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TSV622ILT

STMicroelectronics

TSV622ILT by STMicroelectronics

TSV622ILT by STMicroelectronics is a dual operational amplifier designed for automotive applications. It features a max input offset voltage of 6000 µV, low bias current of 0.0001 µA, and operates within a supply range of 1.8-5 V. Its compact size and high performance make it ideal for precision signal processing in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,672 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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9,672

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Digiode

USA . 2,626 parts In-Stock

1+ parts

-

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1k+ parts

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2,626

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Anansix

USA . 1,788 parts In-Stock

1+ parts

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1,788

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 776 parts In-Stock

1+ parts

$5.189

100+ parts

-

1k+ parts

$4.670

10k+ parts

-

776

$5.189

-

$4.670

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MKK Technologies

India . 2,375 parts In-Stock

1+ parts

$9.757

100+ parts

-

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2,375

$9.757

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DigiPath Technology Company

USA . 2,375 parts In-Stock

1+ parts

$9.757

100+ parts

-

1k+ parts

-

10k+ parts

-

2,375

$9.757

-

-

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AZTECH Wire

Italy . 992 parts In-Stock

1+ parts

$18.480

100+ parts

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992

$18.480

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Perfect Parts

USA . 4,988 parts In-Stock

1+ parts

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4,988

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Corphita

USA . 4,304 parts In-Stock

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4,304

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Kepictronics

USA . 3,200 parts In-Stock

1+ parts

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3,200

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Parana Technologies

USA . 213 parts In-Stock

1+ parts

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100+ parts

$6.204

1k+ parts

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213

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$6.204

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Overview

Unlock unparalleled performance with the TSV622ILT operational amplifier from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a reliable solution perfect for automotive and industrial applications. Experience exceptional precision with low bias current and high common-mode rejection, ensuring your designs operate seamlessly under various conditions. Elevate your projects with efficiency and innovation, making the TSV622ILT an invaluable asset for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures reliability and protection in various environments.

Maximum Input Offset Voltage: 6000 uV

High maximum input offset voltage indicates suitability for less precision-critical applications.

Maximum Average Bias Current (IIB): 0.0001 uA

Ultra-low average bias current enhances the device's performance in low-power applications.

Surface Mount: YES

Surface mount configuration allows for compact designs and easy assembly in high-density circuits.

No. of Functions: 2

Dual functionality offers flexibility in circuit design, allowing for multiple applications.

Package Shape: RECTANGULAR

Rectangular shape optimizes board space and facilitates efficient layout and routing.

Nominal Common Mode Reject Ratio: 80 dB

High common mode reject ratio improves signal integrity by reducing the impact of noise.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage of 5V enhances compatibility with various systems.

Power Supplies (V): 1.8/5

Wide power supply range allows for flexibility in diverse applications and designs.

No. of Terminals: 8

Eight terminals provide sufficient connections for versatile configurations.

Package Style (Meter): SMALL OUTLINE

Small outline style is space-efficient, optimal for compact design requirements.

Minimum Slew Rate: 0.1 V/us

Adequate slew rate supports a range of signal frequencies, suitable for various applications.

Maximum Supply Voltage Limit: 6 V

Allows flexibility in operation across different voltage levels, with a safe maximum limit.

Maximum Operating Temperature: 125 °C

High operating temperature rating ensures reliability in harsh environments, especially automotive.

Maximum Bias Current (IIB) @ 25 °C: 0.00001 uA

Extremely low bias current enhances accuracy and battery life in micropower applications.

Frequency Compensation: YES

Frequency compensation feature makes the op-amp stable across a variety of frequencies, ideal for varying applications.

Minimum Voltage Gain: 4470

High voltage gain improves amplification efficiency, making it suitable for weak signal processing.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures functionality under extreme conditions, vital for automotive use.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and minimizes corrosion risks, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal position simplifies layout design and improves circuit connection versatility.

Maximum Seated Height: 1.45 mm

Low height profile is beneficial for space-constrained applications without sacrificing performance.

Width: 1.625 mm

Compact width allows for easy integration into high-density PCB designs.

Micropower: YES

Micropower operation makes it ideal for battery-operated devices and energy-efficient systems.

Maximum Time At Peak Reflow Temperature (s): 30

Adherence to high reflow temperatures ensures reliable solder joints and durability.

Peak Reflow Temperature (°C): 260

High reflow temperature capability supports modern assembly techniques for enhanced reliability.

Length: 2.9 mm

Compact length is advantageous for tight layout spaces and facilitates efficient circuit designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures the device meets strict industry standards for reliability and safety.

Low-Bias: YES

Low bias specification improves accuracy in sensitive applications, making this op-amp suitable for instrumentation.

Nominal Unity Gain Bandwidth: 420 kHz

Adequate bandwidth supports a range of signal frequencies, suitable for a variety of applications.

Technology: CMOS

CMOS technology offers low power consumption and high density, ideal for advanced applications.

Terminal Form: GULL WING

Gull wing terminal design enhances mechanical strength and stability during PCB assembly.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design provides high versatility in amplification tasks, ideal for signal processing.

Maximum Supply Current: 0.076 mA

Low supply current ensures power efficiency, extending battery life in portable applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is widely used in analog applications, suitable for a range of designs.

Packing Method: TAPE AND REEL

Tape and reel packaging allows for efficient automated assembly and easy handling.

Nominal Slow Rate: 0.19 V/us

This slow rate allows for stability while processing slower changing inputs, suitable for low frequency applications.

Terminal Pitch: 0.65 mm

Standard terminal pitch facilitates compatibility with PCBs and simplifies assembly processes.

Technical Specifications

Operational Amplifiers (Op Amps) TSV622ILT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

420 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

4470

Minimum Slew Rate:

0.1 V/us

Nominal Slew Rate:

0.19 V/us

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

76 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.064 in (1.625 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

TSSOP8,.1

Trade Compliance

TSV622ILT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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