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VB921ZV

STMicroelectronics

VB921ZV by STMicroelectronics

STMicroelectronics' VB921ZV is a peripheral driver with 5.5V max supply voltage, 7A output peak current limit, and sink flow direction. It is ideal for buffer or inverter-based applications requiring transient and overcurrent protection in a rectangular package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,469

-

-

-

-

Digiode

USA . 3,453 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,453

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-

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Anansix

USA . 76 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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76

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,047 parts In-Stock

1+ parts

$2.106

100+ parts

-

1k+ parts

$1.895

10k+ parts

-

2,047

$2.106

-

$1.895

-

MKK Technologies

India . 751 parts In-Stock

1+ parts

$3.960

100+ parts

-

1k+ parts

-

10k+ parts

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751

$3.960

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DigiPath Technology Company

USA . 751 parts In-Stock

1+ parts

$3.960

100+ parts

-

1k+ parts

-

10k+ parts

-

751

$3.960

-

-

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Corphita

USA . 4,752 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,752

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-

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Parana Technologies

USA . 1,670 parts In-Stock

1+ parts

-

100+ parts

$2.518

1k+ parts

-

10k+ parts

-

1,670

-

$2.518

-

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Overview

Elevate your electronic projects with the VB921ZV by STMicroelectronics, a high-quality peripheral driver designed to deliver exceptional performance and reliability. Manufactured by industry leader STMicroelectronics, this versatile component offers built-in protections against transients and overcurrents, ensuring peace of mind for your applications. Ideal for a wide range of uses, from automotive electronics to industrial automation, the VB921ZV provides outstanding value and benefits to customers seeking a dependable solution for their design needs. Upgrade your projects today with the VB921ZV and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for compatibility with a wide range of systems and devices.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to mount and integrate into different configurations.

Built-in Protections: TRANSIENT; OVER CURRENT

The built-in protections ensure the longevity and safety of the connected devices by preventing damage from transient surges and over-current situations.

No. of Terminals: 3

With three terminals, the product offers simplicity in connectivity and installation.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides stability and ease of mounting in various applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient operation even in low power scenarios.

Output Characteristics: OPEN-COLLECTOR

The open-collector output characteristics allow for easy interfacing with other components and devices.

Terminal Finish: TIN LEAD

The terminal finish of tin lead provides good conductivity and reliability in connections.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection processes.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers secure and stable connections during use.

Input Characteristics: STANDARD

With standard input characteristics, the product is compatible with a wide range of systems and devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures reliable and stable operation in various applications.

Nominal Output Peak Current Limit: 7 A

The nominal output peak current limit of 7A allows for handling high current loads effectively.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver offers flexibility and compatibility in different circuits and applications.

Output Current Flow Direction: SINK

The output current flow direction of sink ensures efficient operation for driving external devices or components.

Technical Specifications

Peripheral Drivers VB921ZV attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT

Input Characteristics:

STANDARD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

3

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

7 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

VB921ZV Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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