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VND5E008MYTR-E

STMicroelectronics

VND5E008MYTR-E by STMicroelectronics

STMicroelectronics VND5E008MYTR-E is a peripheral driver with 36 terminals, offering built-in protections for transient, over current, and over voltage. It operates at supply voltages ranging from 4.5V to 28V and has a nominal output peak current limit of 76A. Ideal for applications requiring a half bridge based peripheral driver with sink output current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,228 parts In-Stock

1+ parts

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10,228

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Anansix

USA . 1,771 parts In-Stock

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1,771

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Digiode

USA . 81 parts In-Stock

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81

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,776 parts In-Stock

1+ parts

$5.953

100+ parts

-

1k+ parts

$5.358

10k+ parts

-

1,776

$5.953

-

$5.358

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MKK Technologies

India . 1,619 parts In-Stock

1+ parts

$11.195

100+ parts

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1,619

$11.195

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DigiPath Technology Company

USA . 1,619 parts In-Stock

1+ parts

$11.195

100+ parts

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1,619

$11.195

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Microchip USA

USA . 1,630 parts In-Stock

1+ parts

$17.080

100+ parts

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1,630

$17.080

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AZTECH Wire

Italy . 42 parts In-Stock

1+ parts

$18.020

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42

$18.020

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Component Stockers USA

USA . 524 parts In-Stock

1+ parts

$99.990

100+ parts

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524

$99.990

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 2,682 parts In-Stock

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2,682

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Corphita

USA . 2,110 parts In-Stock

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2,110

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Parana Technologies

USA . 1,339 parts In-Stock

1+ parts

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100+ parts

$7.118

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1,339

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$7.118

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Overview

Unleash the power of innovation with the VND5E008MYTR-E from STMicroelectronics, a leading manufacturer known for its top-quality products. Designed for a wide range of applications in the peripheral drivers category, this product offers built-in protections against transient events and various faults, ensuring reliable performance. With a wide supply voltage range and high output current capability, this versatile driver provides exceptional value and benefits to customers looking for a robust solution for their electronic designs. Say goodbye to limitations and hello to endless possibilities with the VND5E008MYTR-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and reliability of the peripheral driver.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 28 V

With a maximum supply voltage of 28V, this peripheral driver can handle a wide range of power requirements.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The multiple built-in protections ensure the safety and longevity of connected devices by preventing damage from various electrical faults.

Power Supplies (V): 8/28

The multiple power supply options make this peripheral driver versatile and compatible with various system requirements.

No. of Terminals: 36

The high number of terminals allows for connectivity with multiple components, increasing the flexibility of the peripheral driver.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The compact and efficient package style with heat sink/slub and shrink pitch design enhances thermal management and overall performance.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources, making this peripheral driver versatile.

Terminal Position: DUAL

Dual terminal position provides redundancy and enhances the stability of connections for improved reliability.

Maximum Seated Height: 2.47 mm

The compact maximum seated height allows for space-saving installation in tight areas or densely populated PCBs.

Width: 7.5 mm

The narrow width makes this peripheral driver suitable for applications with limited space availability.

Length: 10.3 mm

The compact length ensures a small footprint, ideal for compact electronic devices or systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections, ensuring long-term reliability under harsh operating conditions.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V provides a stable operating range for the peripheral driver, ensuring consistent performance.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting, enabling efficient use of PCB space and component placement.

Driver No. of Bits: 2

The 2-bit driver configuration provides precise control over connected peripherals, enabling accurate and efficient operation.

Nominal Output Peak Current Limit: 76 A

The high nominal output peak current limit of 76A allows for driving power-hungry components with ease, making this peripheral driver versatile and capable.

Interface IC Type: HALF BRIDGE BASED PERIPHERAL DRIVER

The use of a half bridge-based interface IC type ensures efficient power handling and control, enhancing the overall performance of the connected peripherals.

Output Current Flow Direction: SINK

The sink output current flow direction enables efficient handling of current flow, ensuring proper operation of the connected peripherals.

Technical Specifications

Peripheral Drivers VND5E008MYTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G36

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

36

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

76 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

VND5E008MYTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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