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VN750-12-E

STMicroelectronics

VN750-12-E by STMicroelectronics

STMicroelectronics' VN750-12-E is a peripheral driver with 36V max supply voltage, 2A max output current, and built-in protections. Ideal for applications requiring sink output current flow direction, such as buffer or inverter-based interface ICs. Package style: flange mount, terminals: 5, pitch: 1.7mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,347

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-

-

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Digiode

USA . 1,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,631

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Anansix

USA . 1,535 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,535

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 499 parts In-Stock

1+ parts

$2.553

100+ parts

-

1k+ parts

-

10k+ parts

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499

$2.553

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-

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IDEA Electronic Components Group

UK . 1,356 parts In-Stock

1+ parts

$11.916

100+ parts

-

1k+ parts

$10.724

10k+ parts

-

1,356

$11.916

-

$10.724

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AZTECH Wire

Italy . 1,002 parts In-Stock

1+ parts

$19.480

100+ parts

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1,002

$19.480

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MKK Technologies

India . 979 parts In-Stock

1+ parts

$22.407

100+ parts

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979

$22.407

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DigiPath Technology Company

USA . 979 parts In-Stock

1+ parts

$22.407

100+ parts

-

1k+ parts

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10k+ parts

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979

$22.407

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-

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Corphita

USA . 4,046 parts In-Stock

1+ parts

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4,046

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Parana Technologies

USA . 2,147 parts In-Stock

1+ parts

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100+ parts

$14.247

1k+ parts

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2,147

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$14.247

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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100+ parts

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350

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Overview

Upgrade your electronic designs with the VN750-12-E from STMicroelectronics, a leading manufacturer known for its high-quality components. As a peripheral driver with built-in protections against various hazards, this product offers unmatched reliability and safety. With a wide range of applications, from automotive to industrial systems, the VN750-12-E provides exceptional value and performance to customers seeking efficient power management solutions. Trust STMicroelectronics to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Maximum Supply Voltage: 36 V

Provides flexibility and compatibility with a wide range of power sources, ensuring the peripheral driver can be used in various applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy installation and integration into existing systems or setups.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Multiple built-in protections ensure the safety and reliability of the peripheral driver, protecting it from potential damage or malfunctions.

Power Supplies (V): 8/36

Supports a wide range of input power supplies, making it suitable for various voltage requirements in different applications.

No. of Terminals: 5

Simplifies the wiring and connection process, providing a straightforward setup for users.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure mounting and installation options in different systems or environments.

Minimum Supply Voltage: 5.5 V

Allows for operation with lower power supply voltages, offering flexibility in power source selection.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good conductivity and corrosion resistance, maintaining signal integrity and longevity of the peripheral driver.

Terminal Position: SINGLE

Single terminal position simplifies connection and reduces the risk of wiring errors, improving overall usability.

Maximum Output Current: 2 A

High maximum output current capability supports driving various peripherals or components, making it a versatile choice for different applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure mounting and soldering options, ensuring reliable connections in the system.

Nominal Supply Voltage: 13 V

Nominal supply voltage provides a standard operating voltage level, making it easy to integrate the peripheral driver into existing systems.

Terminal Pitch: 1.7 mm

Close terminal pitch allows for compact design and efficient use of space in the system, especially in crowded or limited-space environments.

Nominal Output Peak Current Limit: 9 A

High peak output current limit ensures the peripheral driver can handle short-term peak loads without issues, enhancing overall performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Buffer or inverter based interface IC type offers flexibility in driving peripherals with different signal requirements, making it a versatile choice for various applications.

Output Current Flow Direction: SINK

Sink output current flow direction ensures compatibility with components or peripherals that require sinking current, improving overall system compatibility.

Technical Specifications

Peripheral Drivers VN750-12-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-XSFM-T5

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

5

Output Current Flow Direction:

SINK

Maximum Output Current:

2 A

Nominal Output Peak Current Limit:

9 A

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

SIP5,.1,67TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

8/36

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Trade Compliance

VN750-12-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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