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VND5E050AJ-E

STMicroelectronics

VND5E050AJ-E by STMicroelectronics

VND5E050AJ-E by STMicroelectronics is a compact peripheral driver with a max supply voltage of 28V and supports output currents up to 2A. It features built-in protections against transient, overcurrent, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,280

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-

-

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Digiode

USA . 1,151 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,151

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-

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ComSIT Distribution GmbH

Germany . 1,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

1,107

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-

-

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Anansix

USA . 436 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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436

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 790 parts In-Stock

1+ parts

$3.020

100+ parts

-

1k+ parts

$2.718

10k+ parts

-

790

$3.020

-

$2.718

-

MKK Technologies

India . 815 parts In-Stock

1+ parts

$5.680

100+ parts

-

1k+ parts

-

10k+ parts

-

815

$5.680

-

-

-

DigiPath Technology Company

USA . 815 parts In-Stock

1+ parts

$5.680

100+ parts

-

1k+ parts

-

10k+ parts

-

815

$5.680

-

-

-

AZTECH Wire

Italy . 1,148 parts In-Stock

1+ parts

$11.640

100+ parts

-

1k+ parts

-

10k+ parts

-

1,148

$11.640

-

-

-

Microchip USA

USA . 120 parts In-Stock

1+ parts

$21.796

100+ parts

-

1k+ parts

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10k+ parts

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120

$21.796

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-

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Component Stockers USA

USA . 730 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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730

$99.990

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,000

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-

-

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Corphita

USA . 2,287 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,287

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-

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Parana Technologies

USA . 2,111 parts In-Stock

1+ parts

-

100+ parts

$3.611

1k+ parts

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10k+ parts

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2,111

-

$3.611

-

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iodParts Technologies Inc.

India . 8 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8

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Overview

Unlock unparalleled performance with the VND5E050AJ-E from STMicroelectronics, a leader in innovative semiconductor solutions. This compact peripheral driver not only ensures robust overcurrent and thermal protection but also thrives in diverse applications like automotive and industrial systems. Experience reliability and efficiency as you optimize your designs with a product built for excellence, delivering exceptional value and peace of mind. Choose quality; choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design, making it suitable for various applications.

Surface Mount: YES

Surface mount capability enables easier integration into compact circuit designs and enhances overall performance.

Maximum Supply Voltage: 28 V

A high maximum supply voltage allows for versatility in high-performance applications and compatibility with a wide range of devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCB layouts, allowing for better design flexibility.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protections ensure reliability and safety, safeguarding the device against various fault conditions.

Power Supplies (V): 8/28

Wide operating voltage range makes this peripheral driver suitable for diverse applications with varying power supply requirements.

No. of Terminals: 12

Having 12 terminals allows for more complex connections and interfacing within circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

This package design promotes effective thermal management while maximizing PCB space, enhancing overall system performance.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage expands compatibility with a wider range of power sources and battery-operated devices.

Terminal Finish: TIN

Tin terminal finishing enhances solderability and ensures reliable connections in assembly processes.

Terminal Position: DUAL

Dual terminal positioning supports better layout efficiency and improves signal integrity within the circuit.

Maximum Seated Height: 1.62 mm

The low profile height allows for compact designs, making it suitable for space-constrained applications.

Width: 3.9 mm

Narrow width is beneficial for small form factor designs, enabling tighter spacing on PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for a limited time ensures compatibility with modern soldering techniques.

Peak Reflow Temperature °C: 260

A high peak reflow temperature tolerance ensures reliability in mass production without compromising quality.

Length: 4.9 mm

Compact length supports higher density application layouts, particularly in portable or space-sensitive devices.

Maximum Output Current: 2 A

A maximum output current of 2 A provides strong drive capabilities for powering peripheral devices effectively.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, making it ideal for modern electronic devices.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and better mechanical stability on the PCB.

Nominal Supply Voltage: 13 V

Nominal supply voltage aligns with standard operational voltages, simplifying system design and integration.

Turn-on Time: 20 us

Fast turn-on time enables quick responsiveness in dynamic applications, enhancing device performance.

Terminal Pitch: 0.8 mm

A smaller terminal pitch allows for denser packing on PCBs, accommodating more connections in compact designs.

Driver No. of Bits: 2

With 2 bits, this driver can control two outputs, allowing for efficient signaling without consuming excessive space.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that appropriate handling and storage are necessary, making it suitable for various manufacturing environments.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed as a buffer or inverter-based driver, it enhances signal integrity across peripherals while providing necessary signal amplification.

Turn-off Time: 45 us

The relatively short turn-off time ensures optimal performance and faster reaction times in applications requiring quick state changes.

Output Current Flow Direction: SOURCE

The source output current flow direction allows for effective power distribution to connected devices, enhancing operational efficiency.

Technical Specifications

Peripheral Drivers VND5E050AJ-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G12

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Output Current Flow Direction:

SOURCE

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP12,.25,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

1.62 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

45 us

Turn-on Time:

20 us

Width:

3.9 mm

Trade Compliance

VND5E050AJ-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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