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VND5004BSP30-E

STMicroelectronics

VND5004BSP30-E by STMicroelectronics

VND5004BSP30-E by STMicroelectronics is a versatile peripheral driver with a max output current of 15 A and supports power supplies from 8 to 24 V. It features a compact rectangular package with 30 terminals and operates at peak reflow temps of 250 °C. Ideal for buffer or inverter applications, it ensures efficient performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,285

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-

-

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Digiode

USA . 1,936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,936

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-

-

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Anansix

USA . 166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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166

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,257 parts In-Stock

1+ parts

$6.020

100+ parts

-

1k+ parts

$5.418

10k+ parts

-

1,257

$6.020

-

$5.418

-

Microchip USA

USA . 2,726 parts In-Stock

1+ parts

$6.817

100+ parts

-

1k+ parts

-

10k+ parts

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2,726

$6.817

-

-

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AZTECH Wire

Italy . 1,128 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

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10k+ parts

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1,128

$10.000

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-

-

MKK Technologies

India . 1,057 parts In-Stock

1+ parts

$11.321

100+ parts

-

1k+ parts

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10k+ parts

-

1,057

$11.321

-

-

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DigiPath Technology Company

USA . 1,057 parts In-Stock

1+ parts

$11.321

100+ parts

-

1k+ parts

-

10k+ parts

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1,057

$11.321

-

-

-

Component Stockers USA

USA . 265 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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265

$99.990

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 29,498 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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29,498

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Corphita

USA . 4,867 parts In-Stock

1+ parts

-

100+ parts

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4,867

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-

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Parana Technologies

USA . 1,344 parts In-Stock

1+ parts

-

100+ parts

$7.198

1k+ parts

-

10k+ parts

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1,344

-

$7.198

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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350

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Overview

Elevate your projects with the VND5004BSP30-E from STMicroelectronics, a leader in innovation and quality. Designed for optimal performance in peripheral driving applications, this versatile component seamlessly integrates into various designs, offering reliability and efficiency. With a compact size and robust output capabilities, it ensures smooth operations in demanding environments. Trust in STMicroelectronics for unparalleled support and cutting-edge technology that empowers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology minimizes space requirements, allowing for compact designs and easier integration into modern electronic devices.

Package Shape: RECTANGULAR

A rectangular package shape optimizes PCB layout, enabling better thermal management and efficient use of board space.

Power Supplies (V): 8/24

The versatility in power supply options (8V to 24V) allows for flexible adoption in a variety of applications, accommodating diverse system needs.

No. of Terminals: 30

With 30 terminals, this device can support multiple connections, facilitating complex circuit designs and numerous functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is optimal for high-density applications where space is limited, ensuring efficient use of PCB real estate.

Terminal Finish: MATTE TIN

Matte tin terminal finishing improves solderability and enhances long-term reliability, ensuring stable electrical connections.

Terminal Position: DUAL

Dual terminal positioning supports efficient use of space on the PCB and enhances routing options for interconnections.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with modern soldering techniques, preserving component integrity.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C indicates robust thermal performance, suitable for high-temperature environments.

Maximum Output Current: 15 A

A maximum output current rating of 15A allows for driving higher loads, making it ideal for substantial applications requiring strong outputs.

Terminal Form: GULL WING

Gull wing terminal form supports easy handling and assures good solder joint reliability, contributing to robust assembly.

Terminal Pitch: 1 mm

The 1 mm terminal pitch is advantageous for high-density applications, providing compact layout options without compromising performance.

Driver No. of Bits: 2

Having a 2-bit driver allows for simple control and integration, suitable for straightforward digital signaling in peripheral applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates adequate handling and packaging requirements, ensuring reliability and performance longevity in humid environments.

Nominal Output Peak Current Limit: 100 A

A nominal output peak current limit of 100A allows for handling surges in demanding applications, ensuring robust performance under load.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface IC type provides flexibility in application, effectively interfacing with various electronic components.

Output Current Flow Direction: SINK

The capability of sinking output current simplifies circuit designs, making it easier to control devices and manage connections.

Technical Specifications

Peripheral Drivers VND5004BSP30-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

30

Output Current Flow Direction:

SINK

Maximum Output Current:

15 A

Nominal Output Peak Current Limit:

100 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP30,.75,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VND5004BSP30-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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