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VND5E025MK-E

STMicroelectronics

VND5E025MK-E by STMicroelectronics

VND5E025MK-E by STMicroelectronics is a CMOS peripheral driver with a max supply voltage of 28V and can handle output currents up to 10A. It features built-in protections against transient, overcurrent, thermal, and undervoltage conditions. Ideal for automotive and industrial applications, it comes in a compact SO-24 package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,289 parts In-Stock

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6,289

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Digiode

USA . 2,809 parts In-Stock

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2,809

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Anansix

USA . 1,410 parts In-Stock

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1,410

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ACDS - Activité Composants Distribution Service

France . 1,225 parts In-Stock

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1,225

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Distributors (Availability)

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Microchip USA

USA . 263 parts In-Stock

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$2.776

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263

$2.776

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IDEA Electronic Components Group

UK . 825 parts In-Stock

1+ parts

$11.515

100+ parts

-

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$10.363

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825

$11.515

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$10.363

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AZTECH Wire

Italy . 437 parts In-Stock

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$13.660

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437

$13.660

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MKK Technologies

India . 700 parts In-Stock

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$21.653

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700

$21.653

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DigiPath Technology Company

USA . 700 parts In-Stock

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$21.653

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700

$21.653

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Corphita

USA . 2,152 parts In-Stock

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2,152

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Parana Technologies

USA . 1,663 parts In-Stock

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$13.768

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1,663

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$13.768

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Perfect Parts

USA . 1,372 parts In-Stock

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1,372

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iodParts Technologies Inc.

India . 1,225 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,225 parts In-Stock

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Glotronic Ltd.

UK . 980 parts In-Stock

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980

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Kepictronics

USA . 110 parts In-Stock

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110

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Overview

Elevate your designs with the VND5E025MK-E from STMicroelectronics, a leader in innovative solutions. This premium peripheral driver ensures reliable performance with built-in protections against transient spikes, overcurrent, and thermal events, making it ideal for diverse applications ranging from automotive to industrial automation. Its compact design and robust features empower you to create efficient, high-quality systems that stand the test of time. Experience the advantage of ST's trusted expertise and bring your projects to life with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space and easier integration into compact devices.

Maximum Supply Voltage: 28 V

A high maximum supply voltage expands application possibilities and compatibility with diverse systems.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized design for easy placement and soldering on PCBs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Integrated protections enhance safety and reliability, minimizing the risk of damage from electrical surges.

Power Supplies (V): 8/28

Flexible operating voltage range supports versatility in design and adaptation across various applications.

No. of Terminals: 24

With 24 terminals, this product facilitates a comprehensive connection and integration within complex circuitry.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline package style is ideal for modern compact device designs, optimizing space without compromising performance.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage allows for operation in systems with limited power resources, enhancing compatibility.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish improves solderability and provides corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position aids in balancing thermal performance and enhances connection efficiency.

Maximum Seated Height: 2.47 mm

The low seated height ensures easy integration into low-profile applications and designs.

Width: 7.5 mm

Compact width contributes to space efficiency on the PCB, allowing for denser layouts in electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with industry standard reflow soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature support guarantees excellent soldering performance and reliability.

Length: 10.3 mm

A compact length suits high-density PCB layouts, making the product ideal for small electronic devices.

Maximum Output Current: 10 A

10 A output current capability enables the driver to control higher power loads, making it suitable for robust applications.

Technology: CMOS

CMOS technology allows for low power consumption and high-speed performance, enhancing energy efficiency.

Terminal Form: GULL WING

Gull wing type terminals facilitate reliable soldering and improve mechanical stability in the mounted state.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V optimizes performance for a variety of applications while maintaining efficiency.

Turn-on Time: 20 us

Fast turn-on time of 20 microseconds contributes to quicker response times in dynamic circuit applications.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch supports compact placements, making it suitable for modern miniaturized PCB designs.

Driver No. of Bits: 2

Having a 2-bit driver supports straightforward signal processing, enhancing efficiency in control applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates manageable moisture sensitivity, allowing for standard handling in assembly processes.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based design enables versatile signal handling for various peripheral driver tasks.

Turn-off Time: 40 us

A turn-off time of 40 microseconds allows for controlled signal disconnection, reducing risks of circuit instability.

Output Current Flow Direction: SOURCE

Output current that sources supports load driving capabilities, crucial for many peripheral applications.

Technical Specifications

Peripheral Drivers VND5E025MK-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Output Current Flow Direction:

SOURCE

Maximum Output Current:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

40 us

Turn-on Time:

20 us

Width:

7.5 mm

Trade Compliance

VND5E025MK-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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