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VND5E160MJ-E

STMicroelectronics

VND5E160MJ-E by STMicroelectronics

VND5E160MJ-E by STMicroelectronics is a compact peripheral driver with a max supply voltage of 28V and built-in protections against overcurrent, thermal issues, and transients. It features a low profile design with 12 terminals for efficient integration. Ideal for buffer or inverter applications, it ensures reliable performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,538 parts In-Stock

1+ parts

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8,538

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Digiode

USA . 3,079 parts In-Stock

1+ parts

-

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3,079

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Anansix

USA . 2,302 parts In-Stock

1+ parts

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2,302

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 275 parts In-Stock

1+ parts

$2.183

100+ parts

-

1k+ parts

-

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-

275

$2.183

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IDEA Electronic Components Group

UK . 148 parts In-Stock

1+ parts

$3.658

100+ parts

-

1k+ parts

$3.292

10k+ parts

-

148

$3.658

-

$3.292

-

MKK Technologies

India . 725 parts In-Stock

1+ parts

$6.878

100+ parts

-

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725

$6.878

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DigiPath Technology Company

USA . 725 parts In-Stock

1+ parts

$6.878

100+ parts

-

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10k+ parts

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725

$6.878

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-

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AZTECH Wire

Italy . 950 parts In-Stock

1+ parts

$11.020

100+ parts

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950

$11.020

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Corphita

USA . 1,378 parts In-Stock

1+ parts

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1,378

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Parana Technologies

USA . 713 parts In-Stock

1+ parts

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100+ parts

$4.374

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713

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$4.374

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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350

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Overview

Unlock unparalleled performance with the VND5E160MJ-E from STMicroelectronics, a leading name in innovation and reliability. This advanced peripheral driver is designed to elevate your applications, boasting built-in protections against transient spikes, overcurrent, and thermal overloads. With its compact design and surface-mount capabilities, it ensures seamless integration while providing exceptional value and efficiency, making it the ideal choice for any project demanding quality and robustness.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances reliability and longevity in various environments.

Surface Mount: YES

Surface mount capability allows for compact designs and easy integration into modern circuit boards.

Maximum Supply Voltage: 28 V

A high maximum supply voltage ensures versatility in different applications requiring varying power levels.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on the PCB, making it suitable for tight layouts.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protections enhance device safety and reliability, reducing the risk of failure in adverse conditions.

Power Supplies (V): 8/28

Supports a wide power supply range, accommodating a variety of applications and enabling flexible designs.

No. of Terminals: 12

With multiple terminals, it provides versatile connections for various components and functionalities.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

The low profile design is ideal for fitting into modern compact devices without compromising performance.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage broadens its usability in battery-powered and energy-efficient applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish ensures good solderability and corrosion resistance for reliable performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in layout and design, enabling easier PCB routing.

Maximum Seated Height: 1.62 mm

A low seated height helps in maintaining a compact profile, allowing for more efficient space usage.

Width: 3.9 mm

Narrow width contributes to space-saving designs, making it suitable for small electronics.

Maximum Time At Peak Reflow Temperature (s): 30

This moderate reflow time supports reliable soldering in high-volume manufacturing processes.

Peak Reflow Temperature °C: 260

A high peak temperature ensures compatibility with lead-free soldering processes often required by regulations.

Length: 4.9 mm

Compact length enhances versatility, making it ideal for various design requirements.

Technology: CMOS

CMOS technology provides low power consumption down to low leakage currents, adding efficiency to devices.

Terminal Form: GULL WING

The gull wing terminal form promotes easy assembly and is effective for reflow soldering techniques.

Nominal Supply Voltage: 13 V

A nominal voltage of 13 V positions it well within user-standard operational ranges, optimizing performance.

Turn-on Time: 10 us

Fast turn-on time enhances operational efficiency, allowing rapid response in applications.

Terminal Pitch: 0.8 mm

A narrow terminal pitch saves space on the PCB, beneficial for compact design layouts.

Driver No. of Bits: 2

Two-bit capability allows for more precise control, making it suitable for a range of digital applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, it is suitable for standard moisture-sensitive floor life preservation practices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface type ensures compatibility with various microcontrollers and peripheral devices, promoting design flexibility.

Turn-off Time: 15 us

Quick turn-off time contributes to efficient power usage and reactive performance in switching applications.

Output Current Flow Direction: SOURCE

The source output current capability allows for direct interfacing with various loads, simplifying design issues.

Technical Specifications

Peripheral Drivers VND5E160MJ-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

1.62 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

15 us

Turn-on Time:

10 us

Width:

3.9 mm

Trade Compliance

VND5E160MJ-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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