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VND5E025LKTR-E

STMicroelectronics

VND5E025LKTR-E by STMicroelectronics

VND5E025LKTR-E by STMicroelectronics is a half-bridge peripheral driver with a max output current of 3 A, operating b/w 8-28 V. It features a compact 24-terminal SO package and supports surface mount applications. Ideal for driving motors and actuators in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,406 parts In-Stock

1+ parts

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5,406

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Digiode

USA . 2,008 parts In-Stock

1+ parts

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2,008

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Anansix

USA . 407 parts In-Stock

1+ parts

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407

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 403 parts In-Stock

1+ parts

$4.151

100+ parts

-

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403

$4.151

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AZTECH Wire

Italy . 541 parts In-Stock

1+ parts

$9.640

100+ parts

-

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541

$9.640

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IDEA Electronic Components Group

UK . 942 parts In-Stock

1+ parts

$11.409

100+ parts

-

1k+ parts

$10.268

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942

$11.409

-

$10.268

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MKK Technologies

India . 304 parts In-Stock

1+ parts

$21.454

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304

$21.454

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DigiPath Technology Company

USA . 304 parts In-Stock

1+ parts

$21.454

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304

$21.454

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Kepictronics

USA . 5,211 parts In-Stock

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5,211

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Corphita

USA . 3,098 parts In-Stock

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3,098

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A-Z Elektronik GmbH

Germany . 1,145 parts In-Stock

1+ parts

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1,145

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Futuretech Components

Singapore . 980 parts In-Stock

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980

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Parana Technologies

USA . 478 parts In-Stock

1+ parts

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$13.641

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478

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$13.641

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Overview

Elevate your projects with the VND5E025LKTR-E by STMicroelectronics, a premier choice in peripheral drivers. Crafted for reliability and performance, this compact solution supports a wide voltage range and delivers robust output without compromise. With STMicroelectronics' commitment to quality and innovation, you can trust this driver for applications demanding efficiency and durability. Unlock new possibilities and streamline your designs with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides excellent durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and enables automated assembly, reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape contributes to more efficient layout and organization on a PCB, optimizing space and connectivity.

Power Supplies (V): 8/28

Wide voltage range (8 to 28V) allows flexibility in design, accommodating a variety of power supply scenarios.

No. of Terminals: 24

A total of 24 terminals offers ample connectivity options for various input and output configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the compactness of designs, ideal for space-constrained applications.

Terminal Finish: MATTE TIN

Matte tin finish provides reliable solderability and good corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: DUAL

Dual terminal positioning improves accessibility and routing options on the PCB, enhancing overall design flexibility.

Maximum Time At Peak Reflow Temperature: 30s

A maximum reflow time of 30 seconds helps to ensure effective soldering processes during assembly while avoiding damage.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C is suitable for a variety of lead-free soldering processes, aligning with modern manufacturing requirements.

Maximum Output Current: 3 A

With a maximum output current of 3 A, this driver can effectively manage high power loads, suitable for demanding applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and stability, ensuring reliable connections on the PCB.

Terminal Pitch: 0.8 mm

An 0.8 mm terminal pitch optimizes space usage while maintaining manufacturability, making it compatible with modern PCB designs.

Driver No. of Bits: 2

Having 2 bits allows for controlling multiple devices with fewer resources, making it efficient for many applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 designation indicates moderate sensitivity to moisture, which is manageable with standard handling practices in electronics.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

This half bridge design allows for efficient control of motor drives and actuators, enhancing system performance.

Output Current Flow Direction: SINK

Supporting sink current flow allows for versatile configurations in driving applications, enabling efficient control of external loads.

Technical Specifications

Peripheral Drivers VND5E025LKTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Output Current Flow Direction:

SINK

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VND5E025LKTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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