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TS1852ID

STMicroelectronics

TS1852ID by STMicroelectronics

TS1852ID from STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 3000 µV, a nominal voltage of 3 V, and operates within -40 °C to 125°C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 6,981 parts In-Stock

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Chip Stock

USA . 5,420 parts In-Stock

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Anansix

USA . 2,486 parts In-Stock

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Digiode

USA . 1,538 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 75 parts In-Stock

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A2Z Electronics, Inc.

USA . 41 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 15 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 171 parts In-Stock

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$3.785

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171

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IDEA Electronic Components Group

UK . 686 parts In-Stock

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$6.539

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$5.885

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686

$6.539

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$5.885

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MKK Technologies

India . 2,255 parts In-Stock

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$12.297

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$12.297

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DigiPath Technology Company

USA . 2,255 parts In-Stock

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$12.297

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$12.297

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AZTECH Wire

Italy . 677 parts In-Stock

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$19.100

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677

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Metaverse IC Inc.

Canada . 99,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,745 parts In-Stock

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Vigor

Singapore . 3,170 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Perfect Parts

USA . 2,255 parts In-Stock

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Parana Technologies

USA . 1,595 parts In-Stock

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$7.819

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Corphita

USA . 1,342 parts In-Stock

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Kepictronics

USA . 150 parts In-Stock

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GreenTree Electronics

Israel . 70 parts In-Stock

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70

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Overview

Unlock unparalleled performance with the TS1852ID from STMicroelectronics, a leader in innovative technologies. This exceptional operational amplifier is designed for reliability and precision in demanding applications, from automotive to consumer electronics. Its low power consumption and superior noise rejection ensure optimal efficiency and performance, offering peace of mind for engineers. Experience the quality and commitment that STMicroelectronics brings to every product, elevating your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and protection against environmental factors, making the product reliable for various applications.

Maximum Input Offset Voltage: 3000 uV

A low input offset voltage is crucial for accurate signal processing, particularly in precision applications, ensuring minimal error in output.

Maximum Average Bias Current (IIB): 0.055 uA

The low average bias current contributes to improved power efficiency and extends battery life in micropower applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern PCB layouts, reducing overall space requirements.

No. of Functions: 2

Having multiple functions within a single package enhances design flexibility and reduces component count, simplifying the circuit design.

Package Shape: RECTANGULAR

A rectangular shape is standard for many applications, supporting easy handling, placement, and orientation on PCBs.

Nominal Common Mode Reject Ratio: 90 dB

A high common mode reject ratio improves the op-amp's ability to ignore noise, providing cleaner and more accurate signal amplification.

Nominal Supply Voltage / Vsup (V): 3

Operating at a low nominal supply voltage is advantageous for low-power applications, such as battery-powered devices.

Power Supplies: 1.8/5 V

The flexibility in power supply options allows for versatility in various application environments, accommodating diverse design needs.

No. of Terminals: 8

Eight terminals offer a balance between compact design and sufficient connectivity options for various configurations and usages.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, enabling compact circuit designs without sacrificing performance.

Minimum Slew Rate: 0.1 V/us

A minimum slew rate of 0.1 V/us allows the op-amp to respond adequately to rapidly changing signals, making it suitable for a wide range of dynamic applications.

Maximum Supply Voltage Limit: 7 V

The capability to handle a relatively high maximum supply voltage enhances the device's versatility, allowing it to be used in more demanding environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this op-amp is suitable for automotive and industrial applications, ensuring reliability in extreme conditions.

Maximum Bias Current (IIB) @25°C: 0.063 uA

The very low bias current at a standard temperature ensures high accuracy and low power consumption in precision applications.

Frequency Compensation: YES

Frequency compensation enables stable operation across various frequencies, enhancing performance in a wide range of applications.

Minimum Voltage Gain: 3160

A high minimum voltage gain indicates strong amplification capabilities, making this op-amp suitable for applications requiring significant signal enhancement.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product is well-suited for harsh environments and applications requiring extended temperature ranges.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent corrosion resistance and reliable long-term connectivity in various applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB placements and ensures better integration into designs with varying layouts.

Maximum Seated Height: 1.75 mm

A low maximum seated height helps reduce the overall thickness of PCBs, enabling more compact designs that fit into tighter spaces.

Width: 3.9 mm

The compact width suits space-constrained applications, allowing for high-density designs without compromising on performance.

Micropower: YES

Micropower capability makes this op-amp ideal for battery-operated and energy-efficient applications, extending device life between charges.

Length: 4.9 mm

A short length facilitates easy placement in compact layouts, beneficial in today's miniaturized electronic designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive standards, this product ensures reliability and safety in automotive applications where performance is critical.

Nominal Unity Gain Bandwidth: 600 kHz

A sizeable unity gain bandwidth supports high-speed applications, making it suitable for demanding signal processing tasks.

Technology: BIPOLAR

Bipolar technology generally yields high performance in terms of speed and low noise, ideal for high-fidelity applications.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering and component mounting, promoting better mechanical stability.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are highly versatile, suitable for a wide range of analog applications such as amplification, filtering, and signal conditioning.

Maximum Supply Current: 0.44 mA

Low maximum supply current contributes to energy efficiency, making this device an excellent choice for battery-powered circuits.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides a good balance of speed and accuracy, facilitating its use in many application scenarios.

Nominal Slow Rate: 0.2 V/us

A nominal slow rate again highlights the ability to handle a range of signal scenarios effectively, ensuring versatile applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch strikes a balance between compact design and easy handling during assembly, suitable for modern production techniques.

Technical Specifications

Operational Amplifiers (Op Amps) TS1852ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

1.8/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

600 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

90 dB

Input Offset Voltage Limit:

3000 uV

Minimum Voltage Gain:

3160

Minimum Slew Rate:

0.1 V/us

Nominal Slew Rate:

0.2 V/us

Peak Bias Current:

55 nA

Maximum Bias Current (IIB) @25 °C:

63 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

440 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS1852ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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