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TS1872IST

STMicroelectronics

TS1872IST by STMicroelectronics

TS1872IST by STMicroelectronics is a micropower operational amplifier with a max input offset voltage of 6000 µV and a nominal voltage of 1.8 V. It features a high common mode reject ratio of 77 dB, making it ideal for automotive applications. This compact, surface-mount device operates efficiently in temperatures from -40 °C to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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QIE Inc.

USA . 7,743 parts In-Stock

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Vyrian

USA . 6,296 parts In-Stock

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Anansix

USA . 1,028 parts In-Stock

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Bristol Electronics

USA . 432 parts In-Stock

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432

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Flex Direct, LLC

USA . 432 parts In-Stock

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432

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Digiode

USA . 52 parts In-Stock

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Vigor

Singapore . 1,525 parts In-Stock

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$1.120

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$1.120

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IDEA Electronic Components Group

UK . 1,645 parts In-Stock

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$2.842

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$2.558

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$2.842

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$2.558

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Microchip USA

USA . 157 parts In-Stock

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$3.411

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157

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MKK Technologies

India . 1,698 parts In-Stock

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$5.344

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$5.344

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DigiPath Technology Company

USA . 1,698 parts In-Stock

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$5.344

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$5.344

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$8.412

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$8.328

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$7.992

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500

$8.412

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$7.992

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AZTECH Wire

Italy . 137 parts In-Stock

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$21.440

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Component Stockers USA

USA . 220 parts In-Stock

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$99.990

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Perfect Parts

USA . 8,417 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,991 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Parana Technologies

USA . 479 parts In-Stock

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$3.398

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Corphita

USA . 305 parts In-Stock

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Kepictronics

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Overview

Unlock precision and reliability with the TS1872IST operational amplifier from STMicroelectronics. Renowned for their innovative engineering, STMicroelectronics delivers unmatched quality that enhances your designs across automotive and consumer electronics applications. With ultra-low bias current and a compact footprint, this op-amp ensures efficient performance while optimizing power consumption. Elevate your projects with cutting-edge technology designed to meet demanding standards!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package ensures durability and reliability in various applications.

Maximum Input Offset Voltage: 6000 uV

This low input offset voltage contributes to higher accuracy in signal processing, making it suitable for precision applications.

Maximum Average Bias Current (IIB): 0.15 uA

The low average bias current minimizes power consumption, which is essential for battery-powered applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern PCBs.

Number of Functions: 2

Having two functions in a single package increases flexibility and reduces the need for multiple components.

Package Shape: SQUARE

The square package shape facilitates efficient layout in tight spaces on circuit boards.

Nominal Common Mode Reject Ratio: 77 dB

A high common mode rejection ratio enhances performance by effectively eliminating noise from common signals.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage is advantageous for low-power applications, extending battery life.

Power Supplies (V): 2/5

Compatibility with a range of power supplies allows for versatile usage in different systems.

Number of Terminals: 8

With 8 terminals, it provides multiple connection possibilities while maintaining compact design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile is ideal for space-constrained designs, minimizing overall product size.

Minimum Slew Rate: 0.38 V/us

This slew rate allows for sufficient responsiveness in analog signal processing applications.

Maximum Supply Voltage Limit: 7 V

The ability to handle up to 7 V enables use in a wide variety of circuits and applications.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliability and functionality even in extreme conditions.

Maximum Bias Current (IIB) @25 °C: 0.13 uA

Lower bias current at specific temperatures improves accuracy and reduces noise.

Frequency Compensation: YES

Built-in frequency compensation enhances stability and performance across various applications.

Minimum Voltage Gain: 3160

A high minimum voltage gain supports amplification needs in a variety of signal processing tasks.

Minimum Operating Temperature: -40 °C

The device is suitable for automotive applications and harsh environments due to its extensive temperature range.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes enhance conductivity and connection reliability over time.

Terminal Position: DUAL

Dual terminal position allows for flexible configurations in circuit designs.

Maximum Seated Height: 1.1 mm

Low seated height contributes to a compact footprint in circuit assemblies.

Width: 3 mm

A small width allows for dense packing on PCBs without compromising functionality.

Micropower: YES

Micropower consumption is ideal for portable and battery-operated devices.

Length: 3 mm

A short length complements the small-profile design of the op-amp, facilitating use in compact applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive specifications ensures suitability for demanding environments.

Nominal Unity Gain Bandwidth: 1600 kHz

A high unity gain bandwidth supports high-speed applications in data acquisition and processing.

Technology: BICMOS

BICMOS technology offers the benefits of both bipolar and CMOS processes, combining speed and low power consumption.

Terminal Form: GULL WING

The gull-wing terminal form provides secure connections and is well-suited for automated assembly techniques.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, it is versatile and applicable in various analog signal processing scenarios.

Maximum Supply Current: 1.75 mA

Low supply current allows for energy-efficient designs, ideal for portable applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is widely used in applications requiring a stable gain and wide bandwidth.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates easy handling and efficient assembly processes for manufacturers.

Nominal Slow Rate: 0.54 V/us

A good slow rate ensures stability in linear operations and helps maintain signal integrity.

Terminal Pitch: 0.65 mm

A pitch of 0.65 mm supports high-density packaging while maintaining manufacturability.

Technical Specifications

Operational Amplifiers (Op Amps) TS1872IST attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BICMOS

Power Supply:

2/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.6 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

77 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

3160

Minimum Slew Rate:

0.38 V/us

Nominal Slew Rate:

0.54 V/us

Peak Bias Current:

150 nA

Maximum Bias Current (IIB) @25 °C:

130 nA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

1.75 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

TS1872IST Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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