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VND5004B-E

STMicroelectronics

VND5004B-E by STMicroelectronics

VND5004B-E by STMicroelectronics is a robust peripheral driver with a max output current of 15 A and supports power supplies from 8 to 24 V. Its quad terminal design ensures efficient performance in compact applications. Ideal for buffer or inverter-based systems, it features a moisture sensitivity level of 3.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,727 parts In-Stock

1+ parts

-

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5,727

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Digiode

USA . 3,586 parts In-Stock

1+ parts

-

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1k+ parts

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3,586

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Anansix

USA . 582 parts In-Stock

1+ parts

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582

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,688 parts In-Stock

1+ parts

$7.737

100+ parts

-

1k+ parts

$6.963

10k+ parts

-

1,688

$7.737

-

$6.963

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AZTECH Wire

Italy . 1,052 parts In-Stock

1+ parts

$12.830

100+ parts

-

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1,052

$12.830

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MKK Technologies

India . 995 parts In-Stock

1+ parts

$14.549

100+ parts

-

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995

$14.549

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DigiPath Technology Company

USA . 995 parts In-Stock

1+ parts

$14.549

100+ parts

-

1k+ parts

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10k+ parts

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995

$14.549

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 16,671 parts In-Stock

1+ parts

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16,671

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Microchip USA

USA . 4,484 parts In-Stock

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4,484

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Corphita

USA . 1,075 parts In-Stock

1+ parts

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1,075

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Parana Technologies

USA . 205 parts In-Stock

1+ parts

-

100+ parts

$9.251

1k+ parts

-

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205

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$9.251

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Overview

Unlock new possibilities with the VND5004B-E from STMicroelectronics, a premier choice for peripheral driving solutions. Engineered for reliability and performance, this compact driver excels in demanding applications, ensuring seamless operation across various devices. Trust in STMicroelectronics' renowned expertise to enhance your projects, delivering exceptional power management and efficiency that boosts productivity and innovation. Experience unparalleled value with VND5004B-E!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy allows for a lightweight and durable construction, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology enhances the compactness of the design while ensuring improved electrical performance and assembly efficiency.

Package Shape: SQUARE

The square package shape facilitates efficient use of PCB space and optimized electrical characteristics.

Power Supplies (V): 8/24

Flexible power supply options make this driver versatile and compatible with a wide range of systems.

No. of Terminals: 16

With 16 terminals, this driver supports complex configurations and multiple connections, enhancing its utility for various applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers excellent thermal performance and is ideal for high-speed applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable long-term performance.

Terminal Position: QUAD

Quad terminal positioning enhances layout flexibility on PCBs, making design integration easier.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds helps prevent heat damage to sensitive components, ensuring reliability in assembly.

Peak Reflow Temperature: 260 °C

High peak reflow temperature enables compatibility with various solder materials, facilitating robust product assembly.

Maximum Output Current: 15 A

With a maximum output current of 15 A, this driver is suitable for applications that require substantial current handling capabilities.

Terminal Form: NO LEAD

No lead terminal form contributes to reduced PCB space and enhanced performance in high-frequency applications.

Driver No. of Bits: 2

The 2-bit driver interface allows for efficient data processing and control in peripheral driver applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates good resistance to moisture and supports reliable operation in various environments.

Nominal Output Peak Current Limit: 100 A

A peak current limit of 100 A provides a significant margin for high-demand operations, ensuring the driver can handle sudden load changes.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based design enhances signal integrity and ensures reliable communication with connected components.

Output Current Flow Direction: SINK

The sink current flow direction offers compatibility with various load types, making this driver adaptable for different applications.

Technical Specifications

Peripheral Drivers VND5004B-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

2

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Output Current Flow Direction:

SINK

Maximum Output Current:

15 A

Nominal Output Peak Current Limit:

100 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/24

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

VND5004B-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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