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VB921ZVSP13TR

STMicroelectronics

VB921ZVSP13TR by STMicroelectronics

VB921ZVSP13TR by STMicroelectronics is a compact peripheral driver with a 12V nominal voltage and a peak output current limit of 6.5A. It features built-in transient protection and comes in a small outline package for efficient surface mounting. Ideal for applications requiring reliable signal buffering or inversion, it ensures robust performance in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,715

-

-

-

-

Anansix

USA . 2,462 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,462

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-

-

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Vyrian

USA . 1,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,447

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 855 parts In-Stock

1+ parts

$6.540

100+ parts

-

1k+ parts

$5.886

10k+ parts

-

855

$6.540

-

$5.886

-

MKK Technologies

India . 1,666 parts In-Stock

1+ parts

$12.299

100+ parts

-

1k+ parts

-

10k+ parts

-

1,666

$12.299

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-

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DigiPath Technology Company

USA . 1,666 parts In-Stock

1+ parts

$12.299

100+ parts

-

1k+ parts

-

10k+ parts

-

1,666

$12.299

-

-

-

Parana Technologies

USA . 982 parts In-Stock

1+ parts

-

100+ parts

$7.820

1k+ parts

-

10k+ parts

-

982

-

$7.820

-

-

Corphita

USA . 177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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177

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Overview

Unleash the power of innovation with the VB921ZVSP13TR from STMicroelectronics, a leading name in high-quality semiconductor solutions. This exceptional peripheral driver is designed to enhance performance and reliability across various applications, ensuring optimal functionality for your electronic projects. With built-in transient protections and a compact design, it guarantees durability while maximizing efficiency. Choose STMicroelectronics and experience seamless integration and unmatched value that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration onto printed circuit boards, optimizing space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout design on PCBs, allowing for easier routing of traces and better thermal performance.

Built-in Protections: TRANSIENT

The transient protection helps safeguard the device against voltage spikes, enhancing the longevity and reliability of the peripheral driver.

No. of Terminals: 10

Having 10 terminals provides flexibility for multiple connections, allowing for versatile configurations and improved functionality in various applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style with a heat sink/slug design helps in effective heat dissipation, making it suitable for high-performance applications.

Terminal Position: DUAL

The dual terminal position offers ease of access and improved connectivity options, ensuring reliable connections within the circuit.

Maximum Seated Height: 3.75 mm

A compact seated height allows for installation in space-constrained applications while maintaining a low profile design.

Width: 7.5 mm

A width of 7.5 mm is ideal for fitting into tight spaces on PCBs, giving designers greater flexibility in their layout.

Length: 9.4 mm

The length of 9.4 mm contributes to a compact footprint, enabling high-density designs without compromising on performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability for surface mounting, enhancing manufacturing quality and consistency.

Nominal Supply Voltage: 12 V

A nominal supply voltage of 12 V allows for compatibility with common power supplies, making it easier to incorporate into existing systems.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is suitable for modern PCB designs, enabling more compact arrangements and denser circuitry.

Nominal Output Peak Current Limit: 6.5 A

The capability of handling a nominal output peak current limit of 6.5 A ensures powerful performance for driving high-demand peripherals.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being designed as a buffer or inverter based peripheral driver enhances versatility, allowing it to manage multiple signal types effectively.

Output Current Flow Direction: SINK

With the output current flow direction set to sink, it is well-suited for interfacing with common ground configuration systems, ensuring compatibility.

Technical Specifications

Peripheral Drivers VB921ZVSP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

R-PDSO-G10

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

6.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

VB921ZVSP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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