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TSG8511IP

STMicroelectronics

TSG8511IP by STMicroelectronics

TSG8511IP by STMicroelectronics is an active filter with a max supply current of 5 mA and technology based on CMOS. It operates at temperatures ranging from -25 °C to 85°C, making it suitable for lowpass filtering applications. With 16 terminals and a package style of IN-LINE, it offers precise elliptic transfer characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,899

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-

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Anansix

USA . 2,774 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,774

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Digiode

USA . 1,532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,532

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,158 parts In-Stock

1+ parts

$7.342

100+ parts

-

1k+ parts

$6.607

10k+ parts

-

2,158

$7.342

-

$6.607

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MKK Technologies

India . 1,691 parts In-Stock

1+ parts

$13.805

100+ parts

-

1k+ parts

-

10k+ parts

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1,691

$13.805

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DigiPath Technology Company

USA . 1,691 parts In-Stock

1+ parts

$13.805

100+ parts

-

1k+ parts

-

10k+ parts

-

1,691

$13.805

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-

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Corphita

USA . 956 parts In-Stock

1+ parts

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956

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Parana Technologies

USA . 842 parts In-Stock

1+ parts

-

100+ parts

$8.778

1k+ parts

-

10k+ parts

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842

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$8.778

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-

Overview

Get ready to experience superior quality and precision with the TSG8511IP by STMicroelectronics. As a leader in active filters, STMicroelectronics delivers cutting-edge technology in a convenient rectangular package. With high nominal supply voltages and low operating temperatures, this switched capacitor filter offers unbeatable value and performance. Whether you're in audio processing, telecommunications, or instrumentation, this product provides unmatched benefits for your applications. Upgrade to the TSG8511IP today and elevate your projects to the next level of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ensuring long-lasting performance.

Maximum Supply Current (Isup): 5 mA

The low maximum supply current requirement of 5 mA makes this product energy-efficient and suitable for applications where power consumption needs to be minimized.

Technology: CMOS

The CMOS technology used in this product offers high noise immunity, low power consumption, and compatibility with a wide range of signal levels.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and mounting in various electronic systems, optimizing space utilization.

Nominal Negative Supply Voltage (Vsup): -5 V

The nominal negative supply voltage of -5 V ensures compatibility with systems that require a dual power supply configuration.

Active Filter Type: SWITCHED CAPACITOR FILTER

The switched capacitor filter design provides accurate and efficient filtering of signals, making this product ideal for applications that require precise signal processing.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5 V ensures stable and reliable operation of the active filter within the specified voltage range.

Power Supplies (V): +-5

The dual power supply compatibility with +-5 V power supplies allows for versatile and flexible integration in various electronic systems.

No. of Terminals: 16

The 16 terminals provide ample connection points for interfacing with other electronic components, offering versatility in system design.

Package Style (Meter): IN-LINE

The in-line package style enables easy installation and replacement of the active filter in electronic systems, simplifying maintenance and upgrades.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand higher temperature environments, ensuring reliable performance in diverse conditions.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for precise and secure connections, enhancing the reliability and stability of the active filter in electronic circuits.

Minimum Operating Temperature: -25 °C

The minimum operating temperature of -25 °C ensures that the active filter can function effectively even in cold environments, expanding its range of applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance of the active filter.

Terminal Position: DUAL

The dual terminal position allows for versatile installation and connection options, accommodating different circuit configurations and system requirements.

Response Type: LOWPASS

The lowpass response type of the active filter enables it to effectively attenuate higher frequency signals, making it suitable for applications that require noise filtering and signal conditioning.

Transfer Characteristics: ELLIPTIC

The elliptic transfer characteristics of this active filter provide precise control over frequency response and filter performance, making it ideal for applications that demand high selectivity and stopband attenuation.

Technical Specifications

Active Filters TSG8511IP attributes and parameters. Explore more Active Filters devices from STMicroelectronics

Electrical Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Current (Isup):

5 mA

Nominal Negative Supply Voltage:

-5 V

Power Supply:

±5 V

Performance Parameters

Semiconductor Technology:

CMOS

Response Type:

Filter Technology:

Transfer Characteristics:

Elliptical

Filter Order:

7th

Environmental Characteristics

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

-25 °C (-13 °F)

Temperature Grade:

Connectivity

Total Functions:

1

Total Terminals:

16

Terminal Finish:

Tin Lead

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Physical Characteristics

Package Style:

In-Line

Form Factor:

Rectangular

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Body Material:

Plastic/Epoxy

Surface Mounting:

No

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Additional Features

Qualified:

No

Trade Compliance

TSG8511IP Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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