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VND3NV04-1

STMicroelectronics

VND3NV04-1 by STMicroelectronics

VND3NV04-1 by STMicroelectronics is a 3-terminal peripheral driver with built-in protections for transient, over current, and over voltage. It has a nominal output peak current limit of 5A and turn-on time of 1.35us. Ideal for applications requiring buffer or inverter based interface ICs in compact spaces due to its small dimensions and sink output current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,608 parts In-Stock

1+ parts

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6,608

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Digiode

USA . 4,038 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,038

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Anansix

USA . 2,821 parts In-Stock

1+ parts

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2,821

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 281 parts In-Stock

1+ parts

$2.847

100+ parts

-

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281

$2.847

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IDEA Electronic Components Group

UK . 2,214 parts In-Stock

1+ parts

$6.136

100+ parts

-

1k+ parts

$5.523

10k+ parts

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2,214

$6.136

-

$5.523

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AZTECH Wire

Italy . 854 parts In-Stock

1+ parts

$8.810

100+ parts

-

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854

$8.810

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MKK Technologies

India . 1,883 parts In-Stock

1+ parts

$11.539

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1,883

$11.539

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DigiPath Technology Company

USA . 1,883 parts In-Stock

1+ parts

$11.539

100+ parts

-

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1,883

$11.539

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Corphita

USA . 4,883 parts In-Stock

1+ parts

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4,883

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Parana Technologies

USA . 1,162 parts In-Stock

1+ parts

-

100+ parts

$7.337

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1,162

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$7.337

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Overview

Unlock the power of innovation with the VND3NV04-1 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics offers top-notch quality and reliability. This peripheral driver is built for excellence, featuring built-in protections for transient, over current, over voltage, and thermal events. With its compact design and high-performance capabilities, the VND3NV04-1 is perfect for a wide range of applications. Experience the value and benefits this product brings to your projects, providing seamless operation and peace of mind. Elevate your designs with the VND3NV04-1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

The built-in protections ensure the safety and longevity of the peripheral driver by safeguarding against various types of electrical faults.

Width: 2.4 mm

The compact width of 2.4 mm allows for easy integration into tight spaces or densely populated circuit boards.

Peak Reflow Temperature °C: 225

With a peak reflow temperature of 225 °C, this peripheral driver can withstand high-temperature soldering processes during assembly.

Nominal Output Peak Current Limit: 5 A

The high nominal output peak current limit of 5 A allows the peripheral driver to handle demanding loads without overheating or malfunctioning.

Technical Specifications

Peripheral Drivers VND3NV04-1 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

JESD-30 Code:

R-PSIP-T3

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

3

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

225

Qualification:

Not Qualified

Maximum Seated Height:

6.1 mm

Surface Mount:

NO

Terminal Form:

Terminal Pitch:

2.25 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

10 us

Turn-on Time:

1.35 us

Width:

2.4 mm

Trade Compliance

VND3NV04-1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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