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TSG8511CP

STMicroelectronics

TSG8511CP by STMicroelectronics

STMicroelectronics TSG8511CP is a CMOS active filter with 16 terminals. It operates on +-5V power supplies, consuming 5mA max supply current at -5V nominal negative supply voltage. The switched capacitor filter has an elliptic response type and is ideal for lowpass filtering applications in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,340 parts In-Stock

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4,340

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Digiode

USA . 2,480 parts In-Stock

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2,480

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Anansix

USA . 606 parts In-Stock

1+ parts

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606

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ICP Electronique

France . 47 parts In-Stock

1+ parts

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47

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ECAB

Sweden . 46 parts In-Stock

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46

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 975 parts In-Stock

1+ parts

$17.082

100+ parts

-

1k+ parts

$15.373

10k+ parts

-

975

$17.082

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$15.373

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MKK Technologies

India . 1,687 parts In-Stock

1+ parts

$32.121

100+ parts

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1,687

$32.121

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DigiPath Technology Company

USA . 1,687 parts In-Stock

1+ parts

$32.121

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1,687

$32.121

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Corphita

USA . 2,060 parts In-Stock

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2,060

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Parana Technologies

USA . 459 parts In-Stock

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$20.424

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459

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$20.424

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Overview

Looking for a reliable solution for your active filter needs? Look no further than the TSG8511CP by STMicroelectronics. With a reputation for top-quality products, STMicroelectronics delivers once again with this switched capacitor filter. Ideal for a variety of applications, this filter offers customers unparalleled value and benefits. Say goodbye to subpar performance and hello to superior results with the TSG8511CP. Trust in STMicroelectronics to provide you with the best in active filters.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Maximum Supply Current (Isup): 5 mA

Low maximum supply current of 5 mA indicates efficient power usage and lower energy consumption.

Technology: CMOS

CMOS technology offers high speed performance, low power consumption, and compatibility with a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration and space-saving design in various electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and secure connections, ensuring stable operation over time.

Active Filter Type: SWITCHED CAPACITOR FILTER

Switched capacitor filter design offers adjustable frequency response and precise filtering capabilities for signal processing.

Nominal Supply Voltage / Vsup (V): 5

Nominal supply voltage of 5V is commonly used in electronic systems, making it compatible with a wide range of devices.

Response Type: LOWPASS

Lowpass response type allows for the passage of low-frequency signals while filtering out high-frequency noise, ideal for audio and communication applications.

Transfer Characteristics: ELLIPTIC

Elliptic transfer characteristics provide a steep roll-off and high degree of selectivity in filtering unwanted frequencies, ensuring signal purity.

Technical Specifications

Active Filters TSG8511CP attributes and parameters. Explore more Active Filters devices from STMicroelectronics

Electrical Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Current (Isup):

5 mA

Nominal Negative Supply Voltage:

-5 V

Power Supply:

±5 V

Performance Parameters

Semiconductor Technology:

CMOS

Response Type:

Filter Technology:

Transfer Characteristics:

Elliptical

Filter Order:

7th

Environmental Characteristics

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temperature Grade:

Connectivity

Total Functions:

1

Total Terminals:

16

Terminal Finish:

Tin Lead

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Physical Characteristics

Package Style:

In-Line

Form Factor:

Rectangular

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Body Material:

Plastic/Epoxy

Surface Mounting:

No

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Additional Features

Qualified:

No

Trade Compliance

TSG8511CP Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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