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TS4040DIZT-2.5

STMicroelectronics

TS4040DIZT-2.5 by STMicroelectronics

TS4040DIZT-2.5 by STMicroelectronics is a cylindrical, two-terminal voltage reference with a nominal output of 2.5 V and operates b/w -40 °C to 85 °C. It features a max voltage temp coef of 150 ppm/°C and comes in a plastic/epoxy package. Ideal for industrial applications requiring stable voltage references.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,974 parts In-Stock

1+ parts

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3,974

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Anansix

USA . 2,633 parts In-Stock

1+ parts

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2,633

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Digiode

USA . 972 parts In-Stock

1+ parts

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972

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 566 parts In-Stock

1+ parts

$2.862

100+ parts

-

1k+ parts

$2.576

10k+ parts

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566

$2.862

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$2.576

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MKK Technologies

India . 1,281 parts In-Stock

1+ parts

$5.382

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1,281

$5.382

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DigiPath Technology Company

USA . 1,281 parts In-Stock

1+ parts

$5.382

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1,281

$5.382

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Parana Technologies

USA . 2,354 parts In-Stock

1+ parts

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$3.422

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2,354

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$3.422

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Corphita

USA . 1,229 parts In-Stock

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1,229

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Overview

Elevate your projects with the TS4040DIZT-2.5 from STMicroelectronics—a trusted leader in innovation. This premium voltage reference delivers precision and stability, ensuring your applications perform flawlessly under diverse conditions. With its robust design, it excels in industrial settings, providing unmatched quality and reliability. Experience enhanced efficiency and accuracy in your electronic designs, making this component an invaluable asset for engineers seeking excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability, making the product suitable for various applications.

Package Shape: ROUND

A round package shape facilitates easy integration into circuit designs and can be advantageous for space-constrained layouts.

No. of Terminals: 3

Having three terminals allows for versatile connections, enhancing the product's compatibility with different circuit setups.

Package Style (Meter): CYLINDRICAL

The cylindrical package style provides a compact design, making it ideal for applications where space is limited.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures the voltage reference can function effectively in a variety of high-temperature environments.

Minimum Output Voltage: 2.451 V

A minimum output voltage as low as 2.451 V allows for greater flexibility in low-voltage applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for use in harsh and cold environments.

Terminal Finish: TIN

The tin terminal finish enhances solderability, ensuring reliable connections during installation.

Maximum Output Voltage: 2.549 V

With a maximum output voltage of 2.549 V, this product provides stable reference voltages necessary for precision applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient board layout and improved thermal management.

Other IC type: TWO TERMINAL VOLTAGE REFERENCE

As a two-terminal voltage reference, it simplifies circuit designs and reduces component count.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures consistent performance in a wide range of operating conditions.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are suitable for high-stress environments.

Max Voltage Temp Coef: 150 ppm/°C

A maximum voltage temperature coefficient of 150 ppm/°C ensures excellent stability across temperature variations.

Nominal Output Voltage: 2.5 V

The nominal output voltage of 2.5 V is ideal for powering various electronic circuits and ensuring reliable performance.

Technical Specifications

Voltage References TS4040DIZT-2.5 attributes and parameters. Explore more Voltage References devices from STMicroelectronics

Specs

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

2.549 V

Minimum Output Voltage:

2.451 V

Nominal Output Voltage:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Surface Mount:

NO

Max Voltage Temp Coef:

150 ppm/Cel

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trim or Adjustable Output (V):

NO

Trade Compliance

TS4040DIZT-2.5 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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