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TDE3247FP

STMicroelectronics

TDE3247FP by STMicroelectronics

TDE3247FP by STMicroelectronics is a versatile interface IC designed for commercial applications, operating b/w -20 °C and 85 °C. It features a power supply range of 8-30V, supports up to 0.15A output current, and comes in a compact 14-terminal SO package. Ideal for surface mount technology, it enhances connectivity in electronic devices.

Median Price

$6.035

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 924 parts In-Stock

1+ parts

$4.400

100+ parts

$2.920

1k+ parts

$2.480

10k+ parts

-

924

$4.400

$2.920

$2.480

-

Mouser Electronics

USA . 713 parts In-Stock

1+ parts

$5.080

100+ parts

$3.230

1k+ parts

$2.960

10k+ parts

$2.950

713

$5.080

$3.230

$2.960

$2.950

Newark

USA . 883 parts In-Stock

1+ parts

$6.990

100+ parts

$4.210

1k+ parts

$3.580

10k+ parts

-

883

$6.990

$4.210

$3.580

-

Element14

Singapore . 924 parts In-Stock

1+ parts

$538.150

100+ parts

$396.220

1k+ parts

$337.290

10k+ parts

-

924

$538.150

$396.220

$337.290

-

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 1,220 parts In-Stock

1+ parts

$4.642

100+ parts

$2.182

1k+ parts

$1.996

10k+ parts

-

1,220

$4.642

$2.182

$1.996

-

Digiode

USA . 520 parts In-Stock

1+ parts

$4.864

100+ parts

-

1k+ parts

-

10k+ parts

-

520

$4.864

-

-

-

Vyrian

USA . 2,494 parts In-Stock

1+ parts

$5.120

100+ parts

-

1k+ parts

-

10k+ parts

-

2,494

$5.120

-

-

-

Dan-Mar Components

USA . 1,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

-

-

-

-

Anansix

USA . 197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

197

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

190

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,021 parts In-Stock

1+ parts

$4.311

100+ parts

-

1k+ parts

$3.880

10k+ parts

-

1,021

$4.311

-

$3.880

-

Corphita

USA . 1,891 parts In-Stock

1+ parts

$4.608

100+ parts

-

1k+ parts

-

10k+ parts

-

1,891

$4.608

-

-

-

Continental Prestige Electronics

USA . 948 parts In-Stock

1+ parts

$5.110

100+ parts

$3.570

1k+ parts

$2.330

10k+ parts

-

948

$5.110

$3.570

$2.330

-

MKK Technologies

India . 402 parts In-Stock

1+ parts

$8.107

100+ parts

-

1k+ parts

-

10k+ parts

-

402

$8.107

-

-

-

DigiPath Technology Company

USA . 402 parts In-Stock

1+ parts

$8.107

100+ parts

-

1k+ parts

-

10k+ parts

-

402

$8.107

-

-

-

Microchip USA

USA . 2,013 parts In-Stock

1+ parts

$23.657

100+ parts

-

1k+ parts

-

10k+ parts

-

2,013

$23.657

-

-

-

A-Z Elektronik GmbH

Germany . 4,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,959

-

-

-

-

Kepictronics

USA . 4,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,861

-

-

-

-

Parana Technologies

USA . 770 parts In-Stock

1+ parts

-

100+ parts

$5.155

1k+ parts

-

10k+ parts

-

770

-

$5.155

-

-

Assy Fe

Spain . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

Overview

Elevate your projects with the TDE3247FP from STMicroelectronics, a trusted leader in innovative solutions. This versatile interface IC delivers reliable performance across diverse applications, from consumer electronics to industrial automation. With its compact design and wide operating temperature range, it ensures seamless integration and outstanding efficiency. Experience enhanced functionality and peace of mind, knowing you're powered by a manufacturer renowned for quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures robust protection against environmental factors, making the IC reliable in various applications.

Surface Mount: YES

Surface mount technology enables compact designs and ease of integration into modern PCBs, allowing for space-efficient solutions.

Package Shape: RECTANGULAR

Rectangular packaging optimizes space on the PCB and facilitates better organization of components, improving layout flexibility.

Power Supplies: 8/30 V

The wide voltage range of 8 to 30 V ensures compatibility with various power supply systems, enhancing versatility in different applications.

Number of Terminals: 14

Fourteen terminals provide ample connectivity options for interfacing with other circuits, promoting flexibility in design.

Package Style: SMALL OUTLINE

The small outline package style is ideal for space-constrained environments, catering to the growing demand for miniaturized electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows for reliable operation in standard commercial environments without overheating issues.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20 °C, this IC is suitable for applications in colder climates or environments.

Terminal Position: DUAL

Dual terminal positioning enables flexible routing and connection options, simplifying circuit design and assembly.

Maximum Seated Height: 1.75 mm

A low maximum seated height contributes to the overall compactness of the design, allowing for streamlined assemblies with tighter spacing.

Width: 3.9 mm

A narrow width of 3.9 mm allows for high-density designs, accommodating other components without compromising functionality.

Length: 8.65 mm

The precise length of 8.65 mm helps maintain compatibility in standard circuit layouts, supporting ease of integration.

Temperature Grade: COMMERCIAL EXTENDED

This IC is graded for commercial extended temperature ranges, making it suitable for various applications that demand reliability.

Maximum Output Current: 0.15 A

The ability to handle a maximum output current of 0.15 A supports a variety of interfacing needs without risking damage to the IC.

Technology: BIPOLAR

Bipolar technology typically offers higher performance and faster switching speeds, making this IC suitable for high-speed applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering reliability and ease of handling during assembly, reducing the likelihood of connection issues.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for precise placement while minimizing the risk of short circuits, maintaining circuit integrity.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, it is designed specifically for communication between different circuit elements, enhancing overall system performance.

Technical Specifications

Other Function Interface ICs TDE3247FP attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Driver No. of Bits:

1

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/30

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TDE3247FP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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