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TS1852IPT

STMicroelectronics

TS1852IPT by STMicroelectronics

TS1852IPT by STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 3000 µV, a nominal voltage of 3 V, and operates within -40 °C to 125°C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Lakeland Logistics Inc

USA . 4,000 parts In-Stock

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Bristol Electronics

USA . 4,000 parts In-Stock

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4,000

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Digiode

USA . 3,098 parts In-Stock

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J2 Sourcing AB

Sweden . 3,000 parts In-Stock

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3,000

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Component Sense

UK . 2,729 parts In-Stock

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2,729

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Anansix

USA . 2,303 parts In-Stock

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Vyrian

USA . 1,325 parts In-Stock

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1,325

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,036 parts In-Stock

1+ parts

$3.664

100+ parts

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$3.298

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1,036

$3.664

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$3.298

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Microchip USA

USA . 170 parts In-Stock

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$4.218

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170

$4.218

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MKK Technologies

India . 1,898 parts In-Stock

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$6.891

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$6.891

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DigiPath Technology Company

USA . 1,898 parts In-Stock

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$6.891

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$6.891

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QUARKTWIN TECHNOLOGY LTD

USA . 5,918 parts In-Stock

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Perfect Parts

USA . 4,423 parts In-Stock

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Corphita

USA . 2,495 parts In-Stock

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Vigor

Singapore . 1,924 parts In-Stock

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Parana Technologies

USA . 1,788 parts In-Stock

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$4.381

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$4.381

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Overview

Elevate your designs with the TS1852IPT from STMicroelectronics, a leading name in innovative semiconductor solutions. This micropower operational amplifier excels in automotive and industrial applications, offering remarkable performance, low bias current, and exceptional temperature resilience. Its compact package ensures easy integration into space-constrained projects, delivering unparalleled efficiency and reliability. Experience superior value and long-lasting benefits with STMicroelectronics’ trusted quality at the heart of your next breakthrough.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package, making it suitable for various applications including automotive.

Maximum Input Offset Voltage: 3000 uV

A low input offset voltage allows for greater precision in signal amplification, enhancing the overall accuracy of the circuit.

Maximum Average Bias Current (IIB): 0.055 uA

Minimal bias current contributes to lower power consumption, which is critical for battery-powered and low-power applications.

Surface Mount: YES

Surface mount technology (SMT) enables more compact designs and is compatible with automated assembly processes.

No. of Functions: 2

Having two functions allows for versatile applications, making it a cost-effective choice for designers needing multiple functionalities.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout, saving space and enabling better design flexibility.

Nominal Common Mode Reject Ratio: 90 dB

A high common mode rejection ratio improves the ability to filter out noise, ensuring more reliable signal processing.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V supports low-voltage operation, essential for modern energy-efficient electronic devices.

Power Supplies (V): 1.8/5

The ability to operate over a range of power supply voltages adds versatility, accommodating varying system requirements.

No. of Terminals: 8

With 8 terminals, this op amp can easily integrate into complex circuits while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this op amp suitable for space-constrained applications without sacrificing performance.

Minimum Slew Rate: 0.1 V/us

A minimum slew rate allows for adequate response times in dynamic applications, making it suitable for various signal types.

Maximum Supply Voltage Limit: 7 V

The 7V supply voltage limit provides flexibility in design, accommodating a wide range of scenarios without risk of damage.

Maximum Operating Temperature: 125 °C

An extended temperature range of up to 125 °C allows this operational amplifier to be utilized in high-temperature environments, such as automotive applications.

Maximum Bias Current (IIB) @25 °C: 0.063 uA

Low bias currents ensure minimal impact on circuit performance, enhancing overall stability and precision.

Frequency Compensation: YES

Built-in frequency compensation improves stability and reduces the risk of oscillation in feedback applications.

Minimum Voltage Gain: 3160

A high minimum voltage gain indicates strong amplification capabilities, suitable for weak signal processing.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures is essential for outdoor and harsh environment applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Quality terminal finish ensures reliable connectivity and enhances the durability of the solder joint.

Terminal Position: DUAL

Dual terminal positioning allows for efficient routing and layout on PCBs, improving design compactness.

Maximum Seated Height: 1.2 mm

Low seated height is advantageous in applications where low profile components are required.

Width: 3 mm

A narrow width helps maintain compact board layouts, allowing for more features in smaller devices.

Micropower: YES

Micropower characteristics make it ideal for energy-sensitive applications such as portable and battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 10

This specification ensures compatibility with standard reflow soldering processes, enhancing manufacturing efficiency.

Peak Reflow Temperature (°C): 260

High reflow temperature is suitable for lead-free soldering, meeting modern industry standards.

Length: 4.4 mm

The modest length aids in maintaining a dense component arrangement on PCBs.

Temperature Grade: AUTOMOTIVE

Automotive-grade components ensure reliability and performance in demanding automotive environments.

Nominal Unity Gain Bandwidth: 600 kHz

High unity gain bandwidth supports the amplification of a wide range of frequencies, making it versatile for different applications.

Technology: BIPOLAR

Bipolar technology provides advantages in terms of speed and dynamic response, suitable for a variety of applications.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and provide stable connections, enhancing the reliability of connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are fundamental building blocks in analog circuitry, crucial for various signal processing tasks.

Maximum Supply Current: 0.44 mA

A maximum supply current of 0.44 mA aligns with low-power design strategies, beneficial in battery-operated applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is common in precision applications, allowing for accurate signal processing and stability.

Packing Method: TAPE AND REEL

Tape and reel packaging allows for automated assembly and handling, improving production efficiency.

Nominal Slow Rate: 0.2 V/us

This specification contributes to predictable and controlled signal responses in applications requiring linearity.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch is a standard size that facilitates compatibility with a variety of PCB layouts and designs.

Technical Specifications

Operational Amplifiers (Op Amps) TS1852IPT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

600 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Input Offset Voltage Limit:

3000 uV

Minimum Voltage Gain:

3160

Minimum Slew Rate:

0.1 V/us

Nominal Slew Rate:

0.2 V/us

Peak Bias Current:

55 nA

Maximum Bias Current (IIB) @25 °C:

63 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

10 s

Maximum Supply Current:

440 μA

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TS1852IPT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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