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VND3NV04-E

STMicroelectronics

VND3NV04-E by STMicroelectronics

VND3NV04-E by STMicroelectronics is a compact peripheral driver with built-in protections against transient, overcurrent, and thermal issues. It supports a nominal output peak current of 5 A and features a fast turn-on time of 1.35 µs. Ideal for buffer or inverter applications, it ensures reliable performance in various electronic systems.

Median Price

$1.110

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 691 parts In-Stock

1+ parts

-

100+ parts

$1.110

1k+ parts

$1.050

10k+ parts

-

691

-

$1.110

$1.050

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,721 parts In-Stock

1+ parts

$1.197

100+ parts

-

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-

10k+ parts

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4,721

$1.197

-

-

-

Chip Stock

USA . 52,500 parts In-Stock

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52,500

-

-

-

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Vyrian

USA . 4,820 parts In-Stock

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-

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4,820

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-

-

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Sensible Micro Corp

USA . 3,021 parts In-Stock

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-

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3,021

-

-

-

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IBS Electronics

USA . 816 parts In-Stock

1+ parts

-

100+ parts

$1.430

1k+ parts

$1.365

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-

816

-

$1.430

$1.365

-

Anansix

USA . 390 parts In-Stock

1+ parts

-

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-

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390

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Bas Electronics GmbH & Co. KG

Germany . 108 parts In-Stock

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108

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 690 parts In-Stock

1+ parts

$1.134

100+ parts

-

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-

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-

690

$1.134

-

-

-

IDEA Electronic Components Group

UK . 1,959 parts In-Stock

1+ parts

$7.875

100+ parts

-

1k+ parts

$7.088

10k+ parts

-

1,959

$7.875

-

$7.088

-

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$9.407

100+ parts

$8.560

1k+ parts

$7.714

10k+ parts

-

450

$9.407

$8.560

$7.714

-

AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$9.710

100+ parts

-

1k+ parts

-

10k+ parts

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472

$9.710

-

-

-

MKK Technologies

India . 1,824 parts In-Stock

1+ parts

$14.809

100+ parts

-

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-

10k+ parts

-

1,824

$14.809

-

-

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DigiPath Technology Company

USA . 1,824 parts In-Stock

1+ parts

$14.809

100+ parts

-

1k+ parts

-

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1,824

$14.809

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-

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

1+ parts

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56,986

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Perfect Parts

USA . 19,832 parts In-Stock

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19,832

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QUARKTWIN TECHNOLOGY LTD

USA . 7,308 parts In-Stock

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7,308

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A-Z Elektronik GmbH

Germany . 6,054 parts In-Stock

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6,054

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-

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RC Electronics

USA . 5,740 parts In-Stock

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5,740

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Microchip USA

USA . 5,406 parts In-Stock

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5,406

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 2,180 parts In-Stock

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2,180

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Parana Technologies

USA . 1,100 parts In-Stock

1+ parts

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100+ parts

$9.416

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1,100

-

$9.416

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Eastek

USA . 1,050 parts In-Stock

1+ parts

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1,050

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-

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GreenTree Electronics

Israel . 1,050 parts In-Stock

1+ parts

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1,050

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Overview

Elevate your projects with the VND3NV04-E from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This compact peripheral driver combines robust built-in protections against transients, overcurrent, and thermal events, ensuring reliable performance in demanding environments. Ideal for automotive, industrial, and consumer applications, it delivers exceptional value with effortless integration and enhanced system stability, empowering you to achieve your design goals with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body offers durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount enhances design flexibility and reduces space on the PCB, facilitating easy integration into compact devices.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and optimal placement in electronic layouts.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

Having multiple built-in protections ensures reliability and safety, reducing the risk of damage under varying conditions.

No. of Terminals: 2

A simple 2-terminal design allows for easy connection and installation, making it user-friendly for engineers.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications with limited space, promoting compact product designs.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: SINGLE

Single terminal positioning simplifies circuit layout and reduces potential connection errors.

Maximum Seated Height: 2.63 mm

A maximum seated height of 2.63 mm allows for flexibility in low-profile device designs.

Width: 6.1 mm

A width of 6.1 mm helps in fitting the driver in narrow spaces while maintaining performance integrity.

Maximum Time At Peak Reflow Temperature (s): 30

A reflow time of 30 seconds ensures proper solder flow during installation, improving reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C allows compatibility with high-performance soldering techniques.

Length: 6.5 mm

The length of 6.5 mm enables efficient space utilization in a tight layout without sacrificing performance.

Terminal Form: GULL WING

Gull wing terminals offer reliable surface mount connections, enhancing solder joint reliability.

Turn-on Time: 1.35 us

A fast turn-on time of 1.35 microseconds ensures quick response, making it suitable for high-speed applications.

Terminal Pitch: 2.28 mm

A terminal pitch of 2.28 mm allows for compatibility with various PCB layouts and designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, providing sufficient handling and storage instructions for reliability.

Nominal Output Peak Current Limit: 5 A

The capability to handle a nominal output peak current of 5 A ensures the driver can effectively manage significant loads.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based peripheral driver makes it versatile for various interfacing needs in electronic circuits.

Turn-off Time: 10 us

A turn-off time of 10 microseconds allows for efficient power management and fast circuit response.

Output Current Flow Direction: SINK

As a sink driver, it provides effective current management in a circuit, enhancing overall system performance.

Technical Specifications

Peripheral Drivers VND3NV04-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

2

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.63 mm

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.28 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

10 us

Turn-on Time:

1.35 us

Width:

6.1 mm

Trade Compliance

VND3NV04-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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