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VN5E016AH-E

STMicroelectronics

VN5E016AH-E by STMicroelectronics

STMicroelectronics VN5E016AH-E is a MOSFET gate driver with 7 terminals and small outline package. It operates at supply voltages b/w 4.5V to 28V, delivering a peak output current of 73A. Ideal for high side driving applications, it features a max seated height of 2.4mm and matte tin terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,544 parts In-Stock

1+ parts

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4,544

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Anansix

USA . 2,663 parts In-Stock

1+ parts

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2,663

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Digiode

USA . 644 parts In-Stock

1+ parts

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644

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Nova Conductors

Japan . 27 parts In-Stock

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27

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 58 parts In-Stock

1+ parts

$3.327

100+ parts

-

1k+ parts

$2.994

10k+ parts

-

58

$3.327

-

$2.994

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MKK Technologies

India . 2,077 parts In-Stock

1+ parts

$6.256

100+ parts

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2,077

$6.256

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DigiPath Technology Company

USA . 2,077 parts In-Stock

1+ parts

$6.256

100+ parts

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2,077

$6.256

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AZTECH Wire

Italy . 306 parts In-Stock

1+ parts

$8.288

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306

$8.288

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Ampacity Inc.

Singapore . 367 parts In-Stock

1+ parts

$21.500

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367

$21.500

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Microchip USA

USA . 1,852 parts In-Stock

1+ parts

$25.995

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1,852

$25.995

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Corphita

USA . 3,610 parts In-Stock

1+ parts

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3,610

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Lixinc

USA . 2,639 parts In-Stock

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2,639

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Parana Technologies

USA . 1,882 parts In-Stock

1+ parts

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100+ parts

$3.978

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1,882

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$3.978

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock the potential of your electronic designs with the VN5E016AH-E by STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics brings you a high-quality MOSFET Gate Driver that offers unparalleled performance and reliability. With its compact design and versatile applications, this product provides value and benefits to customers looking for efficient power management solutions. Trust STMicroelectronics to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers durability and resistance to environmental factors, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, reducing assembly time and costs.

Maximum Supply Voltage: 28 V

High maximum supply voltage allows for compatibility with a wide range of power supply configurations.

Package Shape: RECTANGULAR

Rectangular package shape enables compact and efficient PCB layout, saving valuable board space.

Power Supplies (V): 8/28

Support for multiple power supply voltages provides flexibility in design and application usage.

No. of Terminals: 7

Sufficient number of terminals for easy connectivity and integration within a circuit.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

Small outline package with heat sink/slug design helps in heat dissipation and thermal management, ensuring reliable performance.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage allows for operation in systems with lower power supply levels, enhancing versatility.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides excellent solderability and corrosion resistance, ensuring secure connections and long-term reliability.

Terminal Position: SINGLE

Single terminal position simplifies installation and wiring, reducing assembly complexity.

Maximum Seated Height: 2.4 mm

Low seated height allows for compact design and efficient use of space in electronic devices.

Width: 6.1 mm

Narrow width facilitates easy integration into tight spaces on PCBs, enhancing overall system design flexibility.

High Side Driver: YES

High side driver capability enables efficient control and management of power distribution in electronic systems.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliability during manufacturing processes and maintains product integrity.

Terminal Form: GULL WING

Gull wing terminal form offers robust mechanical strength and easy handling during assembly, contributing to overall product durability.

Nominal Supply Voltage: 13 V

Optimal nominal supply voltage for consistent and stable operation in a variety of applications.

Terminal Pitch: 0.85 mm

Narrow terminal pitch allows for high-density mounting on PCBs, maximizing board space utilization.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates robust moisture resistance, making the product suitable for a wide range of environments.

Nominal Output Peak Current Limit: 73 A

High nominal output peak current limit enables efficient and reliable operation in demanding electrical systems.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Versatile interface IC type allows for flexible control and customization based on specific application requirements.

Technical Specifications

MOSFET Gate Drivers VN5E016AH-E attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

1

High Side Driver:

YES

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

7

Nominal Output Peak Current Limit:

73 A

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP7H,.4,34TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

8/28

Qualification:

Not Qualified

Maximum Seated Height:

2.4 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

28 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.85 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

VN5E016AH-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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