peak current limit of 8A. Ideal for applications requiring a half bridge based peripheral driver with source and sink output current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,976 parts In-Stock

1+ parts

-

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5,976

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Digiode

USA . 4,161 parts In-Stock

1+ parts

-

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1k+ parts

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4,161

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Anansix

USA . 1,213 parts In-Stock

1+ parts

-

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1,213

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,035 parts In-Stock

1+ parts

$5.728

100+ parts

-

1k+ parts

$5.155

10k+ parts

-

1,035

$5.728

-

$5.155

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Microchip USA

USA . 312 parts In-Stock

1+ parts

$8.334

100+ parts

-

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312

$8.334

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MKK Technologies

India . 694 parts In-Stock

1+ parts

$10.771

100+ parts

-

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694

$10.771

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DigiPath Technology Company

USA . 694 parts In-Stock

1+ parts

$10.771

100+ parts

-

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694

$10.771

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AZTECH Wire

Italy . 732 parts In-Stock

1+ parts

$16.810

100+ parts

-

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732

$16.810

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Corphita

USA . 2,202 parts In-Stock

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2,202

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Parana Technologies

USA . 224 parts In-Stock

1+ parts

-

100+ parts

$6.849

1k+ parts

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224

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$6.849

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Overview

Discover the VNH5200AS-E by STMicroelectronics, a high-quality peripheral driver designed to deliver reliable performance and superior protection for your applications. With built-in safeguards against overvoltage, thermal issues, and undervoltage, this compact device offers peace of mind and efficiency in operation. Perfect for a wide range of uses, from automotive systems to industrial automation, the VNH5200AS-E provides unmatched value and benefits to customers seeking a dependable solution for their projects. Trust STMicroelectronics for innovative technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, ideal for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 18 V

With a high maximum supply voltage, this peripheral driver can handle various power requirements.

Built-in Protections: OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety of connected components by preventing damage from voltage spikes and overheating.

No. of Terminals: 16

Having 16 terminals allows for connection to multiple input and output devices, expanding the functionality of the driver.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact designs.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in usage.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in wiring connections, improving reliability.

Maximum Seated Height: 1.75 mm

The low seated height makes the product suitable for applications with tight space constraints.

Width: 3.9 mm

The compact width enables easy integration into densely populated circuit boards.

Length: 9.9 mm

The short length further contributes to space-saving design considerations.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and robust connections.

Nominal Supply Voltage: 13 V

The nominal supply voltage provides a standard operating range for consistent performance.

Terminal Pitch: 1.27 mm

The small terminal pitch enables high-density mounting and precise connections.

Nominal Output Peak Current Limit: 8 A

The high output peak current limit allows the driver to handle power-intensive devices with ease.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The half-bridge interface IC type offers efficient control for peripheral devices, making it suitable for various applications.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink current makes the driver versatile in controlling different types of loads effectively.

Technical Specifications

Peripheral Drivers VNH5200AS-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

VNH5200AS-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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