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VB326SP13TR

STMicroelectronics

VB326SP13TR by STMicroelectronics

VB326SP13TR by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 24V and supports up to 9A output current. It features built-in transient and thermal protections, ensuring reliable operation. Ideal for applications requiring efficient signal buffering or inversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,479 parts In-Stock

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5,479

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Digiode

USA . 3,084 parts In-Stock

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3,084

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Anansix

USA . 1,228 parts In-Stock

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1,228

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LIBRA Elektronik GmbH

Germany . 214 parts In-Stock

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214

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,585 parts In-Stock

1+ parts

$5.283

100+ parts

-

1k+ parts

$4.754

10k+ parts

-

1,585

$5.283

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$4.754

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Microchip USA

USA . 349 parts In-Stock

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$7.219

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349

$7.219

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MKK Technologies

India . 510 parts In-Stock

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$9.934

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510

$9.934

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DigiPath Technology Company

USA . 510 parts In-Stock

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$9.934

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510

$9.934

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AZTECH Wire

Italy . 933 parts In-Stock

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$13.760

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933

$13.760

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Corphita

USA . 4,589 parts In-Stock

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4,589

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Vigor

Singapore . 1,380 parts In-Stock

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1,380

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Parana Technologies

USA . 1,211 parts In-Stock

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$6.316

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1,211

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$6.316

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Overview

Unlock the power of efficiency with STMicroelectronics' VB326SP13TR peripheral driver, designed for superior performance and reliability. With built-in protections against thermal and transient issues, this robust component ensures optimal operation in demanding applications. Its compact, surface-mount design allows easy integration into various systems, delivering stability and durability without compromise. Elevate your projects with a trusted name in innovation—experience the advantage that quality brings!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resilience, making this peripheral driver suitable for a variety of environments.

Surface Mount: YES

Being a surface mount device allows for easier assembly and reduced circuit board space, enhancing design flexibility.

Maximum Supply Voltage: 5.5 V

Supports a wide range of applications with voltages below 5.5 V, ensuring compatibility with many digital circuits.

Package Shape: RECTANGULAR

Rectangular shape promotes efficient layout on the PCB, facilitating better space management.

Built-in Protections: TRANSIENT; THERMAL

Integrated transient and thermal protection enhances reliability by protecting the device from voltage spikes and overheating.

Maximum Supply Voltage-1: 24 V

The higher supply voltage limit of 24 V expands its usability in various high-voltage applications.

No. of Terminals: 10

Ten terminals provide multiple connection options, enhancing the versatility of circuit configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The heat sink/slug design aids in thermal dissipation, making the device reliable even in high current scenarios.

Minimum Supply Voltage-1: 5.3 V

The minimum voltage of 5.3 V ensures optimal performance in lower voltage applications, maintaining efficiency.

Minimum Supply Voltage: 4.5 V

A minimum voltage of 4.5 V allows for use in low-power applications while maintaining functionality.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish improves solderability and reduces oxidation, ensuring long-term reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for effective current distribution, improving overall circuit performance.

Maximum Seated Height: 3.65 mm

A low maximum seated height supports compact designs, perfect for space-constrained applications.

Width: 7.5 mm

A width of 7.5 mm allows for flexible board design while accommodating various layout styles.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures the device can withstand typical soldering processes while minimizing damage.

Peak Reflow Temperature °C: 250

Withstanding peak reflow temperatures of up to 250 °C presents compatibility with standard soldering methods.

Length: 9.4 mm

The compact length allows for efficiency in PCB layout, supporting high-density applications.

Terminal Form: GULL WING

Gull wing terminals offer excellent mechanical stability and ease of soldering, ensuring a secure connection.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is ideal for a wide range of electronic applications, enhancing compatibility.

Turn-on Time: 5 us

Rapid turn-on time improves system performance and response times, making it suitable for high-speed applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a good balance between dense packing and ease of handling during assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates reasonable handling precautions for moisture sensitivity, thus extending the shelf life of the device.

Nominal Output Peak Current Limit: 9 A

The ability to handle peak output currents of up to 9 A supports demanding applications such as motor drives and high-load circuits.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed as a buffer or inverter-based driver, this IC can effectively manage signal levels and drive capability.

Turn-off Time: 25 us

Quick turn-off time helps to minimize power losses and improves switching performance in dynamic systems.

Output Current Flow Direction: SINK

Output current sinking capability enables it to interface effectively with a variety of load types, enhancing versatility.

Technical Specifications

Peripheral Drivers VB326SP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

3.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

24 V

Minimum Supply Voltage-1:

5.3 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

25 us

Turn-on Time:

5 us

Width:

7.5 mm

Trade Compliance

VB326SP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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