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TS4041CIAP-1.2

STMicroelectronics

TS4041CIAP-1.2 by STMicroelectronics

TS4041CIAP-1.2 by STMicroelectronics is a cylindrical, two-terminal voltage reference with a nominal output of 1.225 V and operates b/w -40 °C to 85 °C. It features a max voltage temp coefficient of 120 ppm/°C and comes in a plastic/epoxy package. Ideal for industrial applications requiring stable voltage references.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,520 parts In-Stock

1+ parts

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2,520

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Anansix

USA . 2,453 parts In-Stock

1+ parts

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2,453

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Digiode

USA . 1,710 parts In-Stock

1+ parts

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1,710

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,559 parts In-Stock

1+ parts

$1.398

100+ parts

-

1k+ parts

$1.259

10k+ parts

-

1,559

$1.398

-

$1.259

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MKK Technologies

India . 634 parts In-Stock

1+ parts

$2.630

100+ parts

-

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634

$2.630

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DigiPath Technology Company

USA . 634 parts In-Stock

1+ parts

$2.630

100+ parts

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634

$2.630

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Corphita

USA . 1,522 parts In-Stock

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1,522

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Parana Technologies

USA . 962 parts In-Stock

1+ parts

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100+ parts

$1.672

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962

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$1.672

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Overview

Unlock unmatched precision and reliability with the TS4041CIAP-1.2 from STMicroelectronics, a leader in semiconductor innovation. This two-terminal voltage reference combines exceptional stability with a wide operating temperature range, ensuring performance you can trust in industrial applications. Enhance your designs with dependable voltage regulation that meets rigorous standards, delivering significant value and peace of mind for all your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it reliable for various applications.

Package Shape: ROUND

The round shape allows for easy integration into existing designs and optimizes space in PCB layouts.

No. of Terminals: 3

Having three terminals provides flexibility in circuit design, allowing for a more versatile application in different configurations.

Package Style (Meter): CYLINDRICAL

The cylindrical style contributes to efficient thermal management and reduces space constraints on the circuit board.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, it is suitable for a wide range of industrial applications, ensuring stable performance in high-temperature environments.

Minimum Output Voltage: 1.209 V

Providing a minimum output voltage of 1.209 V ensures compatibility with low-power circuits, making it ideal for precision applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C guarantees reliable performance in extreme conditions, making it suitable for outdoor and harsh environments.

Terminal Finish: TIN

A tin finish enhances solderability and improves the product's longevity, ensuring stable connections and reduced risk of corrosion.

Maximum Output Voltage: 1.241 V

The maximum output voltage of 1.241 V offers versatility in voltage regulation applications, catering to a range of consumer and industrial devices.

Terminal Position: BOTTOM

Bottom terminal positioning allows for compact placement on the PCB, facilitating efficient use of space and enhanced layout design.

Other IC type: TWO TERMINAL VOLTAGE REFERENCE

As a two-terminal voltage reference, it simplifies system design, providing a stable output voltage with minimal external components required.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this product is robust enough for demanding applications, ensuring reliability over extended periods.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide excellent mechanical stability and support better current handling capabilities in high-reliability applications.

Max Voltage Temp Coef: 120 ppm/°C

A maximum voltage temperature coefficient of 120 ppm/°C indicates high stability, making it a great choice for precision voltage reference applications.

Nominal Output Voltage: 1.225 V

The nominal output voltage of 1.225 V is ideal for a variety of analog electronics, ensuring accurate signal processing and improved circuit performance.

Technical Specifications

Voltage References TS4041CIAP-1.2 attributes and parameters. Explore more Voltage References devices from STMicroelectronics

Specs

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

1.241 V

Minimum Output Voltage:

1.209 V

Nominal Output Voltage:

1.225 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Surface Mount:

NO

Max Voltage Temp Coef:

120 ppm/Cel

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trim or Adjustable Output (V):

NO

Trade Compliance

TS4041CIAP-1.2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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