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TS1851IAIDT

STMicroelectronics

TS1851IAIDT by STMicroelectronics

TS1851IAIDT by STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 3000 µV, a common mode reject ratio of 90 dB, and operates within -40 °C to 125°C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,836 parts In-Stock

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Anansix

USA . 1,489 parts In-Stock

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Digiode

USA . 1,406 parts In-Stock

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1,406

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

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$3.358

100+ parts

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$3.022

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$3.358

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$3.022

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MKK Technologies

India . 546 parts In-Stock

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$6.314

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$6.314

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DigiPath Technology Company

USA . 546 parts In-Stock

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$6.314

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546

$6.314

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Kepictronics

USA . 30,000 parts In-Stock

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Corphita

USA . 4,433 parts In-Stock

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Parana Technologies

USA . 469 parts In-Stock

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$4.015

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Overview

Elevate your designs with the TS1851IAIDT operational amplifier from STMicroelectronics, renowned for its exceptional quality and reliability. This micropower Op Amp is perfect for automotive applications, ensuring precision and stability even in extreme conditions. With low bias current and a high common-mode rejection ratio, it delivers unmatched performance while optimizing energy efficiency. Trust STMicroelectronics to power your innovative solutions with cutting-edge technology that enhances your product's value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and excellent protection against environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 3000 uV

A maximum input offset voltage of 3000 µV ensures precise voltage processing, essential in applications requiring high accuracy.

Maximum Average Bias Current (IIB): 0.055 uA

The low average bias current helps maintain low power consumption and enhances battery-operated device longevity.

Surface Mount: YES

Being surface mount compatible allows for easier and more flexible PCB designs, facilitating space-saving and efficient assembly.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB while allowing for effective thermal management.

Nominal Common Mode Reject Ratio: 90 dB

A common mode reject ratio of 90 dB enhances the op amp's ability to reject noise and interference, ensuring cleaner signal processing.

Nominal Supply Voltage / Vsup: 3 V

The nominal supply voltage of 3 V allows compatibility with low-voltage systems, making it suitable for portable applications.

Power Supplies (V): 1.8/5

Supports a wide range of power supply values from 1.8 to 5 V, offering versatility across different applications.

No. of Terminals: 8

Having 8 terminals provides sufficient functionality for various input/output configurations while maintaining a compact design.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces PCB real estate requirements, enabling compact device designs.

Minimum Slew Rate: 0.1 V/us

A minimum slew rate of 0.1 V/µs allows for decent response times in signal processing applications, ensuring accuracy in dynamic conditions.

Maximum Supply Voltage Limit: 7 V

The capability to operate at a maximum supply voltage limit of 7 V provides flexibility in power source selection.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, it is suitable for high-temperature environments, particularly in automotive applications.

Maximum Bias Current (IIB) @25°C: 0.063 uA

The maximum bias current at 25 °C further emphasizes the device's low power consumption characteristics.

Frequency Compensation: YES

Built-in frequency compensation enhances stability in closed-loop configurations, making it easier to design robust circuits.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes the device ideal for extreme conditions, particularly in automotive and industrial applications.

Terminal Position: DUAL

The dual terminal position allows for more versatile integration into various designs, enhancing layout options.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm provides a slim profile that is advantageous for low-profile applications.

Width: 3.9 mm

The compact width enables efficient use of space on PCBs, which is especially important in space-constrained applications.

Micropower: YES

Micropower functionality allows operation with minimal energy usage, making it suitable for low-power, battery-operated devices.

Length: 4.9 mm

A length of 4.9 mm contributes to the overall compact design, which is desirable in modern electronic devices.

Temperature Grade: AUTOMOTIVE

Rated for automotive temperature grades, ensuring reliability in vehicles and harsh conditions.

Nominal Unity Gain Bandwidth: 600 kHz

A nominal unity gain bandwidth of 600 kHz indicates sufficient frequency response for a range of applications, including audio and control systems.

Technology: BIPOLAR

Using bipolar technology enables better performance in terms of speed and frequency response compared to many CMOS alternatives.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and are compatible with automated assembly processes.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it can perform numerous analog signal processing functions, making it versatile for many applications.

Maximum Supply Current: 0.22 mA

A maximum supply current of only 0.22 mA ensures low power usage, beneficial for battery-powered or energy-efficient designs.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture allows for flexible circuit design, making it suitable for various feedback configurations.

Packing Method: TAPE AND REEL

The tape and reel packing method facilitates manufacturing and automated assembly processes, improving efficiency.

Nominal Slow Rate: 0.2 V/us

A nominal slow rate of 0.2 V/µs provides good performance in handling gradual signal changes, enhancing overall circuit functionality.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for many PCB designs, ensuring compatibility with existing layouts and ease of integration.

Technical Specifications

Operational Amplifiers (Op Amps) TS1851IAIDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

1.8/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

600 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Input Offset Voltage Limit:

3000 uV

Minimum Slew Rate:

0.1 V/us

Nominal Slew Rate:

0.2 V/us

Peak Bias Current:

55 nA

Maximum Bias Current (IIB) @25 °C:

63 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

220 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS1851IAIDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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