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VND5E050AJTR-E

STMicroelectronics

VND5E050AJTR-E by STMicroelectronics

VND5E050AJTR-E by STMicroelectronics is a compact peripheral driver with a max supply voltage of 28V and supports up to 2A output current. It features built-in protections against transient, overcurrent, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 49,674 parts In-Stock

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49,674

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Vyrian

USA . 3,853 parts In-Stock

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3,853

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Digiode

USA . 2,706 parts In-Stock

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2,706

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Anansix

USA . 1,526 parts In-Stock

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1,526

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R&J Components

USA . 250 parts In-Stock

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,462 parts In-Stock

1+ parts

$4.693

100+ parts

-

1k+ parts

$4.224

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1,462

$4.693

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$4.224

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Microchip USA

USA . 458 parts In-Stock

1+ parts

$8.404

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-

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458

$8.404

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MKK Technologies

India . 214 parts In-Stock

1+ parts

$8.825

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-

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214

$8.825

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DigiPath Technology Company

USA . 214 parts In-Stock

1+ parts

$8.825

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214

$8.825

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AZTECH Wire

Italy . 615 parts In-Stock

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$21.850

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615

$21.850

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QUARKTWIN TECHNOLOGY LTD

USA . 21,043 parts In-Stock

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21,043

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A-Z Elektronik GmbH

Germany . 7,268 parts In-Stock

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7,268

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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Perfect Parts

USA . 3,681 parts In-Stock

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3,681

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Metaverse IC Inc.

Canada . 2,769 parts In-Stock

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2,769

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Parana Technologies

USA . 1,494 parts In-Stock

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$5.611

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1,494

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$5.611

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Corphita

USA . 1,453 parts In-Stock

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1,453

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Kepictronics

USA . 300 parts In-Stock

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300

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Overview

Elevate your designs with the VND5E050AJTR-E from STMicroelectronics, a premier choice in peripheral drivers that ensures reliability and performance. With built-in protections against transient surges, overcurrent, and thermal issues, this compact, low-profile driver enhances safety while simplifying installation. Ideal for automotive and industrial applications, it delivers exceptional value and efficiency, empowering engineers to create robust, high-quality solutions with confidence. Transform your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robust protection against environmental factors, enhancing product longevity.

Surface Mount: YES

Surface mount capability allows for easy integration into modern circuit designs, saving space and facilitating automated assembly.

Maximum Supply Voltage: 28 V

A high maximum supply voltage enables versatility in application, allowing it to be used in varied electronic devices with different power requirements.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCB layouts, making it suitable for compact applications.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections safeguard the device and the connected circuits, enhancing reliability and reducing failure risks.

Power Supplies (V): 8/28

Support for a broad supply voltage range makes it adaptable for various designs and power requirements.

No. of Terminals: 12

Twelve terminals provide ample connectivity options, facilitating integration into complex circuits.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

This low-profile design is ideal for applications where space is at a premium, allowing for high-density circuit layouts.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage allows for compatibility with low-power devices, extending its usability across various applications.

Terminal Finish: TIN

Tin terminal finish promotes good solderability, ensuring reliable connections during the manufacturing process.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in PCB design, accommodating different layouts and configurations.

Maximum Seated Height: 1.62 mm

A compact seated height contributes to the overall slim profile, suitable for modern low-profile electronic devices.

Width: 3.9 mm

The narrow width aids in space-efficient circuit design, making it ideal for miniature and portable applications.

Maximum Time At Peak Reflow Temperature (s): 30

A defined peak reflow time ensures compatibility with standard soldering processes, enhancing manufacturability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables robust solder joints, ensuring long-term reliability under thermal stress.

Length: 4.9 mm

The compact length allows for effective use in tight spaces, accommodating modern miniaturization trends.

Maximum Output Current: 2 A

A maximum output current of 2 A ensures the driver can handle significant loads, beneficial for powering various peripherals.

Technology: CMOS

Using CMOS technology allows for low power consumption while maintaining high performance, making it energy-efficient.

Terminal Form: GULL WING

Gull-wing terminal form provides ease of handling and reliable solder joints, contributing to greater assembly efficiency.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V aligns well with typical system voltages, simplifying power design considerations.

Turn-on Time: 20 us

Fast turn-on time ensures swift response in electronic applications, suitable for high-speed data communication environments.

Terminal Pitch: 0.8 mm

The small terminal pitch accommodates high-density board designs, ideal for contemporary electronic devices.

Driver No. of Bits: 2

A 2-bit driver enables efficient control in applications requiring multi-bit data transfer, offering enhanced functionality.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product has moderate sensitivity to moisture, allowing for reliable use in various environments with proper handling.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This specification makes the product versatile in interfacing with different types of digital and analog signals, enhancing usability.

Turn-off Time: 45 us

A short turn-off time reduces switching delays, improving overall system performance in time-sensitive applications.

Output Current Flow Direction: SINK

The ability to sink current allows for effective routing of signals and drives, critical in many standard application scenarios.

Technical Specifications

Peripheral Drivers VND5E050AJTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Output Current Flow Direction:

SINK

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

1.62 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

45 us

Turn-on Time:

20 us

Width:

3.9 mm

Trade Compliance

VND5E050AJTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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