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VND5N0713TR

STMicroelectronics

VND5N0713TR by STMicroelectronics

VND5N0713TR by STMicroelectronics is a MOS technology peripheral driver with built-in protections for transient, over current, and over voltage. It has a nominal output peak current limit of 5A and operates with a max supply current of 0.5mA. This small outline package IC is ideal for applications requiring buffer or inverter based peripheral drivers.

Median Price

$0.531

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.531

-

-

-

Chip Stock

USA . 89,600 parts In-Stock

1+ parts

-

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-

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89,600

-

-

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Vyrian

USA . 8,937 parts In-Stock

1+ parts

-

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1k+ parts

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8,937

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-

-

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Next Level Components, LLC

USA . 2,500 parts In-Stock

1+ parts

-

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2,500

-

-

-

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Digiode

USA . 1,499 parts In-Stock

1+ parts

-

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1,499

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-

-

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Anansix

USA . 1,385 parts In-Stock

1+ parts

-

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1,385

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HZD GmbH

Germany . 375 parts In-Stock

1+ parts

-

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375

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,075 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

-

10k+ parts

$0.520

2,075

$0.531

-

-

$0.520

Argo Parts USA

USA . 1,993 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

-

10k+ parts

$0.515

1,993

$0.531

-

-

$0.515

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

$0.504

10k+ parts

$0.494

100

$0.531

-

$0.504

$0.494

AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$5.424

100+ parts

-

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596

$5.424

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IDEA Electronic Components Group

UK . 78 parts In-Stock

1+ parts

$6.640

100+ parts

-

1k+ parts

$5.976

10k+ parts

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78

$6.640

-

$5.976

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Microchip USA

USA . 262 parts In-Stock

1+ parts

$8.235

100+ parts

-

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262

$8.235

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Corohmni

South Africa . 281 parts In-Stock

1+ parts

$9.126

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281

$9.126

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Semicontronic

India . 798 parts In-Stock

1+ parts

$9.500

100+ parts

$9.262

1k+ parts

$9.215

10k+ parts

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798

$9.500

$9.262

$9.215

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Aztec Data Supply Inc.

USA . 249 parts In-Stock

1+ parts

$11.700

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249

$11.700

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MKK Technologies

India . 284 parts In-Stock

1+ parts

$12.485

100+ parts

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284

$12.485

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DigiPath Technology Company

USA . 284 parts In-Stock

1+ parts

$12.485

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284

$12.485

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Ampacity Inc.

Singapore . 1,355 parts In-Stock

1+ parts

$21.500

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1,355

$21.500

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Kepictronics

USA . 7,500 parts In-Stock

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7,500

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Infinite Electronics LLP (Excess)

. 6,696 parts In-Stock

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6,696

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Perfect Parts

USA . 2,750 parts In-Stock

1+ parts

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2,750

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Corphita

USA . 1,777 parts In-Stock

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1,777

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Parana Technologies

USA . 246 parts In-Stock

1+ parts

-

100+ parts

$7.939

1k+ parts

-

10k+ parts

-

246

-

$7.939

-

-

Overview

Unleash the power of cutting-edge technology with the VND5N0713TR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics has crafted this high-quality peripheral driver to deliver exceptional performance and reliability. Ideal for a wide range of applications, this product offers built-in protections against transient events, over current, over voltage, and thermal issues. With its compact design and advanced features, customers can expect seamless integration and enhanced functionality in their projects. Elevate your designs with the VND5N0713TR and experience the unmatched value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that provides protection and longevity to the peripheral driver.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Ensures the peripheral driver and connected components are safeguarded against potential damage from various electrical issues.

No. of Terminals: 2

Simplified design with only two terminals for easy installation and connection.

Technology: MOS

Utilizes Metal-Oxide-Semiconductor technology for efficient operation and high performance.

Technical Specifications

Peripheral Drivers VND5N0713TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

5 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.63 mm

Maximum Supply Current:

.5 mA

Surface Mount:

YES

Technology:

MOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

2.25 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

5 us

Turn-on Time:

.25 us

Width:

6.1 mm

Trade Compliance

VND5N0713TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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