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VB325SP

STMicroelectronics

VB325SP by STMicroelectronics

VB325SP by STMicroelectronics is a peripheral driver with a max supply voltage of 5.5V and built-in transient and thermal protections. It has 10 terminals, operates at a nominal voltage of 5V, and features a turn-on time of 5us. This small outline package is ideal for buffer or inverter-based applications requiring sink output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 3,330 parts In-Stock

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Vyrian

USA . 2,760 parts In-Stock

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2,760

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Digiode

USA . 1,422 parts In-Stock

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Anansix

USA . 491 parts In-Stock

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491

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Nova Conductors

Japan . 100 parts In-Stock

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100

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LWI Electronics Inc

India . 49 parts In-Stock

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49

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Distributors (Availability)

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Microchip USA

USA . 303 parts In-Stock

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$6.819

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IDEA Electronic Components Group

UK . 1,699 parts In-Stock

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$7.994

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$7.194

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$7.994

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Ampacity Inc.

Singapore . 604 parts In-Stock

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$12.500

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MKK Technologies

India . 2,285 parts In-Stock

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$15.032

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DigiPath Technology Company

USA . 2,285 parts In-Stock

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$15.032

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$15.032

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AZTECH Wire

Italy . 871 parts In-Stock

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$18.972

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Vigor

Singapore . 7,531 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,329 parts In-Stock

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Argo Parts USA

USA . 3,649 parts In-Stock

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Corphita

USA . 2,824 parts In-Stock

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Kepictronics

USA . 2,400 parts In-Stock

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Continental Prestige Electronics

USA . 2,294 parts In-Stock

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Parana Technologies

USA . 1,704 parts In-Stock

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$9.558

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Discover the VB325SP by STMicroelectronics, a high-quality peripheral driver that offers exceptional value and benefits. Manufactured by the reputable STMicroelectronics, this product is designed with built-in protections for transient and thermal events, ensuring reliable performance. With a maximum supply voltage of 5.5V and a compact rectangular package shape, the VB325SP is perfect for various applications in electronics. Experience fast turn-on times and efficient output current flow direction with this versatile and innovative peripheral driver. Elevate your electronic projects with the VB325SP from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the peripheral driver, ensuring a longer lifespan.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V allows for flexibility and compatibility with a wide range of electronic devices.

Built-in Protections: TRANSIENT; THERMAL

The built-in transient and thermal protections enhance the reliability and safety of the peripheral driver, protecting it from potential damage.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures good conductivity and corrosion resistance, contributing to the overall performance and longevity of the peripheral driver.

Turn-on Time: 5 us

The fast turn-on time of 5 microseconds ensures quick and efficient operation of the peripheral driver, making it suitable for high-speed applications.

Technical Specifications

Peripheral Drivers VB325SP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

3.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

24 V

Minimum Supply Voltage-1:

5.3 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

25 us

Turn-on Time:

5 us

Width:

7.5 mm

Trade Compliance

VB325SP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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